JPS5948932A - Resin molding method for hybrid integrated circuit - Google Patents

Abstract

PURPOSE:To obtain a positive mold by attaching a powdered resin on a discrete part with a lead wire and a substrate under the state in which the part is erected on the substrate and curing the resin through heating when the part is set up to the IC substrate and molded with the resin. CONSTITUTION:When the discrete part 5 with the lead wire such as a capacitor is fitted onto the substrate 3 for the IC, the part 5 is set up under the state in which it is erected on the substrate 3. The powdered resin 11 is attached on both the surface and back of the substrate 3 while surrounding the part 5 through a fluidized-bed immersion method, and heated to cure the resin 11. Accordingly, since there is no narrow clearance between the part 5 and the substrate 3, the resin can be attached sufficiently on both surfaces of the part 5 and the surface of the substrate 3, and the end section of the IC is not exposed due to an edge irregularity.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a resin molding method for a hybrid IC (hybrid integrated circuit), and proposes a complete method that can reliably mold.

Discrete components such as capacitors with lead wires are made by placing chip-shaped semiconductors on a substrate with conductor layers and resistors formed on them! The installed hybrid IC is usually
To protect it, it is molded with synthetic resin. That is, FIG. 1a) shows a vertical cross section of a resin-molded hybrid IC, and +1 C 21 indicates the conductor layer and resistor layer formed on the substrate (31), respectively.
(4) is a chip-shaped semiconductor element whose electrodes at both ends are connected to the conductor layer, (5) is a capacitor whose lead wires are soldered (6) to the conductor layer, and (7) is a lead frame. , these are integrally molded with n-boxy resin (8).

One method of such resin molding is as follows. That is, as shown in FIG.
It is stirred by the air flow 00) that flows through the air filter UV from the Y air suction hole 03.

In this tank (9) C: @ I (J2v) with discrete components attached as described above. By preheating and immersing the IC, the powdered resin is melted and adhered to the surface of the IC, which is taken out and placed in the air. This is a method of curing the adhered resin by heating at around 150° C. for several hours. In the same figure, reference numeral 1151 is a jig for taking the target IC+13 into and out of the immersion tank +97.

By the way, in the past, discrete components with lead wires such as capacitors (5) soldered to the IC board (1) as described in Ar1 have been soldered to the resin mold yxqT width. Substrate+, 31 as in Figure 1aJ
-14: After approaching the surface, ζ62
Powdery resin was applied by the method shown in the figure, and then heated and cured. For this 1st part, the part like the back side of Condens i51 (AJ is difficult to get powdered resin, so this part IAI resin mold is sure to be done). Capacitor (5)
There was a problem in which the edges of the resin mold were disturbed at the IC end of the Kl) where it was attached, resulting in two boards being exposed as shown in Fig. 1b+6. (Irg released. In other words, in the invention First, install this part (5) in an upright position on the board, and then apply powdered resin (111 to f1) using the fluidized dipping method shown in Figure 2.
Let them wear it. After that, the above part (5) is shaped into the state shown in the figure so that its surface is in close contact with the surface of the substrate (31), and finally heated as described above. It hardens like a mountain.

In this way, as is clear from Section 1, Figure 3, 1al [b], the discrete component (5) and the board]: J
) Since there is no narrow gap between this part (51
Since the powdered resin can be sufficiently attached to the surface of the double-sided engineered substrate (3), the state after molding is the same as the first one.
As shown in FIG. 4, which uses the same figure number as FIG. 1a+, the back side of the part 15) can be sufficiently molded, and
This means that the 4M resin mold 11 is not disturbed and the substrate is not exposed at the 1'C end.

As shown below, the resin molding method of the present invention [according to I
It is suitable as a hybrid C molding method because it can reliably mold discrete components with lead wires attached to the C board and the board.

[Brief explanation of the drawing]

Fig. 1 (1aJlb) is a vertical sectional view and external plan view of a hybrid IC molded with resin according to the conventional method, Fig. 2 (1) is a diagram showing the coating process of powder powder resin, and Fig. 3
1A to 1C1 are diagrams for explaining each step of the molding method of the present invention, and FIG. 5): Discrete component with lead wire, +131: Resin mold layer,
+111: Powdered resin applicant Sanyo Electric Co., Ltd., Pa.

Claims (1)

[Claims] (1) Discrete components with lead wires) IIC
This is a method of resin molding a hybrid C mounted on a board, the above-mentioned discrete components being mounted on the board.
2. Apply powdered resin to the discrete component and the board while standing upright, and then attach the discrete component!
A method for resin molding a hybrid IC, characterized in that the resin is cured by heating while in close contact with a substrate.