JPS5967362A - 噴射メツキ装置 - Google Patents

噴射メツキ装置

Info

Publication number
JPS5967362A
JPS5967362A JP17754682A JP17754682A JPS5967362A JP S5967362 A JPS5967362 A JP S5967362A JP 17754682 A JP17754682 A JP 17754682A JP 17754682 A JP17754682 A JP 17754682A JP S5967362 A JPS5967362 A JP S5967362A
Authority
JP
Japan
Prior art keywords
plating
mask
nozzle
lead frame
island
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17754682A
Other languages
English (en)
Japanese (ja)
Other versions
JPH037143B2 (enExample
Inventor
Yasuhiko Sakaki
榊　泰彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EEJA Ltd
Original Assignee
Electroplating Engineers of Japan Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electroplating Engineers of Japan Ltd filed Critical Electroplating Engineers of Japan Ltd
Priority to JP17754682A priority Critical patent/JPS5967362A/ja
Publication of JPS5967362A publication Critical patent/JPS5967362A/ja
Publication of JPH037143B2 publication Critical patent/JPH037143B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP17754682A 1982-10-12 1982-10-12 噴射メツキ装置 Granted JPS5967362A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17754682A JPS5967362A (ja) 1982-10-12 1982-10-12 噴射メツキ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17754682A JPS5967362A (ja) 1982-10-12 1982-10-12 噴射メツキ装置

Publications (2)

Publication Number Publication Date
JPS5967362A true JPS5967362A (ja) 1984-04-17
JPH037143B2 JPH037143B2 (enExample) 1991-01-31

Family

ID=16032834

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17754682A Granted JPS5967362A (ja) 1982-10-12 1982-10-12 噴射メツキ装置

Country Status (1)

Country Link
JP (1) JPS5967362A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6286849A (ja) * 1985-10-14 1987-04-21 Toshiba Corp リ−ドフレ−ム及びその製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5091533A (enExample) * 1973-12-15 1975-07-22
JPS57210987A (en) * 1981-06-18 1982-12-24 Sumitomo Electric Ind Ltd Partial plating device
JPS5951069U (ja) * 1982-09-25 1984-04-04 凸版印刷株式会社 部分めつき用陽極

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5091533A (enExample) * 1973-12-15 1975-07-22
JPS57210987A (en) * 1981-06-18 1982-12-24 Sumitomo Electric Ind Ltd Partial plating device
JPS5951069U (ja) * 1982-09-25 1984-04-04 凸版印刷株式会社 部分めつき用陽極

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6286849A (ja) * 1985-10-14 1987-04-21 Toshiba Corp リ−ドフレ−ム及びその製造方法

Also Published As

Publication number Publication date
JPH037143B2 (enExample) 1991-01-31

Similar Documents

Publication Publication Date Title
KR100297120B1 (ko) 범프의형성방법및도금장치
US20110111562A1 (en) Partially Patterned Lead Frames and Methods of Making and Using the Same in Semiconductor Packaging
KR100350046B1 (ko) 리드프레임 및 이를 이용한 방열판이 부착된 반도체패키지
JPH10199905A (ja) チップ支持板の粗面化方法
JPS5967362A (ja) 噴射メツキ装置
US4083755A (en) Method and apparatus for selectively plating rectangular sheet continuously or intermittently
JPS6344300B2 (enExample)
JPS5996289A (ja) 部分メツキ方法及びその装置
JPS6321575Y2 (enExample)
JPH07211723A (ja) 半導体装置の製造方法
JPS628516B2 (enExample)
JPH05326788A (ja) リードフレーム素材及びこれを用いた半導体装置
JPS58186957A (ja) リ−ドフレ−ム
JPS62154658A (ja) 半導体装置用リ−ドフレ−ムの製造方法
JPH06334084A (ja) リードフレームとその製造方法
JP2001274307A (ja) 半導体装置の製造方法
US20080156895A1 (en) Flux overspray reduction apparatus, systems, and methods
JPH0139655B2 (enExample)
JPH1187587A (ja) リードフレームの製造方法
JPS61110790A (ja) Ｉｃリ−ドフレ−ムの噴射メツキ方法
JPS5951069U (ja) 部分めつき用陽極
JPH03227241A (ja) スクリーン印刷方法及び印刷用アタッチメント
KR200294020Y1 (ko) 리드프레임 도금용 마스크
JPS5828829A (ja) 半導体ウエハ−のメツキ装置
JPS6114233B2 (enExample)