JPS5958640A - Substrate forming stamper - Google Patents
Substrate forming stamperInfo
- Publication number
- JPS5958640A JPS5958640A JP16862382A JP16862382A JPS5958640A JP S5958640 A JPS5958640 A JP S5958640A JP 16862382 A JP16862382 A JP 16862382A JP 16862382 A JP16862382 A JP 16862382A JP S5958640 A JPS5958640 A JP S5958640A
- Authority
- JP
- Japan
- Prior art keywords
- film
- substrate
- stamper
- layer
- thin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 43
- 239000010409 thin film Substances 0.000 claims abstract description 33
- 239000010408 film Substances 0.000 claims abstract description 30
- 239000002184 metal Substances 0.000 claims abstract description 19
- 229910052751 metal Inorganic materials 0.000 claims abstract description 19
- 239000011347 resin Substances 0.000 claims abstract description 10
- 229920005989 resin Polymers 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims abstract description 4
- 239000000853 adhesive Substances 0.000 claims abstract description 3
- 230000001070 adhesive effect Effects 0.000 claims abstract description 3
- 229910052804 chromium Inorganic materials 0.000 claims abstract 3
- 229910052737 gold Inorganic materials 0.000 claims abstract 2
- 238000000465 moulding Methods 0.000 claims description 7
- 238000010521 absorption reaction Methods 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- 229910052721 tungsten Inorganic materials 0.000 claims description 3
- 229910052720 vanadium Inorganic materials 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 229910052715 tantalum Inorganic materials 0.000 claims description 2
- 229910052757 nitrogen Inorganic materials 0.000 claims 1
- 238000004544 sputter deposition Methods 0.000 abstract description 9
- 239000011521 glass Substances 0.000 abstract description 8
- 238000005187 foaming Methods 0.000 abstract 1
- 230000001678 irradiating effect Effects 0.000 abstract 1
- 239000007789 gas Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 8
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- 238000005266 casting Methods 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000005323 electroforming Methods 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 229910052735 hafnium Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- 229920002319 Poly(methyl acrylate) Polymers 0.000 description 1
- 229910003069 TeO2 Inorganic materials 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 230000003578 releasing effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000006188 syrup Substances 0.000 description 1
- 235000020357 syrup Nutrition 0.000 description 1
- LAJZODKXOMJMPK-UHFFFAOYSA-N tellurium dioxide Chemical compound O=[Te]=O LAJZODKXOMJMPK-UHFFFAOYSA-N 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B23/00—Record carriers not specific to the method of recording or reproducing; Accessories, e.g. containers, specially adapted for co-operation with the recording or reproducing apparatus ; Intermediate mediums; Apparatus or processes specially adapted for their manufacture
- G11B23/0057—Intermediate mediums, i.e. mediums provided with an information structure not specific to the method of reproducing or duplication such as matrixes for mechanical pressing of an information structure ; record carriers having a relief information structure provided with or included in layers not specific for a single reproducing method; apparatus or processes specially adapted for their manufacture
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Manufacturing Optical Record Carriers (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野〕
この奏発明は光学的情報記録媒体用基板を成形するため
のスタンパに係り、特に全面に渡り連続又は不連続の凸
部が■♀ｔＩル訓二が形成されているスタンパに関する
。[Detailed Description of the Invention] [Technical Field of the Invention] This invention relates to a stamper for molding a substrate for an optical information recording medium, and in particular, a stamper having continuous or discontinuous convex portions over the entire surface. Regarding the stamper in which the second part is formed.
エネルギ例えば光学的情報記録媒体は、安定なトラック
追跡を可能にし、記録密度を高める必要から、媒体を構
成している基板上に光学的に識別可能な連続又は不連続
スパイラル状の凸部ないし凹部を形成していわゆる案内
溝とすることが要請されている。このため例えば連続ス
パイラル状の凸部ないし凹部の形成された原盤をまず製
作し、この原盤から電鋳などの方法でスタン／ぞを製作
し、このスタンパを用いて有機樹脂を射出成形、圧縮成
形又は注型するか、あるいは紫外線硬化樹脂を紫外線硬
化させるかして凸部ないし凹部形状を転写された基板を
形成する。For example, optical information recording media have optically distinguishable continuous or discontinuous spiral protrusions or depressions on the substrate constituting the medium because it is necessary to enable stable track tracking and increase recording density. There is a demand for forming so-called guide grooves. For this purpose, for example, a master stamp with continuous spiral protrusions or depressions is first manufactured, stamps/grooves are manufactured from this master disc by a method such as electroforming, and organic resin is injection molded or compression molded using this stamper. Alternatively, a substrate on which the shape of the convex portions or concave portions is transferred is formed by casting or by curing an ultraviolet curable resin with ultraviolet rays.
このような連続スパイラル状の凸部ないし凹部を備える
スタンパは、普通以下のようにして製作されている。先
ず、ガラスなどからなる平坦な基板上に第一工程でＣｒ
膜を蒸着する。次に第二工程でＣｒ膜上にフォトレジス
トをスピンナなどの方法で塗布する。次に第三工程でフ
ォトレジストの塗布されたガラス基板を回転し、１μｍ
φ程度にしばったレーザビームを所定の送り速度で半径
方向へ移動させ乍ら連続スパイラル状の露光を行なう。A stamper having such continuous spiral convex portions or concave portions is usually manufactured as follows. First, Cr is deposited on a flat substrate made of glass etc. in the first step.
Deposit the film. Next, in a second step, a photoresist is applied onto the Cr film using a spinner or the like. Next, in the third step, the glass substrate coated with photoresist is rotated and
Continuous spiral exposure is performed while a laser beam tied to approximately φ is moved in the radial direction at a predetermined feed rate.
次に第四工程で現像、第五工程でベーキングを行なって
まず原盤を作る。次に電極膜を真空蒸着などの方法で原
盤上に形成し、Ｎ１ｆｉ鋳を行なってから原盤を剥離す
ればＮｉスタンパが得られるのである。Next, the fourth step is development, and the fifth step is baking to create a master disc. Next, an electrode film is formed on the master by a method such as vacuum evaporation, N1fi casting is performed, and the master is peeled off to obtain a Ni stamper.
しかしこのような製法には以下に述べる欠点がある。即
ち基板全面について均一な形状の凸部ないし凹部を形成
することが極めて困難なことである。スタンパ上に形成
すべき凸部形状は、良好なトラック追跡を可能にするた
め、高さが通常用いられる半導体レーザの波長的８００
０Ｘの１／８で１００ＯＸ程度、幅が１μｍ程度である
ことがのぞまれる。一方基板の形状は記録容量を高める
ため、３００ｍ１４φ程度迄のものが必要となる。これ
に対してスピンナによる塗布は、通常１〜２μｍ以上の
膜厚のものに対して用いられる技術であって、３ＱＱｉ
ｍφの全域に厚さ１００ＯＸの均一な塗膜を形成するよ
うなことは極めて困難で部分的に剥離が避けられない。However, such a manufacturing method has the following drawbacks. That is, it is extremely difficult to form uniformly shaped protrusions or depressions over the entire surface of the substrate. In order to enable good track tracking, the height of the convex shape to be formed on the stamper is 800 mm, which corresponds to the wavelength of a commonly used semiconductor laser.
It is desired that the width be 1/8 of 0X, about 100OX, and the width be about 1 μm. On the other hand, the shape of the substrate needs to be up to about 300 m14φ in order to increase the recording capacity. On the other hand, coating with a spinner is a technique usually used for coatings with a thickness of 1 to 2 μm or more, and 3QQi
It is extremely difficult to form a uniform coating film with a thickness of 100 OX over the entire mφ area, and partial peeling is unavoidable.
しかも大気中のホコリが基板にわずかに付着しても重大
な塗布ムラを招く原因となる。また全域に渡って一様に
現像することは極めて困難であり、現像ムラの発生する
ことが避けられない。このような原盤がらＮ１電鋳した
スタンパは原盤の欠点が全て転写されたものしが得るこ
とが出来ない。更に後の工程でスタンパからフォトレジ
ストを剥離する必要があるが、焼付きなどの現象により
スタンパ面に７オトレジストが残有となって付着するこ
とも避けられない。また第一に原盤、第二にこの原盤か
らスタンツクを製作するという点で二工程必要な点でも
改良の餘地をとどめている。Moreover, even a small amount of dust in the atmosphere that adheres to the substrate can cause serious coating unevenness. Furthermore, it is extremely difficult to uniformly develop the entire area, and the occurrence of uneven development is unavoidable. It is impossible to obtain a stamper made by electroforming N1 from such a master disc in which all the defects of the master disc are transferred. Furthermore, it is necessary to peel off the photoresist from the stamper in a later step, but it is unavoidable that the 7 photoresist remains and adheres to the stamper surface due to phenomena such as burn-in. Furthermore, there is still room for improvement in that two steps are required: firstly, the master disc, and secondly, the Stantsuk is made from this master disc.
この発明はこのような従来の方法によることなく形成さ
れ、単純々構成でありながら、均一かつ良好に連続スパ
イラル状凸部Ｍを備えるスタンパを提供することにある
。The object of the present invention is to provide a stamper which is formed without using such a conventional method, has a simple structure, and is provided with uniform and well-continuous spiral convex portions M.
即ちこの発明のスタンパは、基体上に基体との密着性が
よい金属薄膜又は酸化物薄膜の倒れが接着用材からなる
第一層、エネルギー吸収性とガス遊離性とを良好にする
薄膜からなる第二層、且つ第二層に対し密着性が良好な
金属薄膜からなる第三層、樹脂に対する離型性のよい金
属薄膜からなる第四層を順に形成されて成り、且つ第二
乃至第四層膜面には連続又は不連続のスパイラル状の凸
部が形成されているものである。That is, the stamper of the present invention has a first layer made of an adhesive material on which a metal thin film or oxide thin film with good adhesion to the substrate falls, and a second layer made of a thin film that has good energy absorption and gas release properties. Two layers, a third layer made of a metal thin film with good adhesion to the second layer, and a fourth layer made of a metal thin film with good mold releasability from resin are formed in this order, and the second to fourth layers Continuous or discontinuous spiral convex portions are formed on the membrane surface.
第一層の金属薄膜はＴｉ、Ｃｒ１届、Ｍｇ、Ｗ。The first layer of metal thin film is Ti, Cr1, Mg, and W.
ＭＯｌＣｏ、Ｎｉ、Ｆｅ１Ｔａ、 Ｖ、 Ｚｒ、 Ｈｆ
を用い、スパッタリング、真空蒸着など通常の薄膜形
成法で基体に被着させてよい。もし酸化物薄膜を用いる
とすれば例えば８１０２ 、ＴｅＯ２等を適用してよい
。MOlCo, Ni, Fe1Ta, V, Zr, Hf
The film may be deposited on the substrate using a conventional thin film forming method such as sputtering or vacuum deposition. If an oxide thin film is used, for example, 8102, TeO2, etc. may be used.
エネルギー吸収性と同時にガス遊離性とを有する第二層
薄膜は、Ｔｏ、Ｂｉのような６００°Ｃ以下に融点をも
つ金属のターゲットをＣＨ４、ＮＨ３、Ｈ２、ＣＯｌな
どのガスのプラズマでスパッタリングすることにより被
着させてよい。例えばＴｅターゲットヲＣＨ４ガスプラ
ズマでスパッタリングして製作した厚さ４０００ＸのＴ
”５０Ｃ３０Ｈ２０なる成分比の薄膜は、８３００Ｘの
波長に対して４０１／の吸収率をもち、空気中１５０℃
以上に加熱すれば３０％の重量減を伴なうガス放出を行
なう。The second layer thin film, which has both energy absorbing properties and gas releasing properties, is produced by sputtering a metal target such as To or Bi, which has a melting point below 600°C, with plasma of a gas such as CH4, NH3, H2, or COl. It may also be coated. For example, a 4000X thick T made by sputtering a Te target with CH4 gas plasma.
``A thin film with a component ratio of 50C30H20 has an absorption rate of 401/ for a wavelength of 8300X, and is heated to 150℃ in air.
If heated above this level, gas will be released with a weight loss of 30%.
第三層の金属薄膜には、Ｃｒ １Ｔｌ 、 Ｍｏ 、
Ｗ。The third layer metal thin film contains Cr 1Tl, Mo,
W.
Ｆｅ１ Ｃｏ％Ｎｌの少くとも一柚を用いてよい。又第
四層の金属薄膜には、ＡｕｌＡｇ、Ｐｄ、Ｎｉの少くと
も一種を用いてよい。At least one piece of Fe1Co%Nl may be used. In addition, at least one of AulAg, Pd, and Ni may be used for the fourth layer metal thin film.
第一層を形成する目的は、記録媒体用基板成形時及び成
形後にこの基板をスタンパから分離する際、第二層がス
タンパ基体から剥離してスタンパを破壊することを防止
するためである。第一層に望ましい金属薄膜は、ガラス
など基体への密着性があることである。’ｌ’ ｌ １
Ｃ１１ＡＪ！ｔ 、 Ｍｇ ｓ Ｗ １Ｍｏ ｓＣｏ、
Ｎｉ、Ｆｅ、Ｔａ、Ｖ、Ｚｒ、Ｈｆはこの理由から好ま
しい。これらは単独に用いてもよいし、二成分以上の組
合せで用いてもよい。The purpose of forming the first layer is to prevent the second layer from peeling off from the stamper base and destroying the stamper during molding of the recording medium substrate and when separating this substrate from the stamper after molding. A desirable metal thin film for the first layer is one that has adhesion to a substrate such as glass. 'l' l 1
C11AJ! t, MgsW1MosCo,
For this reason, Ni, Fe, Ta, V, Zr, and Hf are preferred. These may be used alone or in combination of two or more components.
第三層を形成する目的は第一に形状の秀れた連続もしく
は不連続スパイラル状の凸部を形成するためであり、第
二に記録媒体用基板成形時に第二層が損傷することを防
止するためである。このような第三層に望ましい金属薄
膜は、第二層への密着性が良く、硬度が高いことである
。Ｃｒ、ＴＩ。The purpose of forming the third layer is firstly to form continuous or discontinuous spiral convex portions with an excellent shape, and secondly to prevent damage to the second layer during molding of the recording medium substrate. This is to do so. A desirable metal thin film for the third layer is one that has good adhesion to the second layer and high hardness. Cr, T.I.
Ｍｏ 、 Ｗ、 Ｃｏ １Ｎｉ １Ｆｅはこの理由から
好ましい。Mo, W, Co 1Ni 1Fe are preferred for this reason.
これらは単独に用いても有効であるが、二成分以上の組
合せで用いてもよい。Although these are effective when used alone, they may be used in combination of two or more components.
第四層を形成する目的はポリメチルアクリレート、ポリ
カーボネイトなど有機樹脂との密着性が小さいものであ
れば用いることができる。特に望ましいものはＡｕ、、
Ａｇ、 Ｐｄである。For the purpose of forming the fourth layer, materials such as polymethyl acrylate and polycarbonate can be used as long as they have low adhesion to organic resins. Particularly desirable are Au,
They are Ag and Pd.
連続又は不連続スパイラル状の凸部は、四種の薄膜の形
成されている基板を回転し、１μｍφ程度にしぼり込ん
だレーザビームを所定の速度で半径方向へ送りながら連
続的もしくは不連続的に照射することにより形成できる
。凸部は、照射されたレーザビームにより局部加熱され
、第二層からガス放出が起υ、このガス圧力が第三層、
第四層に作用して隆起させることで形成される。The continuous or discontinuous spiral convex part rotates the substrate on which the four types of thin films are formed, and continuously or discontinuously sends the laser beam narrowed to about 1 μm diameter in the radial direction at a predetermined speed. It can be formed by irradiation. The convex part is locally heated by the irradiated laser beam, gas is released from the second layer, and this gas pressure increases the temperature of the third layer.
It is formed by acting on the fourth layer and raising it.
このようなスタンパによシ基板を成形するには、スタン
パを構成している基体が破壊しなければ用法を制限しな
い。例えば、あらかじめ成形された平坦な記録媒体用基
板材とこのスタンパを対向させ、両者の中間に紫外線硬
化樹脂を流し込み、平坦な基板材側から紫外縁を照射し
硬化させ連続ス・ξイラル状の凸部を転写した記録媒体
用基板を得させる。又例えばこのスタンノミ上に有機樹
脂のモノマーｈいしシランプを流し込み加熱し重合させ
る注型法をとってもよい。In order to mold a substrate using such a stamper, there are no restrictions on its usage as long as the base forming the stamper is not destroyed. For example, a pre-formed flat substrate for recording media and this stamper are placed opposite each other, an ultraviolet curable resin is poured between the two, and the ultraviolet rays are irradiated from the flat substrate side to harden it, forming a continuous spiral. A recording medium substrate to which the convex portions have been transferred is obtained. Alternatively, for example, a casting method may be used in which an organic resin monomer or syrup is poured onto the stun chisel and heated and polymerized.
以下実施例について述べる。 Examples will be described below.
（１）第１図はこの例のスタンパの生成品断面図である
。まず３００朋φのガラス板を基体（１）とし、厚さ３
００１のＴ ｉ 膜（２）をスパッタリングで形成して
第一層とする。次にＴｅターゲットをＣＨ４ガスとＮＨ
，ガスの混合ガスプラズマでスパッタリングし、厚さ４
０００ＸでＴ”５００３ＯＮ５Ｈ１５の成分比の第二層
（３）を形成する。次に厚さ３００ＸのＣｒ膜（４）を
ス／ぞツタリングで形成し第三層とし、厚さ２００Ｘの
Ａｕ 膜（５）を更にスパッタリングで形成して第四層
とする。これら四種の膜体が形成された基体を回転支持
台（６）にのせ、レンズ（７）で１μｍφ にしぼシこ
んだＡｒガスレーザビーム（８）を、半径方向へ所定の
速度で移動させながら照射する。第２図にこのようにし
て形成されたスタンノソの微小部分の断面図を示す。ス
タンパの膜面には連続ス、ｏイラル状の凸部（９）が形
成されている。凸部形状は高さが０．１μｍ１底部にお
ける幅は１．１μｍである。この凸部は３００朋φのガ
ラス板の全面に及び一様に形成されており、剥離した部
分は認められない。(1) FIG. 1 is a sectional view of the stamper produced in this example. First, a glass plate with a diameter of 300mm is used as the substrate (1), and the thickness is 3mm.
A Ti film (2) of 001 is formed by sputtering to serve as the first layer. Next, the Te target was mixed with CH4 gas and NH
, sputtering with a mixed gas plasma of 4 gases to a thickness of 4
A second layer (3) with a component ratio of T"5003ON5H15 is formed with 000X. Next, a Cr film (4) with a thickness of 300X is formed by sputtering to form the third layer, and an Au film (4) with a thickness of 200X is formed. 5) is further formed by sputtering to form a fourth layer.The substrate on which these four types of films are formed is placed on a rotating support (6), and an Ar gas laser beam is indented to a diameter of 1 μm using a lens (7). (8) is irradiated while moving in the radial direction at a predetermined speed. Figure 2 shows a cross-sectional view of a minute part of the stamper formed in this way. A shaped convex portion (9) is formed.The height of the convex portion is 0.1 μm and the width at the bottom is 1.1 μm.This convex portion extends uniformly over the entire surface of the 300 mm diameter glass plate. formed, and no peeled parts are observed.
このように真空中で薄膜を形成して得られたスタンパの
利点は、フォトレジスト法による原盤から電鋳したスタ
ンパと異なり、基板全面に均一な凸部が形成できる上、
大気中の塵埃のない状態で膜形成できること、大面積に
渡り一様な膜厚に膜形成できることが数えられる。The advantage of a stamper obtained by forming a thin film in a vacuum is that, unlike a stamper that is electroformed from a master using the photoresist method, it can form uniform protrusions over the entire surface of the substrate.
The film can be formed in the absence of dust in the atmosphere, and the film can be formed to a uniform thickness over a large area.
この例のスタンパを用い、平坦なアクリル板上へアクリ
ル系紫外線硬化樹脂による転写を行なったところ記録媒
体用基板の全面に極めて一様な連続スパイラル状の凹部
を転写することができ、スタンパからはどの薄膜も剥離
しない。When the stamper of this example was used to transfer the acrylic ultraviolet curable resin onto a flat acrylic plate, extremely uniform continuous spiral recesses were transferred over the entire surface of the recording medium substrate, and the stamper No thin film will peel off.
（２）３００ｍｉφのガラス板に第一層として夫々厚さ
３００ＸのＣｒ、ＡＪ、Ｍｇ 、 Ｗ ＳＭｏ、Ｃ０１
Ｎｉ 、 Ｆｅ １’ｌ”ａ、Ｖ、Ｚｒ１Ｈｆ膜を形成
し、第二層としていずれも岸さ３８００ＸのＴｅ５ｏＣ
５ｏＨ２ｏの成分比の薄膜を形成し、第三層として厚さ
３００ＸのＣｒ膜を形成し、第四層として厚さ２００Ｘ
のＡｇ膜を形成する。次に前記実施例と同様にして連続
レーザ露光を行ない１２種のスタンパを製作する。(2) Cr, AJ, Mg, W SMo, C01 each having a thickness of 300X as the first layer on a 300 miφ glass plate
Ni, Fe 1'l"a, V, Zr1Hf films were formed, and Te5oC with a surface diameter of 3800X was formed as the second layer.
Form a thin film with a component ratio of 5oH2o, form a Cr film with a thickness of 300X as the third layer, and form a Cr film with a thickness of 200X as the fourth layer.
Form an Ag film. Next, continuous laser exposure is performed in the same manner as in the previous embodiment to produce 12 types of stampers.
いずれのスタンパ々も前記スタンパと同様に幅０．９〜
１．２μｍ１高さ０．７μｍ以上の連続スパイラル状凸
部を備えている。Each stamper has a width of 0.9~
It has continuous spiral convex portions of 1.2 μm and 0.7 μm or more in height.
（３） ３００ ｉｏｉφのガラス板に第一層として
厚さ３００ＸのＴＩ膜を形成し、第二層として厚さ４０
００芙のＴｅ４５Ｃ５［］Ｈ２Ｏ０５の成分比の薄膜を
形成し、第三層として夫々Ｔ１、Ｍｏ、ＷｌＦｅ、 ｃ
ｏ、Ｎｉ膜を厚さ３００１形成し、第四層として厚さ３
００ＸのＰｄ膜を形成する。次に前記実施例と同様にし
て不連続レーザ無光を行ない大棟のスタンパを製作する
。いずれのスタンパも幅０．９〜１．２μｍ１高さ０．
６μｍ以上の不連続スパイラル状凸部を備えている。(3) A TI film with a thickness of 300X was formed as the first layer on a glass plate of 300 ioiφ, and a TI film with a thickness of 40X was formed as the second layer.
A thin film with a component ratio of Te45C5[]H2O05 of
o, a Ni film is formed with a thickness of 3001 mm, and a thickness of 300 mm is formed as the fourth layer.
00X Pd film is formed. Next, in the same manner as in the previous embodiment, a large ridge stamper is manufactured by performing discontinuous laser non-emission. Each stamper has a width of 0.9 to 1.2 μm and a height of 0.9 μm.
It has discontinuous spiral convex portions of 6 μm or more.
この例のスタン７ξを用い、注型法により基板の成形を
行なったところ、良好な形状の連続スパイラル状凹部を
転写できた。When a substrate was molded by a casting method using Stan 7ξ of this example, continuous spiral recesses of good shape could be transferred.
各側のスタンパは、通常の電鋳法によるスタンパのマス
ター原盤としても使用出来る。また、マスタースタンパ
とフザースタンパとの剥離性を向上させるために第四層
上に更にポリテトラフルオロエチレン膜を第五層として
スパツタリングして形成してもよろしい。The stampers on each side can also be used as master discs for stampers using the normal electroforming method. Further, in order to improve the peelability between the master stamper and the fuser stamper, a polytetrafluoroethylene film may be further formed as a fifth layer on the fourth layer by sputtering.
尚不連続スパイラル状の凸部を形成されたスタンパはビ
デオディスクのような読出し専用タイプの情報記録媒体
用基板を製造するために使用される。A stamper having discontinuous spiral convex portions is used for manufacturing a substrate for a read-only type information recording medium such as a video disk.
このようなこの発明によれば、従来の欠点を除去し、単
純な構成でありながら、大面積に＃、シ極めて一様な連
続又は不連続スパイラル状の凸部を備えた基板成形用ス
タンパとして提供することができる。According to the present invention, the conventional drawbacks are eliminated, and although the structure is simple, it is possible to use a stamper for molding a substrate having extremely uniform continuous or discontinuous spiral convex portions over a large area. can be provided.
第１図は本発明のスタンパの生成品断面図、第２図はこ
の発明のスタンパを微小部分について示す断面図である
。
１・・・基体
２・・・基体への密着性のよい金属薄膜又は酸化物薄膜
（第一層）
３・・・エネルギー吸収性とガス遊離性とを良好にする
薄膜（第二層）
４・・・機械的強度の大きく密着性のよい金属薄膜（第
三層）
５・・・離型性のよい薄膜（第四層）
６・・・回転支持台
７・・・レンズ
８・・・レーザビーム
９・・・形成された連続スパイラル状凸部代理人 弁理
士 井 上 −男
第 １ 図
第２図FIG. 1 is a cross-sectional view of a product of the stamper of the present invention, and FIG. 2 is a cross-sectional view of a minute portion of the stamper of the present invention. 1... Substrate 2... Metal thin film or oxide thin film with good adhesion to the substrate (first layer) 3... Thin film with good energy absorption and gas release properties (second layer) 4 ...Metal thin film with high mechanical strength and good adhesion (third layer) 5...Thin film with good mold releasability (fourth layer) 6... Rotating support base 7... Lens 8... Laser beam 9... Continuous spiral convex portion formed Patent attorney Inoue - Male Figure 1 Figure 2
Claims (5)
のスタンパであって、このスタンパが基体上に基体との
密着性のよい金属薄膜又は酸化物薄膜の何れか接着用材
からなる第一層、エネルギー吸収性とガス遊離性とを良
好にする薄膜からなる第二層、硬度が高く且つ第二層に
対する密着性が良好な金属薄膜からなる第三層、樹脂に
対する離型性のよい金属薄膜からなる第四層を順に形成
されて成り、且つ第二乃至第四層膜面にはレーザ露光に
より連続又は不連続我パイラル状の凸部が形成されてい
ることを特徴とする基板成形用スタンパ。(1) A stamper for forming a substrate for an energy information recording medium, in which the first layer is formed of an adhesive material such as a metal thin film or an oxide thin film that has good adhesion to the substrate; A second layer consisting of a thin film that has good absorption and gas release properties, a third layer consisting of a thin metal film that has high hardness and good adhesion to the second layer, and a thin metal film that has good mold releasability from resin. 1. A stamper for forming a substrate, characterized in that a fourth layer is sequentially formed, and continuous or discontinuous spiral convex portions are formed on the film surfaces of the second to fourth layers by laser exposure.
Ｊｋ Ｎ Ｍｇ ％ Ｗ 。 Ｍｏ１ Ｃｏ、Ｎｉ、Ｆｅ、Ｔａ、Ｖ、Ｚｒ１ Ｈｆの
少くとも一種であることを特徴とする特許請求の範囲第
（１）項に記載の基板成形用スタンパ。(2) The first layer metal thin film is Ti, Cr, A
Jk N Mg % W . The stamper for forming a substrate according to claim 1, wherein the stamper is at least one of Mo1 Co, Ni, Fe, Ta, V, and Zr1 Hf.
ＣＳＨ，Ｎ、Ｏの少くとも一種からなるガス成分とから
なることを特徴とする特許請求の範囲第（１２項に記載
の基板成形用スタンパ。(3) The second layer is composed of a metal component having a melting point of 600°C or less and a gas component consisting of at least one of CSH, N, and O. Stamper for substrate molding.
、Ｗ。 Ｆｅ １Ｃｏ １Ｎｉの少くとも一種であることを特徴
とする特許請求の範囲第（１）項に記載の基板成形用ス
タンパ。(4) The third layer metal thin film is Cr, Ti 1Mo
,W. The stamper for molding a substrate according to claim (1), characterized in that the stamper is at least one type of Fe 1Co 1Ni.
ｉの少くとも一種であることを特徴とする特許請求の範
囲第（り項に記載の基板成形用スタンパ。(5) The fourth layer metal thin film is Au, Ag, Pd, N
A stamper for forming a substrate according to claim 1, characterized in that the stamper is at least one of i.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16862382A JPS5958640A (en) | 1982-09-29 | 1982-09-29 | Substrate forming stamper |
| EP83305768A EP0107913B1 (en) | 1982-09-29 | 1983-09-27 | Radiation-sensitive carrier body utilized as stamper structure |
| DE8383305768T DE3377173D1 (en) | 1982-09-29 | 1983-09-27 | Radiation-sensitive carrier body utilized as stamper structure |
| US06/630,232 US4565772A (en) | 1982-09-29 | 1984-07-12 | Process of using radiation-sensitive carrier body to form stamper structure and subsequent use as a stamper to make optical disks |
| US06/939,292 US4845000A (en) | 1982-09-29 | 1986-12-04 | Radiation sensitive carrier body utilized as stamper structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16862382A JPS5958640A (en) | 1982-09-29 | 1982-09-29 | Substrate forming stamper |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5958640A true JPS5958640A (en) | 1984-04-04 |
| JPH0252331B2 JPH0252331B2 (en) | 1990-11-13 |
Family
ID=15871486
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16862382A Granted JPS5958640A (en) | 1982-09-29 | 1982-09-29 | Substrate forming stamper |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5958640A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007502511A (en) * | 2003-05-21 | 2007-02-08 | サムスン エレクトロニクス カンパニー リミテッド | MULTILAYER STRUCTURE AND METHOD FOR DRAWING MICROSTRUCTURE ON THIS STRUCTURE |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5665340A (en) * | 1979-10-17 | 1981-06-03 | Rca Corp | Recordinggmedium for optical recording and regeneration |
| JPS56124135A (en) * | 1980-02-01 | 1981-09-29 | Thomson Csf | Thermal optical writing permanent memory structure and optically reading and writing method |
-
1982
- 1982-09-29 JP JP16862382A patent/JPS5958640A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5665340A (en) * | 1979-10-17 | 1981-06-03 | Rca Corp | Recordinggmedium for optical recording and regeneration |
| JPS56124135A (en) * | 1980-02-01 | 1981-09-29 | Thomson Csf | Thermal optical writing permanent memory structure and optically reading and writing method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007502511A (en) * | 2003-05-21 | 2007-02-08 | サムスン エレクトロニクス カンパニー リミテッド | MULTILAYER STRUCTURE AND METHOD FOR DRAWING MICROSTRUCTURE ON THIS STRUCTURE |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0252331B2 (en) | 1990-11-13 |
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