JPH0626911B2 - Thermal print head - Google Patents

Thermal print head

Info

Publication number
JPH0626911B2
JPH0626911B2 JP60131165A JP13116585A JPH0626911B2 JP H0626911 B2 JPH0626911 B2 JP H0626911B2 JP 60131165 A JP60131165 A JP 60131165A JP 13116585 A JP13116585 A JP 13116585A JP H0626911 B2 JPH0626911 B2 JP H0626911B2
Authority
JP
Japan
Prior art keywords
heating resistor
gold
lead electrodes
thickness
print head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP60131165A
Other languages
Japanese (ja)
Other versions
JPS61287766A (en
Inventor
方俊 明智
等 岩田
浩昭 林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP60131165A priority Critical patent/JPH0626911B2/en
Publication of JPS61287766A publication Critical patent/JPS61287766A/en
Publication of JPH0626911B2 publication Critical patent/JPH0626911B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/345Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors

Landscapes

  • Electronic Switches (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Details Of Resistors (AREA)
  • Non-Adjustable Resistors (AREA)

Description

【発明の詳細な説明】 <産業上の利用分野> 本発明は、感熱式や熱転写式のプリンタに使用される熱
印字ヘッドに関する。
The present invention relates to a thermal print head used in a thermal type or thermal transfer type printer.

<従来の技術> 一般に、この種の熱印字ヘッドとしては、例えば第4図
の平面図に示されるようなものがある。同図において、
符号1は絶縁基板であって、この絶縁基板1の一面上に
はグレーズ層2(第5図参照)が形成されており、このグ
レーズ層2を介して発熱抵抗体3が形成されている。こ
の発熱抵抗体3は帯状の連続抵抗体で構成されており、
その各印字ドット単位ごとに駆動回路4およびコモン電
極5に個別に接続されている。この駆動回路4は制御信
号に基づいて前記発熱抵抗体3を各印字ドット単位ごと
に通電制御を行なうものであって、絶縁基板1上に取り
付けられる。この駆動回路4および前記コモン電極5
と、発熱抵抗体3との間はそれぞれ絶縁基板1上に形成
された複数のリード電極6a,6bで接続されている。
<Prior Art> In general, as a thermal print head of this type, there is one as shown in a plan view of FIG. 4, for example. In the figure,
Reference numeral 1 is an insulating substrate, and a glaze layer 2 (see FIG. 5) is formed on one surface of the insulating substrate 1, and a heating resistor 3 is formed via the glaze layer 2. The heating resistor 3 is composed of a strip-shaped continuous resistor,
Each of the printing dot units is individually connected to the drive circuit 4 and the common electrode 5. The drive circuit 4 controls energization of the heating resistor 3 for each print dot unit based on a control signal, and is mounted on the insulating substrate 1. The drive circuit 4 and the common electrode 5
And the heating resistor 3 are connected by a plurality of lead electrodes 6a and 6b formed on the insulating substrate 1, respectively.

このような構成を有する熱印字ヘッドは、通常、第5図
に示すように、前記絶縁基板1の一面に所定の厚さでグ
レーズ層2の印刷,焼成した後、このグレーズ層2と絶
縁基板1上にわたって、各リード電極6a,6bをスクリ
ーン印刷法によって印刷,焼成し、更に、このリード電
極6a,6bの端部を横切る形で、前記発熱抵抗体3を印
刷,焼成している。
As shown in FIG. 5, the thermal printing head having such a structure usually prints and fires the glaze layer 2 on one surface of the insulating substrate 1 with a predetermined thickness, and then the glaze layer 2 and the insulating substrate 2 are heated. The lead electrodes 6a and 6b are printed and fired by a screen printing method over the upper surface of the substrate 1, and the heating resistor 3 is printed and fired so as to cross the ends of the lead electrodes 6a and 6b.

<発明が解決しようとする問題点> ところで、従来では、前記リード電極6a,6bを金(A
u)を主成分とする導電材料、例えば金に樹脂を混入し
てなる金ペーストで構成しているが、この場合、前述の
スクリーン印刷法で1回だけ印刷,焼成しただけでは、
該金ペーストの材料特性上、金の焼結が先に連行してペ
ースト中で凝集し、その結果、第7図に示すように、形
成済みの電極層中に金が高密度で存在する部分A(第7
図中、斜線部分で示す)と、金が疎らな部分、いわゆる
スケ部分Bが形成され、金膜が緻密に形成されない。こ
のため、従来では、リード電極6a,6bを形成するにあ
たって、1度、印刷,焼成した上に、更に1回〜2回重
ね合わせて印刷,焼成し、最終的に前記スケ部分Bを無
くして、その導体抵抗を調整していた。
<Problems to be Solved by the Invention> By the way, conventionally, the lead electrodes 6a and 6b are made of gold (A
It is composed of a conductive material containing u) as a main component, for example, a gold paste obtained by mixing a resin with gold, but in this case, printing and firing only once by the screen printing method described above,
Due to the material characteristics of the gold paste, the sintering of gold is first carried out and agglomerated in the paste, and as a result, as shown in FIG. 7, a portion where gold is present at a high density in the formed electrode layer. A (7th
(Indicated by hatched portions in the figure) and a portion where the gold is sparse, that is, a so-called transparent portion B, is formed, and the gold film is not densely formed. Therefore, conventionally, when the lead electrodes 6a and 6b are formed, they are printed and fired once, and then are printed and fired once or twice more, and finally the skein portion B is eliminated. , The conductor resistance was adjusted.

ところが、このようにして形成されたリード電極6a,6
bは厚みが2μm〜6μmという可成り分厚い寸法にな
るため、次のような問題点があった。
However, the lead electrodes 6a and 6 thus formed are
Since b has a considerably large thickness of 2 μm to 6 μm, it has the following problems.

まず、このような熱印字ヘッドは、その駆動時には、通
常、前記発熱抵抗体3の表面温度を300 ℃〜500℃程度
まで昇温させる必要があるが、厚みが大きいリード電極
6a,6bでは、その分、放熱作用も大きくなる。このた
め、従来では、該リード電極6a,6bによる放熱作用が
発熱抵抗体3の駆動に影響を及ぼすことを防止するため
に、前記グレーズ層2の厚みを大きくしなければならな
かった。
First, in such a thermal print head, it is usually necessary to raise the surface temperature of the heating resistor 3 to about 300 ° C. to 500 ° C. at the time of driving, but with the thick lead electrodes 6a, 6b, As a result, the heat dissipation effect is also increased. Therefore, in the past, in order to prevent the heat radiation effect of the lead electrodes 6a and 6b from affecting the driving of the heating resistor 3, it was necessary to increase the thickness of the glaze layer 2.

また、このようにリード電極6a,6bの厚みが大きい
と、第5図に示すように、前記発熱抵抗体3の表面に各
リード電極6a,6bの厚みによる凹凸が生じる。このた
め、第6図に示すように、該発熱抵抗体3は印刷時にお
いて、各リード電極6a,6b間に挟まれた部分に滲みbが
生じ、結果的に印字品位に問題が生じることにもなる。
Further, when the lead electrodes 6a and 6b have a large thickness in this manner, as shown in FIG. 5, irregularities due to the thickness of the lead electrodes 6a and 6b occur on the surface of the heating resistor 3. Therefore, as shown in FIG. 6, when the heating resistor 3 is printed, bleeding b occurs in a portion sandwiched between the lead electrodes 6a and 6b, resulting in a problem in print quality. Also becomes.

更には、リード電極6a,6bの厚みが大きくなるほど、
金ペースト使用量が増えるため、製造コストが高くつく
といった問題点があった。
Furthermore, as the thickness of the lead electrodes 6a and 6b increases,
Since the amount of gold paste used increases, there is a problem that the manufacturing cost is high.

本発明はかかる従来の問題点を一掃するためになされた
もので、リード電極による放熱作用を抑制すると共に、
印字品位を向上させ、かつ、製造コストを低減させるこ
とを目的とする。
The present invention has been made to eliminate such conventional problems, and suppresses the heat dissipation effect of the lead electrodes,
It is intended to improve the printing quality and reduce the manufacturing cost.

<問題点を解決するための手段> 本発明ではこのような目的を達成するために、リード電
極等の導体を金ペーストと有機金ペーストとを混練して
なる素材で構成したことに特徴を有するものである。
<Means for Solving Problems> In order to achieve such an object, the present invention is characterized in that a conductor such as a lead electrode is made of a material obtained by kneading a gold paste and an organic gold paste. It is a thing.

<実施例> 以下、本発明を図面に示す実施例に基づき詳細に説明す
る。なお、この実施例の熱印字ヘッドは第4図に示され
た従来例の熱印字ヘッドと概ね同一構成を有するもので
あり、前記従来例と同一部分には同一符号を付し、その
説明を省略する。
<Examples> Hereinafter, the present invention will be described in detail based on Examples shown in the drawings. The thermal print head of this embodiment has substantially the same structure as the thermal print head of the conventional example shown in FIG. 4, and the same parts as those of the conventional example are designated by the same reference numerals and the description thereof will be omitted. Omit it.

第1図はこの実施例の要部拡大平面図であり、第2図は
第1図における切断線II−IIに沿う断面図であり、第3
図は第2図における切断線III−IIIに沿う断面図であ
る。これらの図において、駆動回路(図示せず)と発熱抵
抗体3との間に配線されたリード電極60aと、コモン
電極5と発熱抵抗体3との間に配線されたリード電極6
0bとは、発熱抵抗体3を挟んで互いに対向して配置さ
れると共に、両リード電極60a,60bの発熱抵抗体3
との接続部分は交互に交叉する状態で櫛歯状に配列され
ている。
FIG. 1 is an enlarged plan view of an essential part of this embodiment, FIG. 2 is a sectional view taken along the section line II-II in FIG.
The drawing is a sectional view taken along the section line III-III in FIG. In these drawings, a lead electrode 60a wired between a drive circuit (not shown) and the heating resistor 3 and a lead electrode 6 wired between the common electrode 5 and the heating resistor 3
0b is arranged so as to face each other with the heating resistor 3 interposed therebetween, and the heating resistor 3 of both the lead electrodes 60a and 60b.
The connecting portions with and are arranged in a comb shape in a state of alternately intersecting.

前記各リード電極60a,60bはそれぞれ金ペーストと
有機金ペーストとを混練してなる素材で構成されてい
る。
Each of the lead electrodes 60a and 60b is made of a material obtained by kneading a gold paste and an organic gold paste.

この金ペーストは粒子状の金に樹脂を混入してなる公知
のものである。また、有機金ペーストは金と樹脂の有機
化合物で構成されており、例えば米国のエンゲルハード
社から「メタルオーガニックス」の商品名で発売されてい
るものがある。
This gold paste is a publicly known one made by mixing resin into particulate gold. Further, the organic gold paste is composed of an organic compound of gold and a resin, and for example, there is one sold by Engelhard Co., Ltd. in the United States under the product name of “Metal Organics”.

この有機金ペーストと、通常の金ペーストとは、ペース
ト状態のままで、1:1の割合で混練される。なお、こ
れらの導電材料を混練するために使用される装置として
は、例えばローラ式混練機や、磊塊機等の公知の装置が
使用される。
The organic gold paste and the normal gold paste are kneaded in the paste state in a ratio of 1: 1. As a device used for kneading these conductive materials, a known device such as a roller-type kneading machine or a rock mass machine is used.

この金ペーストと有機金ペーストとを混練してなる導電
ペースト材料は焼成時において、材料中の金の収縮量が
少なく、印刷層全体にわたって均等に配分されるため、
緻密な電極層が形成される。また、該リード電極60a,
60bは0.5μm〜1μm程度の厚みに設定されるが、こ
ような薄膜であっても、該電極層中にスケ部分が生じな
い。したがって、1回だけの印刷,焼成で、規定の厚み
を有する緻密な電極層を形成することができる。
The conductive paste material obtained by kneading the gold paste and the organic gold paste has a small shrinkage amount of gold in the material during firing and is evenly distributed over the entire printing layer.
A dense electrode layer is formed. In addition, the lead electrode 60a,
60b is set to a thickness of about 0.5 μm to 1 μm, but even such a thin film does not cause a scaly portion in the electrode layer. Therefore, a dense electrode layer having a specified thickness can be formed by printing and firing only once.

なお、前記リード電極60a,60bを有機金ペーストだ
けから構成することも考えられるが、この場合、該有機
金ペーストは1回だけの印刷,焼成によっては0.2μm〜
0.3μm程度の厚みの電極層しか得られないため、導体
抵抗が大きくなり過ぎる。このため、有機金ペースト単
独でリード電極60a,60bを作成しようとすると、3
回程度、印刷,焼成を重ねなければならず、その分、作
成過程が繁雑化する。
The lead electrodes 60a and 60b may be composed of only the organic gold paste, but in this case, the organic gold paste is 0.2 μm or more when printed and fired only once.
Since only an electrode layer having a thickness of about 0.3 μm can be obtained, the conductor resistance becomes too large. For this reason, if the lead electrodes 60a and 60b are formed using the organic gold paste alone,
Printing and firing must be repeated about once, and the production process becomes complicated accordingly.

前記各リード電極60a,60bは従来例と比較してその
厚みが1/2以下しかないため、前記発熱抵抗体3に対す
る放熱作用が抑制される。このため、蓄熱層として作用
するグレーズ層2を形成するに際して、その厚みを小さ
くすることができる。
Since each of the lead electrodes 60a and 60b has a thickness of only half or less as compared with the conventional example, the heat radiation effect on the heating resistor 3 is suppressed. Therefore, when forming the glaze layer 2 that functions as a heat storage layer, its thickness can be reduced.

また、前記発熱抵抗体3はリード電極60a,60b上に
形成されるものであるため、第3図に示すように、該リ
ード電極60a,60b上では、発熱抵抗体3の表面が他
の部分の表面より膨出すると共に、印刷時において多少
の滲みが生じることになるが、この点についても、リー
ド電極60a,60bの厚みが小さいため、印字品位に影
響を及ぼすほどの凹凸むらは生じない。更に、金の使用
量も厚みが薄くなった分だけ減少する。
Further, since the heating resistor 3 is formed on the lead electrodes 60a, 60b, as shown in FIG. 3, the surface of the heating resistor 3 on the lead electrodes 60a, 60b is the other part. While swelling from the surface of the sheet, some bleeding occurs at the time of printing. In this respect as well, since the thickness of the lead electrodes 60a and 60b is small, there is no unevenness enough to affect the print quality. . Further, the amount of gold used also decreases as the thickness decreases.

なお、前記各実施例によれば、金の含有量の減少により
約50%の製造コストダウンが可能になることが判明して
いる。更に、リード電極60a,60bの抵抗値のばらつ
きも±15%まで抑制することが可能である。
In addition, according to each of the above-mentioned examples, it has been proved that the manufacturing cost can be reduced by about 50% by reducing the gold content. Further, it is possible to suppress the variation in the resistance value of the lead electrodes 60a and 60b to ± 15%.

<発明の効果> 以上のように本発明によれば、発熱抵抗体に連なる通電
用の導体を金ペーストと有機金ペーストとを混練してな
る素材で構成したのちで、該導体を1μm程度の薄い厚
みで形成することができる。したがって、この導体によ
る放熱作用を抑制することができ、例えば、グレーズ層
を有するものにあっては、これらの厚みを薄くすること
ができる。また、発熱抵抗体の印刷後のパターンが明瞭
になり、抵抗値のばらつきが抑制されて、印字品位が向
上する。更に、1回の印刷,焼成により、1μm程度の
厚みが得られるので、印刷回数を少なくすることができ
るうえ、高価な金の使用量が減少するので、大幅に製造
コストを低減させることが可能になる。
<Effects of the Invention> As described above, according to the present invention, after the conductor for energization connected to the heating resistor is made of the material obtained by kneading the gold paste and the organic gold paste, the conductor is made to have a thickness of about 1 μm. It can be formed with a small thickness. Therefore, the heat radiation effect of this conductor can be suppressed, and for example, in the case of the one having the glaze layer, the thickness of these can be reduced. Further, the pattern of the heating resistor after printing becomes clear, variation in resistance value is suppressed, and printing quality is improved. Furthermore, since a thickness of about 1 μm can be obtained by printing and firing once, the number of printings can be reduced and the amount of expensive gold used can be reduced, which can significantly reduce the manufacturing cost. become.

【図面の簡単な説明】[Brief description of drawings]

第1図ないし第3図は本発明の実施例を示し、第1図は
この実施例の要部拡大平面図、第2図は第1図における
切断線II−IIに沿う断面図、第3図は第2図における切
断線III−IIIに沿う断面図、第4図は一般的な熱印字ヘ
ッドの平面図、第5図は従来例の要部縦断面図、第6図
は第5図における切断線VI−VIに沿う断面図、第7図は
リード電極の不都合な形成状態を示す一部取出し平面図
である。 1……絶縁基板、2……グレーズ層、3……発熱抵抗
体、60a,60b……リード電極(導体)、
1 to 3 show an embodiment of the present invention, FIG. 1 is an enlarged plan view of an essential part of this embodiment, FIG. 2 is a sectional view taken along the section line II-II in FIG. FIG. 4 is a sectional view taken along the section line III-III in FIG. 2, FIG. 4 is a plan view of a general thermal printing head, FIG. 5 is a longitudinal sectional view of a main part of a conventional example, and FIG. 6 is FIG. FIG. 7 is a cross-sectional view taken along the line VI-VI in FIG. 7, and FIG. 7 is a partially taken out plan view showing an inconvenient formation state of the lead electrode. 1 ... Insulating substrate, 2 ... Glaze layer, 3 ... Heating resistor, 60a, 60b ... Lead electrode (conductor),

フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 FI 技術表示箇所 H05K 1/16 6921−4E Continuation of the front page (51) Int.Cl. 5 Identification number Office reference number FI technical display location H05K 1/16 6921-4E

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】発熱抵抗体と、この発熱抵抗体に連なる通
電用の導体とを備えた熱印字ヘッドにおいて、前記導体
を金ペーストと有機金ペーストとを混練してなる素材で
構成したことを特徴とする熱印字ヘッド。
1. A thermal printing head comprising a heating resistor and a conducting conductor connected to the heating resistor, wherein the conductor is made of a material obtained by kneading a gold paste and an organic gold paste. Characteristic thermal print head.
JP60131165A 1985-06-17 1985-06-17 Thermal print head Expired - Fee Related JPH0626911B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60131165A JPH0626911B2 (en) 1985-06-17 1985-06-17 Thermal print head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60131165A JPH0626911B2 (en) 1985-06-17 1985-06-17 Thermal print head

Publications (2)

Publication Number Publication Date
JPS61287766A JPS61287766A (en) 1986-12-18
JPH0626911B2 true JPH0626911B2 (en) 1994-04-13

Family

ID=15051524

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60131165A Expired - Fee Related JPH0626911B2 (en) 1985-06-17 1985-06-17 Thermal print head

Country Status (1)

Country Link
JP (1) JPH0626911B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0386559A (en) * 1989-08-30 1991-04-11 Matsushita Electric Ind Co Ltd Thermal head and production thereof

Also Published As

Publication number Publication date
JPS61287766A (en) 1986-12-18

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