JPS5965408A - Method of producing thick film resistance - Google Patents
Method of producing thick film resistanceInfo
- Publication number
- JPS5965408A JPS5965408A JP57175662A JP17566282A JPS5965408A JP S5965408 A JPS5965408 A JP S5965408A JP 57175662 A JP57175662 A JP 57175662A JP 17566282 A JP17566282 A JP 17566282A JP S5965408 A JPS5965408 A JP S5965408A
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- thick film
- resistors
- manufacturing
- resistance value
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 産業上の利用分野 本発明は厚膜抵抗の製造方法に関する。[Detailed description of the invention] Industrial applications The present invention relates to a method for manufacturing a thick film resistor.
従来例の構成とその問題点
従来、基板上、、Ｖｒ複数の抵抗体を配設した厚膜抵抗
咳お一＾て、は、第１図に示す様に、抵抗ペーストを正
方、形あるいは長方形に印刷して各抵抗体（Ｒ１）１ゞ
（Ｒ６）を形成し、その両端から延出さｎ、た導出電極
（ハ）によって基板伊）周囲の端子電極（Ｔ１）〜（Ｔ
ｔａ）に接続している。また、各抵抗体（Ｒｓ）〜（Ｒ
ｓ）Ｋレーザートリミング装置によって抵抗値トリミン
グ。Conventional configurations and their problems Conventionally, thick film resistors with multiple resistors arranged on a substrate have been constructed using resistor paste in the form of squares, shapes, or rectangles, as shown in Figure 1. The terminal electrodes (T1) to (T) around the substrate are formed by printing on the resistors (R1) and (R6), and the lead-out electrodes (c) extend from both ends of the resistors (R1) to (R6).
ta). In addition, each resistor (Rs) ~ (R
s) Resistance value trimming by K laser trimming device.
溝（句を形成して抵抗値の調整を行っている。この゛様
な構造の厚膜抵抗の製造は内の様な工程で行われている
。The resistance value is adjusted by forming grooves. Thick film resistors with this type of structure are manufactured using the same process.
（１） 端子電極（Ｔ８）〜（Ｔｌ１１）を印刷、焼
成する。(1) Print and bake terminal electrodes (T8) to (Tl11).
、（２） 導出電極■のパターンを印刷、焼成する。, (2) Print and bake the pattern of the lead-out electrode (■).
（３） 抵抗体（Ｒｉ）〜（Ｒｓ）ｆ印刷、焼成する
。(3) Print and bake the resistors (Ri) to (Rs)f.
（４）各抵抗体（Ｒ１）〜（Ｒｓ）をレーザートリミン
グする。(4) Laser trimming each resistor (R1) to (Rs).
ところで、かかる製造方法では、第１に導出電極（Ｌ）
用に導電を極材料？必要とし１、導出電極（Ｌ）パター
ンの印刷、焼成工程が必要なため、高価となり、第２に
各抵抗体（Ｒ１）〜（Ｒｓ）の抵抗値に応じた印刷スク
リーンが必要であり、その変更の厳に印刷スクリーンを
取替えねばならず、生産性が悪く第３に印刷精度、マス
クずｎ＄ｖｃより高密度化が困知りであり、第４に印刷
工法の条件から抵抗体ＣＲ１）〜（Ｒ５）の形状に制限
を受け、第５に導出電極（→パターンの必要面積がかな
り大きくなるため、抵抗体（Ｒ１）〜（Ｒ５）の面積を
大きくできず、大電力化に問題があり、第７に抵抗体（
Ｒ１）〜（Ｒ６）の小形化を図ろうとすると形状効果に
よりばらつき巾が非常に大きくなり、歩留が悪くなる等
、種々の問題がある。By the way, in this manufacturing method, firstly, the lead-out electrode (L)
What about conductive materials? First, printing and firing processes for the lead-out electrode (L) pattern are required, making it expensive.Secondly, a printing screen is required depending on the resistance value of each resistor (R1) to (Rs). Due to changes, the printing screen has to be replaced, which leads to poor productivity.Thirdly, printing accuracy is difficult to achieve with higher density than the mask.Fourthly, due to the conditions of the printing method, the resistor CR1) ~ (R5), and the fifth problem is that the area required for the lead-out electrode (→ pattern becomes quite large), making it impossible to increase the area of the resistors (R1) to (R5), which poses a problem in increasing power. , seventhly, the resistor (
If an attempt is made to reduce the size of R1) to (R6), there are various problems such as a very large variation width due to the shape effect and a poor yield.
発明の目的
明
木登、は、従来のかかる問題点を解消して、抵抗体の高
密度化、大電力化及び低価格化を図ることのできるＪφ
膜抵抗の製造方法を提供することを目的とする〇
発明の構成
本発明はこのため、基板表面の全面もしくは大部分に抵
抗ペーストを印刷し、レーザートリミング装ｆｉ＃、Ｖ
ｒよって抵抗体の外形をカッティングすることによって
複数の抵抗体を形成する厚膜抵抗の製造方法を提供する
。Purpose of the Invention Noboru Akeki has developed a Jφ that can solve the conventional problems and achieve higher density, higher power, and lower cost of resistors.
〇Structure of the Invention Aiming to Provide a Method for Manufacturing a Film Resistor For this purpose, the present invention prints a resistor paste on the entire surface or most of the substrate surface, and uses a laser trimming device fi#, V
Therefore, a method for manufacturing a thick film resistor is provided in which a plurality of resistors are formed by cutting the outer shape of the resistor.
実施例の説明
以下、本発明の一実施例ｆ第２図により説明すると、Ｍ
板（Ｐ）表面の周縁部を残してはソ全面に抵抗ペースト
を印刷してあり、基板碑）周縁には端子電極（Ｔ１）〜
（Ｔｌｇ）が形成されている。抵抗ペーストの全面印刷
（Ａ）はレーザートリミング装ＲＫよるカッティング溝
（Ｃ）によって抵抗体（Ｒ１）〜（Ｒ７ｔＫ分割さｎ１
各抵抗体〔Ｒ１）〜（Ｒ７）の両端は直接端子電極（Ｔ
１）〜（Ｔｌｇ）［接続されている。図示の抵抗体（Ｒ
１）〜（Ｒ６）は第１図における抵抗体（′Ｒ１）〜（
Ｒ５）と同じ端子結線となる様に構成してあり、さらに
抵抗体（Ｒｇ’＆端子電極（Ｔ５）（Ｔ、）間に１抵抗
体（Ｒ７）を端子電極（Ｔ１３）（ＴＩ４）間に追加構
成している。″また、抵抗体（Ｒ１）〜（Ｒ４）（Ｒ６
ＸＲ７）Ｋは抵抗値トリミング溝（Ｓ）を形成してあり
、抵抗体（Ｒ６）はカッティング溝（Ｃ）自体によって
必要な抵抗値の調整が行なわｎ、でいる。DESCRIPTION OF EMBODIMENTS Hereinafter, one embodiment of the present invention will be explained with reference to FIG.
Resistance paste is printed on the entire surface of the board (P) except for the periphery, and terminal electrodes (T1) are printed on the periphery of the board (P).
(Tlg) is formed. The entire surface printing of the resistor paste (A) is divided into resistors (R1) to (R7tK) by cutting grooves (C) by the laser trimming device RK.
Both ends of each resistor [R1] to (R7) are directly connected to terminal electrodes (T
1) ~ (Tlg) [Connected. The illustrated resistor (R
1) to (R6) are the resistors ('R1) to (
It is configured to have the same terminal connection as R5), and one resistor (R7) is connected between the resistor (Rg'& terminal electrodes (T5) (T, ) and between the terminal electrodes (T13) and (TI4). Additionally, resistors (R1) to (R4) (R6
XR7)K has a resistance value trimming groove (S) formed therein, and the resistance value of the resistor (R6) can be adjusted as required by the cutting groove (C) itself.
この様な厚膜抵抗は次の様々工程で製造さｎる。Such thick film resistors are manufactured through the following various steps.
（１）、端子電極（Ｔ１）〜（Ｔｔｓ）を印刷、焼成す
る。(1) Print and bake terminal electrodes (T1) to (Tts).
（２）、抵抗ペーストの全面印刷（勾を行い、焼成する
。このとき、印刷する抵抗ペーストはシート抵抗値が昼
なる次数１【ａ類のものを印刷領域を区分して印刷する
こともでき、その場合２種類から３種類にとどめるのが
好まし−。(2) Full-surface printing of the resistor paste (gradation is performed and fired. At this time, the resistor paste to be printed has a sheet resistance value of day 1 [class A], which can be printed by dividing the printing area. In that case, it is preferable to limit the number of types to two to three.
〔３）、抵抗体（Ｒ１）〜（Ｒ７）をレーザートリミン
グ装装置による外形カッティングにより形成する。又、
同時に抵抗値トリミングを行う。[3) The resistors (R1) to (R7) are formed by external cutting using a laser trimming device. or,
Perform resistance value trimming at the same time.
この様な製造方法では、第１に抵抗体を接続する導電電
他材が端子電極部分のみで良くなると共に導出電極の印
刷スクリーンも不敬となり、かつ製造工数も削減できる
ので安価となり、ｍ ２ Ｋ抵抗体の印刷スクリーンが
一種類で良く、さらに共用化でき、第３にレーザートリ
ミング装置によるカッティング溝（Ｃ）の巾間隔で抵抗
体（勇）〜（Ｒｙ）ｆ形嘘でき、上記抵抗体ＣＲｅ）（
Ｒｔ）を追加構成した様に高密度化に非常に有利であり
、第４に抵抗体（Ｒ１）〜（Ｒ７）の形はレーザートリ
ミング装置のプログラムト■作の与で自由に選定でき、
高笛度化に非常に有利であると共に生産性も飛閑白つに
向上し、第５に基板の面積利用率が大巾に向上し、抵抗
体の大′ｍ力化が可能であると共に、抵抗体の発熱によ
る熱バランスも良くなり、熱的安定性も向上する。In this manufacturing method, firstly, the conductive material that connects the resistor is only the terminal electrode part, and the printing screen of the lead-out electrode is also unnecessary, and the manufacturing man-hours can be reduced, resulting in low cost, and m 2 K Only one type of printing screen is needed for the resistor, and furthermore, it can be used in common. Third, the resistor (Yu) to (Ry) type f can be formed at the width interval of the cutting groove (C) by the laser trimming device, and the resistor CRe )(
Rt) is very advantageous for high density, and fourthly, the shapes of the resistors (R1) to (R7) can be freely selected by programming the laser trimming device.
It is very advantageous for increasing the pitch, and productivity is also greatly improved.Fifth, the area utilization rate of the board is greatly improved, and it is possible to increase the force of the resistor. , the heat balance due to the heat generated by the resistor is improved, and thermal stability is also improved.
発明の効果
本発明の厚膜抵抗の製造方法によれば、以上の説□明か
ち明らかな様に、抵抗体の高密度化、大ｄオ。Effects of the Invention According to the method for manufacturing a thick film resistor of the present invention, as is clear from the above explanation, the density of the resistor can be increased and the resistance can be increased.
力比及び低価格化を図ることができ、生産性も飛曜的に
向上することができる。The power ratio and cost can be reduced, and productivity can be dramatically improved.
第１図は従来方法で製造さ肛た厚膜抵抗の平面図、第２
図は本発明方法で製造さＪまた厚膜抵抗の一実施例を示
す平面図である。′
（Ｐ）は基板、（Ｒ１）〜（Ｒ７）は抵抗体、（Ｔ＋
）〜（Ｔ１６）は端子電極、’＜Ｃ）はカッティング溝
、（Ｓ）は抵抗値トリミング溝。
特許出願人代理人
弁理士 山 本 孝
第１図
Ｔｒ Ｔ６Ｔｙ ル
ア／乙 ７／ｒ７／φ ｐ
第２図
Ｔｔ ｌ Ｔｙ ”Figure 1 is a plan view of a thick film resistor manufactured by the conventional method, Figure 2
The figure is a plan view showing an example of a thick film resistor manufactured by the method of the present invention. ' (P) is the substrate, (R1) to (R7) are resistors, (T+
) to (T16) are terminal electrodes, '<C) are cutting grooves, and (S) are resistance value trimming grooves. Patent applicant's representative Patent attorney Takashi Yamamoto Figure 1 Tr T6Ty Lua/Otsu 7/r7/φ p Figure 2 Tt l Ty ”
Claims (3)
トを印刷し、レーザートリミング装置によって抵抗体の
外形をカッティングするととＫよって複数の抵抗体を形
成する厚膜抵抗の製造方法。(1) A method for manufacturing a thick film resistor, in which a resistor paste is printed on the entire surface or most of the substrate surface, and the outer shape of the resistor is cut using a laser trimming device, thereby forming a plurality of resistors.
抗値トリミングを行う特許請求の範囲第１項に記載の厚
膜抵抗の製造方法。(2) The method for manufacturing a thick film resistor according to claim 1, wherein the resistance value is trimmed at the same time as the outer shape of the resistor is cut.
間以下にとどめて印刷する特許請求の範囲第１項に記載
の厚膜抵抗の製造方法。(3) The method for manufacturing a thick film resistor according to claim 1, wherein the number of resistor bases and bases having different sheet resistance values is limited to three or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57175662A JPS5965408A (en) | 1982-10-05 | 1982-10-05 | Method of producing thick film resistance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57175662A JPS5965408A (en) | 1982-10-05 | 1982-10-05 | Method of producing thick film resistance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5965408A true JPS5965408A (en) | 1984-04-13 |
Family
ID=16000021
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57175662A Pending JPS5965408A (en) | 1982-10-05 | 1982-10-05 | Method of producing thick film resistance |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5965408A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5286150A (en) * | 1976-01-12 | 1977-07-18 | Hitachi Ltd | Method of forming pattern for thinnfilm resistors |
| JPS5288759A (en) * | 1976-01-20 | 1977-07-25 | Matsushita Electric Ind Co Ltd | Process for producing composite resistors |
| JPS5461661A (en) * | 1977-09-29 | 1979-05-18 | Fr Dou Rerekutoroorejisutansu | Plateelike electric resistor with high accuracy resistance value |
-
1982
- 1982-10-05 JP JP57175662A patent/JPS5965408A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5286150A (en) * | 1976-01-12 | 1977-07-18 | Hitachi Ltd | Method of forming pattern for thinnfilm resistors |
| JPS5288759A (en) * | 1976-01-20 | 1977-07-25 | Matsushita Electric Ind Co Ltd | Process for producing composite resistors |
| JPS5461661A (en) * | 1977-09-29 | 1979-05-18 | Fr Dou Rerekutoroorejisutansu | Plateelike electric resistor with high accuracy resistance value |
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