JPS5967362A - 噴射メツキ装置 - Google Patents
噴射メツキ装置Info
- Publication number
- JPS5967362A JPS5967362A JP17754682A JP17754682A JPS5967362A JP S5967362 A JPS5967362 A JP S5967362A JP 17754682 A JP17754682 A JP 17754682A JP 17754682 A JP17754682 A JP 17754682A JP S5967362 A JPS5967362 A JP S5967362A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- mask
- nozzle
- lead frame
- island
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title claims abstract description 84
- 239000007921 spray Substances 0.000 claims description 17
- 239000007788 liquid Substances 0.000 claims description 16
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 10
- 229910052737 gold Inorganic materials 0.000 abstract description 10
- 239000010931 gold Substances 0.000 abstract description 10
- 229910052709 silver Inorganic materials 0.000 abstract description 7
- 239000004332 silver Substances 0.000 abstract description 7
- 238000002347 injection Methods 0.000 abstract description 6
- 239000007924 injection Substances 0.000 abstract description 6
- 239000000243 solution Substances 0.000 description 16
- 239000010970 precious metal Substances 0.000 description 11
- 230000000694 effects Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- OFLYIWITHZJFLS-UHFFFAOYSA-N [Si].[Au] Chemical compound [Si].[Au] OFLYIWITHZJFLS-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Chemically Coating (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17754682A JPS5967362A (ja) | 1982-10-12 | 1982-10-12 | 噴射メツキ装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17754682A JPS5967362A (ja) | 1982-10-12 | 1982-10-12 | 噴射メツキ装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5967362A true JPS5967362A (ja) | 1984-04-17 |
JPH037143B2 JPH037143B2 (enrdf_load_html_response) | 1991-01-31 |
Family
ID=16032834
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17754682A Granted JPS5967362A (ja) | 1982-10-12 | 1982-10-12 | 噴射メツキ装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5967362A (enrdf_load_html_response) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6286849A (ja) * | 1985-10-14 | 1987-04-21 | Toshiba Corp | リ−ドフレ−ム及びその製造方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5091533A (enrdf_load_html_response) * | 1973-12-15 | 1975-07-22 | ||
JPS57210987A (en) * | 1981-06-18 | 1982-12-24 | Sumitomo Electric Ind Ltd | Partial plating device |
JPS5951069U (ja) * | 1982-09-25 | 1984-04-04 | 凸版印刷株式会社 | 部分めつき用陽極 |
-
1982
- 1982-10-12 JP JP17754682A patent/JPS5967362A/ja active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5091533A (enrdf_load_html_response) * | 1973-12-15 | 1975-07-22 | ||
JPS57210987A (en) * | 1981-06-18 | 1982-12-24 | Sumitomo Electric Ind Ltd | Partial plating device |
JPS5951069U (ja) * | 1982-09-25 | 1984-04-04 | 凸版印刷株式会社 | 部分めつき用陽極 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6286849A (ja) * | 1985-10-14 | 1987-04-21 | Toshiba Corp | リ−ドフレ−ム及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPH037143B2 (enrdf_load_html_response) | 1991-01-31 |