JPS5961705A - Inspecting device of mounted chip and parts - Google Patents

Abstract

PURPOSE:To enable automatic inspection of propriety of mounted chip and parts by comparing a video signal by a TV camera which photographs a printed circuit board having chip and parts to be inspected with a reference signal prepared and memorized based on the accepted printed circuit board. CONSTITUTION:When a chip and parts are mounted normally, the state of the actual mounting of the chip and parts 1 is photographed with a TV camera and a signal having the output signal overlapping a reference signal previously prepared is displayed on a monitor TV. The video signal on the horizontal scan line Li of the TV camera has the waveform as indicated by (b) while the reference signal at the same position on the horizontal scan line has the waveform as indicated by (c). ANDing between the (b) and (c) gives the waveform as indicated by (d). The waveform (d) is at a low level and no high level output is obtained. The absence of the high level output enables the judgement that the chip and parts 1 are mounted at the normal position. The state of mounting massive chip and parts at a high density can be inspected at a high speed with a high accuracy.

Description

[Detailed Description of the Invention] Industrial Field of Application The present invention is applicable to electronic circuits that require electronic circuits, and where the electronic circuits are composed of chip components and printed wiring boards. The present invention relates to a chip component mounting inspection device that can be used for.

Conventional configurations and their problems In recent years, electronic devices such as tape recorders, Nudeleon Nutem, and radio receivers have become smaller and lighter in size in order to save energy, improve portability, and save resources. , a resistor used in electronic circuits.

Chip components are increasingly being used in capacitors and other products.

Mounting these chip components onto a printed wiring board is difficult with nesting, and when mass production is carried out, everything is done by machine, but the mounting condition cannot be said to be 100% satisfactory. When chip components are mounted on a printed wiring board, mounting problems occur, such as the chip components not being in the correct location, or even if the chip components are mounted, the position is shifted and the circuit does not operate normally.

For this reason, inspection of the quality of the mounting state of chip components is carried out.

Conventionally, the inspection described in Section 2 was conducted visually by humans to determine the fire mount condition of the parts.
This is done by checking each item one by one.

That is, the inspector visually determines whether the chip component is mounted on the printed wiring board within the normal head circumference of the actual device, and performs the inspection.

However, with the above-mentioned inspection method, abnormalities in the mounting of chip components are often overlooked due to the inspector's mouth being severely fatigued, judgment errors caused by physical fatigue, etc., and the inspection speed is slow. I was worried about the slow speed and the problem of snow.

Purpose of the Invention The present invention solves the above-mentioned conventional problems.
A4. Chip parts. An object of the present invention is to provide a chip component mounting inspection device that automatically performs high-speed, sensitive, and automatic inspection for deviations from the correct mounting range.

l'f+1 construction of the invention The present invention comprises a television camera equipped with an illuminator that illuminates from an angle, a monitor television, and a base ring.
This is a chip component mounting inspection device equipped with a memory circuit for copying and copying, and a borrowing device. This system automatically performs inspection by comparing the base 174 signal with the video signal captured by a television camera of the printed wiring board on which the chip component to be inspected is mounted. .

DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 shows a (14 diagram) in an embodiment of the present invention.A chip component 1 is mounted/ζ printed wiring board 2 has a position regulating guide 1-12 (111
It is positioned at the second position of the stand 11.

The environmental illumination of this device is dimmed, and the chip component 1 is illuminated by a local illumination lamp 13 that illuminates the thousand knob component 1 from an angle.
form a shadow. This is imaged from above with a television camera 8. This camera 8 is attached to a mounting LI stand 9, and this mounting LI stand 9 is fixed to a positioning stand that can be positioned arbitrarily on a base 14, that is, an x-y table 10. This is a monitor pre-vision, and 3Q is a housing that incorporates a television camera control unit and an electric circuit unit for a computer.

Second diagram, 1. : shows a block diagram of the recording device.

In FIG. 2, 16 is a control circuit for the television camera 8;
Binarization circuit 16b, conversion circuit 16b + deflection circuit 6
It consists of 8. Reference numeral 27 denotes a binary level generator, which is controlled by instructions from the computer 17 via the interface 16, and its level is also specified. 2
0 is a valme motor IC that moves the X-Y table 10
The drive circuit 1 is controlled by the numerical control circuit 21. The numerical control circuit 21 receives an indication of the value of the control value via the ink face 19 in response to a command from the printer 17. 23-1lj'l jLi'res bus buffer y l+'lfrA memory circuit that stores the output of Raku 15e.
Functions as a cow generator. Reference numeral 24 denotes a memory control circuit that controls writing and reading of the memory circuit 23 via the ink face 16 in response to commands from the computer 17. 25 is switch ink face circuit 1
, 1 itu is for inputting the result of the operation of the signal write switch 26 to the memory control circuit 24. Reference numeral 28 is a superimposition device for displaying the video signal and the reference signal on the monitor television 22 at the same time, and 29 is a comparator that compares the video signal and the reference signal and outputs an output if there is any discrepancy. Reference numeral 18 is an external memory of a computer block for providing reference signals and general control of the apparatus; for example, a K7-1 tape recorder is used.

The operation of the chip component mounting inspection apparatus according to the present embodiment, which is illustrated as shown in 2 below, will be described below.

First, the operation can be divided into two parts. One is the process of creating a reference signal necessary for inspection, and the other is the operation of inspecting using the reference signal during JJ.

First, to create a reference signal: As shown in FIG. (IJV, 2 (hereinafter referred to as 1/board 2)
The board 2 on which the chip component 1 is mounted in the normal position is placed on the base 11 by regulating the position 11 with the position regulating guide '12 (= 1). As shown in the figure, when light is irradiated from an oblique angle 1 using the 1!

Figure 6 shows normal mounting of chip component 1; center point of head circumference 4
゛This is an enlarged view of how it is implemented in F-Buy. When the substrate 2 shown in FIG. 6 is imaged by the television camera 8 and the imaged output is viewed on the monitor television 22, it will be the same as that shown in FIG. The diagonal shaded area 6 in FIG. 7 indicates if the chip component 1 is mounted shifted to the boundary line within the surface area 4, and the mounting position in all cases at that time is corrected. This is the part that always exists as a shadow. This part is enlarged and shown in 6 of Fig. A base Ng signal is created by superimposing the white signal) on the part 6 in Fig. 8. This second video signal is the white part molecule in Fig. 9, and this becomes the reference signal.

The following operation will be explained with reference to FIG. 2. The television camera 8 always images the board 2 on which the chip component 1 is mounted, and the resulting video signal is multiplied by the video signal [
The IJ unit 15a increases [IJ unit, its output is converted into a binary circuit 16
b, and the binary output is output to the monitor television 22 via the signal switching device 150 and the superimposing device 28.

On the other hand, the operator operates the standard writing pad 26 so that a white portion 7 shown in FIG. 9 is formed at the shadow 3 not shown in FIG. The l-1-/L/ circuit 24 is operated and data is written to the memory circuit (RAM) 23. The video signal written in this memory circuit 23 is outputted every moment, and is sent to the monitor television 2 via a superimposing device 28.
Photo 2. Therefore, the monitor television 22 simultaneously displays two signals: the signal from the television camera 8 and the signal 11 made by the worker along with the signal. Note that the address of the RAM of the memory circuit 23 is created by an AI-paranuhas Hannover circuit 158 synchronized with the oscillation of the deflection circuit 16d in the camera control circuit 15.

Next, for the inspection created as described in -1-1,! late f
A chip component as an object to be inspected was mounted using the T-transfer 3. 17 (Explain the horizontal movement of the board.

For a moment, a substrate on which chip components are always mounted on 1F will be explained with reference to FIG. FIG. 10(a) shows a state in which the chip component 1 is normally mounted, which is imaged by a television camera 8, and the output of the image is superimposed with the previously created reference signal. This is a photograph taken on page 22. In this case, the video signal on the horizontal scanning line L1 of the television camera 8 has the waveform shown in (b), and the reference signal at the same position as the horizontal scanning line has the waveform shown in (c). When both signals (bl) and (C) are ANDed, the waveform shown in (d) is obtained. That is, the waveform (d) is at a low level, and no high level output is obtained.

The absence of this high level output determines that the chip component 1 is mounted in the normal position.

Note that if the mounting position of the chip component 1 is within the normal mounting range, the entire white portion 7 is always located within the shadow 3, so a high level output is not generated, and therefore, a non-defective product is determined even if the chip component 1 is removed.

Next, the determination when the mounting is abnormal, that is, when the thousand-knob component 1 is mounted with too much deviation will be explained with reference to FIG. If the chip component 1 is shifted too much as shown in FIG. The video signal has the waveform shown in ('b) in the same figure, and the reference signal has the waveform shown in (C) in the same figure. Note that this waveform (0) is exactly the same as the waveform (C) in FIG. Therefore, by ANDing the signals of waveforms (b) and (C) in FIG. 11, the waveform shown in FIG. 11(d) is obtained, and a high-level pulse is obtained. That is, the output of this high-level pulse determines that the mounting state is abnormal.

In this way, the inspection device of this embodiment compares the reference signal shift and the printed wiring board on which chip components are mounted by taking the logical product of the image captured by the television camera, and as a result of the comparison, the PALNU output is obtained. If no pulse output appears, it is determined that there is no abnormality, and if a pulse output is generated, it is determined that there is an abnormality.

The sacrificial reference signal described above can be stored in advance in the memory circuit 23 shown in FIG. 2, and when imaging the printed wiring board, the stored contents can be read out from the memory circuit 23 and compared with the imaging signal. .

The following operation will be explained using the block diagram shown in FIG. ? The signal is increased by 11j in ri 16 a, and this is converted into 2 (lT+) by the conversion circuit 15b, and then inputted to the ratio 11 (reducer 29).Meanwhile, the signal read out from the memory circuit 23, that is, the reference signal, is also converted into a ratio 1 [ The output of the comparator 29, that is, the waveform signal shown in FIG. 10 and FIG. 17, if the inspection result shows an abnormality, the abnormality location is displayed on the screen of the monitor television 22 or marked directly on the printed wiring board 2.

In the above embodiment, the mounting inspection of one chip component has been described, but in reality, a plurality of chip components are inspected in the same manner.

Effects of the Invention As described above, the present invention performs JIF on a printed wiring board, and constantly uses a reference signal created based on the shadow of the mounted chip component and an imaging signal of the printed wiring board on which the chip component to be inspected is mounted. A comparator is used for comparison, and the mounting state of the chip components is determined based on the comparison result. This allows the mounting state of a large number of chip components mounted at high density to be checked quickly and with high precision. It can be inspected and therefore greatly contributes to the automation and speeding up of inspection work, and its effects are great.

[Brief explanation of the drawing]

Fig. 1 is a schematic configuration diagram showing one embodiment of the present invention, Fig. 2 is a block configuration diagram of the same, Fig. 3 is a plan view of a printed wiring board on which chip components are mounted, and Fig. 4 is a schematic diagram of the printed wiring board on which chip components are mounted. Figure 5 is a bottom view of the same when exposed to light, Figures 6, 7, 8, and 9 are clear views of the same inspection chamber, Figure 10, and Figure 1.
Figure 1 is the theory 1υ1 diagram of the test judgment. 1...Chip parts, 2...Printed wiring board, 3...Shadow of chip parts, 7...Mark/reference signal part, 8...・Television camera, 1
3. River: Lighting lamp, 22: Monitor television, 23: River: Memory circuit, 26: Reference signal writing switch, 29: Comparator. Name of agent: Patent attorney Toshio Nakao Haga 1 person No. 3
Figure 6 Figure 7 Figure 8 (Figure 9 Figure 10) L -t

Claims (1)

[Claims] A television camera that captures an image of a printed wiring board on which chip components are constantly mounted with oblique light, and a monitor television that displays the image signal of the television camera. A two-party signal creation device that forms the basic signal on the surface of the monitor television image, a memory circuit that stores the basic 14 signal, and a chip component that is a detection body were mounted. A comparator (11iii) is installed to read out and compare the image data obtained by imaging the printed wiring board with a television camera and the corresponding IJI*, and the mounting state of the chip components is determined based on the ratio (119) result of the axis ratio device. A chip component mounting inspection device configured as follows.