JPS5965402A - Thick film resistance - Google Patents
Thick film resistanceInfo
- Publication number
- JPS5965402A JPS5965402A JP57175661A JP17566182A JPS5965402A JP S5965402 A JPS5965402 A JP S5965402A JP 57175661 A JP57175661 A JP 57175661A JP 17566182 A JP17566182 A JP 17566182A JP S5965402 A JPS5965402 A JP S5965402A
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- thick film
- trimming
- same
- resistors
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Non-Adjustable Resistors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
木兄ＢＡは基板上に抵抗利判を印刷、焼成して形成され
る厚膜抵抗に関する。DETAILED DESCRIPTION OF THE INVENTION The industrial field of application relates to a thick film resistor formed by printing and baking a resistor on a substrate.
従来例の構成とその問題点
従来、厚膜抵抗誉製造する際には、使用する抵抗材料（
抵抗段−スト）に合わせて、目標の抵抗 −値よ
シも約１［４０’％程度低い抵抗値となる様に印刷スク
リーンを設計し、印刷、焼成した後トリミング装置たよ
り抵抗体に部分的に切シ溝を入れて抵抗値に合わせそい
る。この切り溝加工のことをトリミングと云い、切り溝
をトリミング溝と云う。Conventional structure and its problems Traditionally, when manufacturing thick film resistors, the resistor material used (
A printing screen is designed to have a resistance value approximately 1% lower than the target resistance (resistance stage), and after printing and baking, a trimming device is used to partially touch the resistor. Cut a groove in it and adjust it to the resistance value. This kerf processing is called trimming, and the kerf is called a trimming groove.
第１図において、（ト）は基板、（Ａ）ＣＢ）は端子ｗ
Ｌ極、０）は抵抗体、（Ｇ）はトリミング溝であり、こ
のトリミング溝（Ｇ）の形状は種々あるが、代表的なも
のとして第１図（ａ）に示す「Ｌカット」と呼ばれるＬ
字状のものと、第１図（ｂ）に示す「シングルカット」
ト呼ばれる直線状のものがあり、その他のものもこれと
類似のものである。そして、第２１Ｙ＋に示す様に、一
つの基板（Ｐ）上に複数の抵抗体（Ｒ１）と（Ｒ２）を
形成する場合、例えば抵抗体（Ｒ１）の抵抗値を１００
Ω、抵抗体（Ｒ２）の抵抗値を１ ｋＱにするには、一
般に抵抗体（Ｒ１）ｒ＝Ｌ １００ ％ 、抵抗体（Ｒ
２）ｔｊ： １ ｋつ名の抵抗ペーストを使用して別々
の印刷スクリーンで印刷し、焼成した後トリミング溝（
Ｇｌ） （（）２）を加工していた。なお、この様な場
合にも同一の抵抗ベース］・を用いることにより印刷数
を削減すること超、理論上は考えられるが、実際には抵
抗体（Ｒ１）と（Ｒ２）の形状が著しく異なるだめ不可
能である。In Figure 1, (G) is the board, (A) CB) is the terminal w
The L pole, 0) is a resistor, and (G) is a trimming groove. There are various shapes of this trimming groove (G), but a typical one is called an "L cut" as shown in Figure 1 (a). L
The letter-shaped one and the “single cut” shown in Figure 1 (b)
There is a linear type called ``g'', and other types are similar to this. As shown in the 21st Y+, when forming a plurality of resistors (R1) and (R2) on one substrate (P), for example, the resistance value of the resistor (R1) is set to 100.
Ω, to make the resistance value of the resistor (R2) 1 kQ, generally the resistor (R1) r=L 100%, the resistor (R
2) tj: 1k resistor pastes are used to print on separate printing screens, and after baking, the trimming grooves (
Gl) (()2) was being processed. Although it is theoretically possible to reduce the number of prints by using the same resistor base in such cases, in reality the shapes of the resistors (R1) and (R2) are significantly different. No, it's impossible.
例えに、抵抗体（Ｒ２）を和ＯＪ″Ｖの抵抗ペーストを
口
用いて形成すれは長さが約１０倍必要となシ、印刷不可
能である。For example, if the resistor (R2) was formed using a resistor paste with a total OJ''V, it would require about 10 times the length and would be impossible to print.
この様に従来の厚膜抵抗においては、
（１）、同じ抵抗ペーストを用いて異なった抵抗値の抵
抗体を形成するのが困難であシ、異方るシート抵抗を崩
１゛る多くの抵抗ペーストが必要であり、
（２）、同一基板に抵抗値の異なる抵抗体を形成する場
合、一つの基板に対して印刷スクリーン数が多く必要で
あり、
（３）、印刷工数も抵抗ペーストの品秤数必要であり、
（４゛・、抵抗体の細密化は印刷精度と抵抗ペーストの
ばらつき等によって決定されるため、従来は１ｉｇｘ
１ ｒｐｓ程度が附異で、づらに細密化を■するのが困
難である、
等、多くの問題点があった。As described above, in conventional thick film resistors, (1) it is difficult to form resistors with different resistance values using the same resistor paste, and there are many (2) When forming resistors with different resistance values on the same board, a large number of printing screens are required for one board; (3) The number of printing steps is also lower than that of resistor paste. The number of items weighed is required,
(4゛・, Since the miniaturization of the resistor is determined by the printing accuracy and the variation of the resistor paste, the conventional method is 1igx
There were many problems, such as the difference of about 1 rps, making it difficult to refine the process.
発明の目的
本発明は、従来のかかる問題点に％み、トリミングによ
って任意の高抵抗値が得られる厚膜抵抗を提供すること
を目的とする。また、本発明は前記厚膜抵抗を用いるこ
とにより、抵抗値の著しく異なった抵抗体を同一基板上
に同一の抵抗材料を用いて形成した厚膜抵抗を提供する
ことを目的とする。OBJECTS OF THE INVENTION It is an object of the present invention to overcome these conventional problems and provide a thick film resistor that can be trimmed to obtain a desired high resistance value. Another object of the present invention is to provide a thick film resistor in which resistors having significantly different resistance values are formed on the same substrate using the same resistive material.
発明の構成
本発明は、このため抵抗材料を印刷、焼成して形成した
抵抗体を、同一回転方向に曲折させた２本のトリミング
溝によってうず巻状Ｋ）リミングし、うず巻長によシ目
標の抵抗値を得た厚膜抵抗を提供する。また本発明は、
同一基板に形成した複数のＶ！、抗体の内、高抵抗値と
すべきものを上記の様にうす巻状にトリミングし、低抵
抗値とすべきものは従来と同様のトリミングをし、同一
抵抗材料を用いて複数種の抵抗値をもつ抵抗を構成した
厚膜抵抗を提供する。なお、前記トリミングをレーザー
トリミング装置を用いて行なうことによシ高精度の加工
が可能で、細密化を図ることができる。Structure of the Invention For this purpose, the present invention rims a resistor formed by printing and firing a resistor material into a spiral shape with two trimming grooves bent in the same direction of rotation, and adjusts the spiral length. A thick film resistor with a target resistance value is provided. Moreover, the present invention
Multiple Vs formed on the same substrate! Among the antibodies, those that should have a high resistance value are trimmed into a thin coil shape as described above, and those that should be a low resistance value are trimmed in the same way as before, and multiple types of resistance values can be obtained using the same resistance material. A thick film resistor is provided. Note that by performing the trimming using a laser trimming device, highly accurate processing is possible, and miniaturization can be achieved.
実施例の説明
以下、本発明の実ｈｔｈ例を第６図乃至第５図に基づい
て説明する。第３図において、伊）は基板、（Ａ）（Ｂ
）は端子電極、幹）は端子を極μ）■）間に印刷された
酸化ルテニウムやカーボンなどの抵抗材料からなる抵抗
体である。この抵抗体（ロ）には、レーザートリミング
装置によル互いに異なった位置から２本のトリミング溝
（Ｔｌ）（Ｔ ２）が力１１工さｔしてＶ・る。これら
トリミング？Ｆ４（ＴｘＸＴｚ）は、同一回転方向にう
ず巻状に折曲して形成され、抵抗体（Ｒ）は内側端が互
いに連続し外側端が各々端子％極（Ａ） （Ｂ）に接続
された２本のうず巻体で構成されている。これによると
、抵抗値は同一形状の抵抗体を印刷しておき、トリミン
グ装動をコントロールすることによって広範囲の抵抗値
を持った厚膜抵抗を任意に製造し得る。DESCRIPTION OF EMBODIMENTS Hereinafter, practical examples of the present invention will be explained based on FIGS. 6 to 5. In Figure 3, Italy) is the substrate, (A) (B
) is a terminal electrode, and stem) is a terminal made of a resistive material such as ruthenium oxide or carbon printed between the poles (μ) and ■). In this resistor (b), two trimming grooves (Tl) (T2) are cut with a force of 11 from different positions by a laser trimming device. Are these trimmed? F4 (TxXTz) is formed by bending in a spiral shape in the same rotational direction, and the inner ends of the resistor (R) are continuous with each other, and the outer ends are connected to the terminals (A) and (B), respectively. It is composed of two spiral bodies. According to this, thick film resistors having a wide range of resistance values can be arbitrarily manufactured by printing resistors having the same resistance value and controlling the trimming mechanism.
第４．図は、抵抗体（６）を方形状に形成し、端子電極
（Ａ） （Ｅｌ）を隣シ合う角部に並列して配置した場
合を示し、トリミング溝（Ｔ１ＸＴ２）Ｕ抵抗体（ロ）
の外形状に沿って形成されている。この様に抵抗体０）
の形状は任意に選択できるものである。4th. The figure shows the case where the resistor (6) is formed into a rectangular shape and the terminal electrodes (A) (El) are arranged in parallel at the adjacent corners, and the trimming grooves (T1XT2) and the U resistor (B) are arranged in parallel.
It is formed along the outer shape of. In this way, resistor 0)
The shape of can be arbitrarily selected.
第５図は、１つの基板（ト）上に抵抗体（Ｒ１）と抵抗
体（Ｒ２）を構成したものであ）、抵抗体（Ｒ１）には
「Ｌカッ）Ｊ（Ｇ）が施され、抵抗体（Ｒ２）にはうず
巻状の２本のトリミング溝（Ｔｌ） （Ｔ２）か加工さ
れている。In Figure 5, a resistor (R1) and a resistor (R2) are constructed on one substrate (G), and the resistor (R1) is marked with an "L" J (G). , two spiral trimming grooves (Tl) (T2) are machined in the resistor (R2).
これに＋ると、抵抗体（Ｒ１）の抵抗値を１００ΩΣ、
抵抗体Ｃ，１１２） ノｍ抗値を１ｋｎ−トじテも、１
００ １０ Ｏシート抵抗を有する抵抗相料でこれら抵
抗体（ＲＩＸＲ２）を形感することができる。By adding this, the resistance value of the resistor (R1) becomes 100ΩΣ,
Resistor C, 112) The resistance value is 1kn-to, 1
These resistors (RIXR2) can be sensed with a resistive phase material having a sheet resistance of 00 10 O.
発明の効果
本発明の厚膜抵抗によれは、以上の説明から明らかな様
に、次の様な効果を得ることができる。Effects of the Invention As is clear from the above description, the thick film resistor of the present invention can provide the following effects.
（１）、一種のシート抵抗を有する抵抗材料で広乾囲の
抵払飴を有する抵抗体を構成できる。(1) It is possible to construct a resistor having a wide resistance resistance material using a resistance material having a certain type of sheet resistance.
（２）、抵抗月料の品種数を削減できる。(2) The number of types of resistance monthly charges can be reduced.
（３）、印刷スクリーンの数を削減できる。(3) The number of printing screens can be reduced.
（４）、印刷工ｖが削減できる。
（０］（５゛、、トリミングをレーザートリミング
装置を用いて１°、うことによシ、抵抗体の細密化が可
能となり、約［１，５ＸＥ７ＪＸＱ。５ｕの抵抗体が製
造可 （ｂ）ｈトとなる。(4) The printing process v can be reduced.
(0) (5゛,, By trimming by 1 degree using a laser trimming device, it is possible to make the resistor smaller, and it is possible to manufacture a resistor of approximately [1,5XE7JXQ.5u) (b) It becomes h.
（０’ｌ、抵抗体の形状が自由であジ、設計が容易でか
つ高密度化が可能となる。(0'l, the shape of the resistor is free, design is easy, and high density is possible.
第１図（ａ） （ｈ）はそれぞれ従来例の平面図、第２
図は同−１析に複数の抵抗体が形成されている場合の従
来例の平面図、第３図及び第４図は本発明の実施例の平
面図、第５図は同一基板に複数の抵抗体が形成される場
合に本発明を適用した実施例の平面図である。
（Ｐ＞は基板、□□□）（Ｒ１）（Ｒ２）は抵抗体、（
Ｔ１） （Ｔ２）はトリ ミ ン グ 渦 。
第７図
ＺFigures 1(a) and 1(h) are plan views of the conventional example, and Figure 2
The figure is a plan view of a conventional example in which a plurality of resistors are formed on the same substrate, FIGS. 3 and 4 are plan views of an embodiment of the present invention, and FIG. FIG. 2 is a plan view of an embodiment to which the present invention is applied when a resistor is formed. (P> is the substrate, □□□) (R1) (R2) is the resistor, (
T1) (T2) is the trimming vortex. Figure 7 Z
Claims (1)
同一回転方向に曲折させた２本のトリミング溝によって
うず巻状にトリミングしてなる厚膜抵抗。 （２）、前記トリミングはレーザートリミング装置によ
るものである特許請求の範囲第１項に記載、の厚膜抵抗
。 （３）、同−抵抗利料を印刷、焼成して形成した複数の
抵抗体を設け、これら抵抗体の内高抵抗値とすべき抵抗
体を、同一回転方向に曲折させた２本のトリング潜によ
ってうず巻状にトリミングし、著しく異たる抵抗値をも
つ抵抗を同一抵抗材料でｔ１成してなる厚膜抵抗。 （４，、前記トリミングはレーザートリミング銭散によ
るものである％￥［請求の範囲第３功に記載の厚膜抵抗
。[Claims] (X) A resistor formed by printing and firing a resistor material,
A thick film resistor that is trimmed into a spiral shape using two trimming grooves bent in the same direction of rotation. (2) The thick film resistor according to claim 1, wherein the trimming is performed by a laser trimming device. (3), A plurality of resistors are formed by printing and firing the same resistance material, and the resistor that should have a high resistance value among these resistors is bent into two strings in the same rotation direction. A thick film resistor made of the same resistive material, trimmed into a spiral shape by diode, and having significantly different resistance values. (4. The trimming is performed by laser trimming. [Thick film resistor according to claim 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57175661A JPS5965402A (en) | 1982-10-05 | 1982-10-05 | Thick film resistance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57175661A JPS5965402A (en) | 1982-10-05 | 1982-10-05 | Thick film resistance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5965402A true JPS5965402A (en) | 1984-04-13 |
Family
ID=16000003
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57175661A Pending JPS5965402A (en) | 1982-10-05 | 1982-10-05 | Thick film resistance |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5965402A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS617585A (en) * | 1984-06-20 | 1986-01-14 | タニカ電器株式会社 | Waterproof structure of domestic electric heater |
| JPS6138902U (en) * | 1984-08-08 | 1986-03-11 | ロ−ム株式会社 | Resistor |
| JPS6157501U (en) * | 1984-09-19 | 1986-04-17 | ||
| EP3821524B1 (en) * | 2018-07-09 | 2023-11-08 | Mavel edt S.p.A. | System for converting direct current electric energy into alternate current electric energy |
-
1982
- 1982-10-05 JP JP57175661A patent/JPS5965402A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS617585A (en) * | 1984-06-20 | 1986-01-14 | タニカ電器株式会社 | Waterproof structure of domestic electric heater |
| JPS6138902U (en) * | 1984-08-08 | 1986-03-11 | ロ−ム株式会社 | Resistor |
| JPS6157501U (en) * | 1984-09-19 | 1986-04-17 | ||
| JPH0219921Y2 (en) * | 1984-09-19 | 1990-05-31 | ||
| EP3821524B1 (en) * | 2018-07-09 | 2023-11-08 | Mavel edt S.p.A. | System for converting direct current electric energy into alternate current electric energy |
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