JPS5964358A - Manufacture of metallic foil lined laminated board - Google Patents
Manufacture of metallic foil lined laminated boardInfo
- Publication number
- JPS5964358A JPS5964358A JP57174942A JP17494282A JPS5964358A JP S5964358 A JPS5964358 A JP S5964358A JP 57174942 A JP57174942 A JP 57174942A JP 17494282 A JP17494282 A JP 17494282A JP S5964358 A JPS5964358 A JP S5964358A
- Authority
- JP
- Japan
- Prior art keywords
- manufacture
- resin
- prepreg
- laminate
- laminated board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明はプリント配線板用等のように高寸法安定性を必
要とする槓Jm板の吸造方法に関するもので、その目的
とするところは厚み精度の同上とあわせて製造の効率化
である。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for sucking Jm boards that require high dimensional stability, such as those used for printed wiring boards, and its purpose is to improve thickness accuracy as well as to improve thickness accuracy. This is to improve manufacturing efficiency.
従来の槓j四板は第1図に示すように槓j曽板用樹脂を
積層板用樹脂に含浸、乾燥したプリプレグ1を所要枚数
積層會し、更に最外層に金属箔2を載置した積肋体aを
金型用金属板3の間に挾み加熱加圧成形していたがプリ
プレグ1から熔融流出する積層板用樹脂4のため厚み精
度か低下するのは避けられないことであった。更に成形
時にプリプレグかズレ易く且つ熔融流出した樹脂か硬化
片となって金型用金属板に付着し次回成形烏に積j−板
表面に傷をつけ不良発生となる欠点かあった。As shown in Fig. 1, the conventional four-panel j-board is made by impregnating the resin for the plywood board into the resin for the laminate, laminating the required number of dried prepregs 1, and then placing the metal foil 2 on the outermost layer. Although the stacked ribs a were sandwiched between metal plates 3 for molds and molded under heat and pressure, it was inevitable that the thickness accuracy would deteriorate due to the laminate resin 4 melting and flowing out from the prepreg 1. Ta. Furthermore, the prepreg tends to shift during molding, and the melted and flowed resin becomes hardened pieces that adhere to the metal plate for the mold, which can damage the surface of the plate and cause defects when it is placed in the next molding process.
本発明は上記欠点を解決するもので、積1曽体周縁側面
部を最外j−金属箔で包含してから加熱加圧成形するた
め成形時の積層板用樹脂の熔融流出を防止することがで
きるので厚み精度の向上と借上でプリプレグのズレと硬
化片による積層板表面の傷つきを防止できるものである
。The present invention solves the above-mentioned drawbacks, and since the peripheral side surface of the laminate is covered with the outermost metal foil and then heated and press-molded, the resin for the laminate is prevented from melting and flowing out during molding. As a result, thickness accuracy can be improved and damage to the laminate surface caused by misalignment of the prepreg and hardened pieces can be prevented.
次に本発明の方法を詳しく説明する。本発明に使用する
積層板用樹脂はエポキシ植j脂、フェノール樹脂、不飽
和ポリエステル極脂、メラミン樹脂、ポリイミド樹脂、
ポリブタジェン樹脂等の単独又は混合物或は変性物等の
熱硬化性樹脂全般である。yi層板用基材としては紙や
木綿等の大然縁維やポリアミド、ポリビニルアルコール
、ポリエステル、ポリアクリル等の有機合成繊維やガラ
ス、アスベスト等の無機繊維の織布や不織布やマ・ント
である。蛍JN4?(+としては銅、アルミニウム、ニ
ッケル、X鋳等の蛍ts 泊か用いられ必要に応じてプ
リプレグ側に接朧−剤層等を設けたものが用いられる。Next, the method of the present invention will be explained in detail. The resins for laminates used in the present invention include epoxy resin, phenol resin, unsaturated polyester resin, melamine resin, polyimide resin,
These include thermosetting resins in general, such as polybutadiene resins alone, mixtures, and modified products. The base material for the laminate can be woven or non-woven fabrics, organic fibers such as paper or cotton, organic synthetic fibers such as polyamide, polyvinyl alcohol, polyester, polyacrylic, glass, inorganic fibers such as asbestos, etc. be. Firefly JN4? (For +, a fluorescent material such as copper, aluminum, nickel, or X-casting is used, and if necessary, a glue layer or the like is provided on the prepreg side.
又両回社騙抽張りat−板の場合においては上、下面各
れかの蛍鵜箔のみはプリプレグ寸法と同一とし残る片面
側の並病箔でもって積j一体周縁側面B1≦を包含する
こともできるものである。In addition, in the case of double-circuit drawing at-board, only the hotauro foil on either the top or bottom surface is the same as the prepreg size, and the remaining average-sized foil on one side covers the integral peripheral side surface B1≦. It is also possible.
次に本発明の方法を実施例にもとすいて説明する。Next, the method of the present invention will be explained based on examples.
実施例
本発明の方法により積#kを得る際の実施例について図
面により説明すれば次のようにある。第2図に示すよう
に樹脂含有率50重蓋% (以下単に%と記す)のレゾ
ール型フェノール樹脂ワニスを厚さ0.1mmのクラフ
ト紙に含浸、乾燥した樹脂含有率45%のプリプレグ1
を8枚積j繭し、更に最上ノーにプリプレグの外形寸法
より大きい厚さ35ミクロンの接着剤iw付銅箔2の接
着剤IA側をプリプレグと対向させて載置した租j餉体
aの該欽箔2で積J一体周縁側面部を包含してから金型
ハ」金属板3の間に挾んで成形圧力100 M、160
℃で60分間積I薗成形して厚さ1.6日の片面銅張
り積層板を、得た。該積j−板の厚み精゛度は16±0
.10+a であり、成形時のプリプレグのズレ発生も
なく且つ鉱型ハ」金属板に樹脂硬化片が付着しないため
積)−板表面の傷つきもな(史に積j一体か1体化され
ているので収嵌い易いものであった。EXAMPLE An example of obtaining the product #k by the method of the present invention will be described below with reference to the drawings. As shown in Figure 2, prepreg 1 with a resin content of 45% is impregnated into 0.1 mm thick kraft paper with a resol type phenolic resin varnish with a resin content of 50% (hereinafter simply referred to as %) and dried.
A cocoon of 8 pieces of cocooned paper is placed on top of the copper foil 2 with adhesive IW, which is larger than the outer dimensions of the prepreg and has a thickness of 35 microns, with the adhesive IA side facing the prepreg. The foil 2 is used to cover the side surface of the integral periphery of the product J, and then the mold is sandwiched between the metal plates 3 and molded under pressures of 100 M and 160 M.
A single-sided copper-clad laminate having a thickness of 1.6 days was obtained by molding for 60 minutes at °C. The thickness accuracy of the product J-plate is 16±0
.. 10 + a, there is no misalignment of the prepreg during molding, and no hardened resin pieces adhere to the metal plate, so there is no damage to the surface of the plate. Therefore, it was easy to fit in.
従来例
実施例と同じプリプレグ8枚を積j曽し、史に最上1m
にプリプレグの外形寸法と同じ厚さ35ミクロンの接論
剤j−付銅箔の接着剤層側をプリプレグと対向させて載
置した積)一体をそのまま蛍型用館属板に挾み実施例と
同じように処理して得た厚さ1.6閣の片面銅張り積層
板の厚み精度はlb±0.14闘であり、成形時のプリ
プレグのズレ発止防止に性急を必要とし且つ熔融樹脂硬
化片が蛍型用金1萬仮に付着するため積J曽板表面の傷
つき不良があり更に積層体が1体化されていないため取
飯い難く製造効率の悪いものであった。The same 8 sheets of prepreg as in the conventional example were piled up, and the highest thickness in history was 1 m.
A copper foil coated with a contact agent of 35 microns in thickness, which is the same as the external dimensions of the prepreg, was placed with the adhesive layer side facing the prepreg.The whole was then sandwiched between the firefly mold board as it was.Example. The thickness accuracy of a single-sided copper-clad laminate with a thickness of 1.6 mm obtained by processing in the same manner as above was lb ± 0.14 mm, and it was necessary to urgently prevent the prepreg from shifting during molding, and melting. Since the cured resin pieces adhered to the firefly-shaped metal 10,000 pieces, the surface of the laminate plate was damaged and the laminate was not integrated, making it difficult to assemble and resulting in poor manufacturing efficiency.
このように本発明の方法(こよれば厚み精度の歯上と製
造の効率化を達成することができ、本発明の方法の優れ
ていることを確認した。As described above, it was confirmed that the method of the present invention was able to achieve thickness accuracy of the teeth and increase manufacturing efficiency, and that the method of the present invention was superior.
第1図は従来の方法により積j鉤体を成形した場合の概
略断面図、第2図は本発明の方法により積層体を成形す
る場合の概略断面図である。
1はプリプレグ、2は蛍鵬箔、3は金型用曽蝿板、4は
熔融流出する積層板用樹脂である。
特許出動人
松下亀工株式会社
代理人升理士 竹 元 敏 丸
(ばか2名)
第1図
第2図FIG. 1 is a schematic cross-sectional view of a laminated body formed by a conventional method, and FIG. 2 is a schematic cross-sectional view of a laminated body formed by the method of the present invention. 1 is a prepreg, 2 is a fluorescent foil, 3 is a mold plate, and 4 is a resin for a laminate that melts and flows out. Patent dispatcher Matsushita Kameko Co., Ltd. agent Masu Toshimaru Takemoto (two idiots) Figure 1 Figure 2
Claims (1)
レグを所要枚数積層し、更に最外層に金属箔を載置した
積層体を加熱加圧成形してなるfjli層板の製造にお
いて、槓りm体周縁側面部を上記金属箔で包含してから
加熱加圧成形することを特徴とする金属箔張り積層板の
製゛造方法。Manufacture of fjli laminates by impregnating resin for doveboards into the base for doveboards, laminating the required number of dried prepregs, and then heat-pressing the laminate with metal foil placed on the outermost layer. A method for manufacturing a metal foil-clad laminate, characterized in that the peripheral side surface of the m-shaped body is covered with the metal foil and then heated and press-molded.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57174942A JPS5964358A (en) | 1982-10-04 | 1982-10-04 | Manufacture of metallic foil lined laminated board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57174942A JPS5964358A (en) | 1982-10-04 | 1982-10-04 | Manufacture of metallic foil lined laminated board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5964358A true JPS5964358A (en) | 1984-04-12 |
JPH0340709B2 JPH0340709B2 (en) | 1991-06-19 |
Family
ID=15987421
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57174942A Granted JPS5964358A (en) | 1982-10-04 | 1982-10-04 | Manufacture of metallic foil lined laminated board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5964358A (en) |
-
1982
- 1982-10-04 JP JP57174942A patent/JPS5964358A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPH0340709B2 (en) | 1991-06-19 |
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