JPS5943118B2 - Heat dissipation mounting structure of repeater electrical circuit - Google Patents
Heat dissipation mounting structure of repeater electrical circuitInfo
- Publication number
- JPS5943118B2 JPS5943118B2 JP13146780A JP13146780A JPS5943118B2 JP S5943118 B2 JPS5943118 B2 JP S5943118B2 JP 13146780 A JP13146780 A JP 13146780A JP 13146780 A JP13146780 A JP 13146780A JP S5943118 B2 JPS5943118 B2 JP S5943118B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- heat dissipation
- repeater
- mounting structure
- electrical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
【発明の詳細な説明】
本発明は中継器の電気回路で発生した熱を効率よく放熱
させる中継器電気回路ユニットの放熱実装構造に関する
。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a heat dissipation mounting structure for a repeater electrical circuit unit that efficiently dissipates heat generated in the electrical circuit of the repeater.
第１図Ａ、Ｂは従来の中継器電気回路およびその具体的
実装構造を示す。FIGS. 1A and 1B show a conventional repeater electrical circuit and its specific mounting structure.
内部筐体シリンダ１内には内部筐体端板１ａ間に金属支
持板２が橋架されてねじ固定されている。金属支持板２
の両端にその両端が直接固定される回路基板３の表面に
は、。電気部品４が実装されるとともに裏面には、回路
基板３の電極５と電気部品４のリード゛線４ａの接続部
６とが存在する。回路基板３および金属支持板２間でこ
れらの中央部には電気絶縁のために空間が設けられる。
回路基板３は金属支持板２に押えばねＴで固定される。
このような構造において、内部筐体シリンダ１が密封さ
れる等のため内部発熱に対する処理が問題となるのであ
るが、この放熱に着目してみると第１図Ｂに示す矢印の
放熱径路を辿る。Inside the internal housing cylinder 1, a metal support plate 2 is bridged between internal housing end plates 1a and fixed with screws. Metal support plate 2
On the surface of the circuit board 3, both ends of which are directly fixed to both ends of the. The electrical component 4 is mounted, and the electrode 5 of the circuit board 3 and the connecting portion 6 of the lead wire 4a of the electrical component 4 are present on the back surface. A space is provided in the center between the circuit board 3 and the metal support plate 2 for electrical insulation.
The circuit board 3 is fixed to the metal support plate 2 by pressing springs T.
In such a structure, treatment of internal heat generation becomes a problem because the internal housing cylinder 1 is sealed, etc., but if we focus on this heat radiation, it follows the heat radiation path shown by the arrow in Figure 1B. .
すなわち、電気部品４にて発生した熱は回路基板３、回
路基板３の両端から金属支持板２、そして内部筐体端板
１ａの順に伝導する。また、従来回路基板３としてアル
ミナ３ａの表面にガラス膜３ｂを塗布したクレーストア
ルミナを用いており、ガラス膜３ｂの熱伝導性がアルミ
ナ３ａのものよりー桁低いため、この従来の回路基板３
はたとえば次表に示すようにアルミナ基板等に比較して
熱伝導性が非常に悪い。表
この結果、従来では回路基板３と金属支持板２との放熱
径路が狭く、すなわち回路基板３と金属支持板２との間
に空間を有し、更には低熱伝導性の回路基板３を使用す
るために、二重に熱抵抗を大きくしており、電気部品４
から内部筐体端板１ａに至る熱抵抗が甚だしく大きくな
つて電気部品４の温度が上昇し、中継器の信頼性や電気
部品の特性安定性の劣化が問題であつた。That is, the heat generated in the electrical component 4 is conducted in this order from the circuit board 3, both ends of the circuit board 3, to the metal support plate 2, and then to the internal housing end plate 1a. In addition, as the conventional circuit board 3, cleasted alumina is used, in which a glass film 3b is coated on the surface of alumina 3a, and the thermal conductivity of the glass film 3b is an order of magnitude lower than that of the alumina 3a.
For example, as shown in the following table, the thermal conductivity is very poor compared to alumina substrates. Table As a result, in the past, the heat dissipation path between the circuit board 3 and the metal support plate 2 was narrow, that is, there was a space between the circuit board 3 and the metal support plate 2, and a circuit board 3 with low thermal conductivity was used. In order to
Thermal resistance from the to the end plate 1a of the internal casing becomes extremely large, and the temperature of the electrical components 4 rises, causing a problem of deterioration of the reliability of the repeater and the characteristic stability of the electrical components.
そこで、本発明は上述の欠点に鑑み、放熱効率を向上さ
せて中継器の信頼性および電気部品の特性安定性を向上
させた中継器電気回路の放熱実装構造の提供を目的とす
る。SUMMARY OF THE INVENTION In view of the above-mentioned drawbacks, the present invention aims to provide a heat dissipation mounting structure for a repeater electrical circuit, which improves heat dissipation efficiency, improves the reliability of the repeater, and improves the characteristic stability of the electrical components.
かかる目的を達成するため本発明の構造は、中継器電気
回路ユニツトにおいて、電気部品が表面に実装された高
熱伝導性電気絶縁材料よりなる回路基板の裏面とこの回
路基板を両端で支持する金属支持板との空間に電気絶縁
材料を充填したことを特徴とする。In order to achieve this object, the structure of the present invention is such that, in a repeater electric circuit unit, the back surface of a circuit board made of a highly thermally conductive electrical insulating material on which electrical components are mounted, and the metal support that supports this circuit board at both ends. It is characterized by filling the space between it and the plate with an electrically insulating material.
ここで、第２図Ａ，Ｂにより本発明の実施例を説明する
。An embodiment of the present invention will now be described with reference to FIGS. 2A and 2B.
第２図Ａ，Ｂ中第１図Ａ，Ｂと同一部分に同符号を付す
。金属支持板２の両端に直接固定される回路基板３はベ
リリア、アルミナなどの高熱伝導性電気絶縁材料からな
る。したがつて、電気部品４からの発熱は実装面である
回路基板３の表面および回路基板３自体にたやすく伝導
する。このため、回路基板３から金属支持板２への熱抵
抗は大幅に低くなる。また、電気絶縁のための回路基板
３と金属支持板２との間の空間には、ポリエチレン、ゴ
ム等の電気絶縁材料を充填した電気絶縁層８が形成され
ている。このため、回路基板３と金属支持板２とは接触
面が広くなつたのと等価で極めて低熱抵抗にてつながり
、回路基板３、電気絶縁層８、そして金属支持板２とい
う具合に放熱径路が形成される。ここで、第３図にて第
１図Ａ，Ｂに示す実装構造と本発明の一具体例との放熱
特性の比較を示す。The same parts in FIGS. 2A and B as in FIGS. 1A and B are given the same reference numerals. The circuit board 3 directly fixed to both ends of the metal support plate 2 is made of a highly thermally conductive electrically insulating material such as beryllia or alumina. Therefore, heat generated from the electrical component 4 is easily conducted to the surface of the circuit board 3, which is the mounting surface, and to the circuit board 3 itself. Therefore, the thermal resistance from the circuit board 3 to the metal support plate 2 is significantly lowered. Further, an electrically insulating layer 8 filled with an electrically insulating material such as polyethylene or rubber is formed in the space between the circuit board 3 and the metal support plate 2 for electrical insulation. Therefore, the circuit board 3 and the metal support plate 2 are connected with extremely low thermal resistance, which is equivalent to a wider contact surface, and a heat dissipation path is established between the circuit board 3, the electrical insulating layer 8, and the metal support plate 2. It is formed. Here, FIG. 3 shows a comparison of the heat dissipation characteristics between the mounting structure shown in FIGS. 1A and 1B and one specific example of the present invention.
回路基板３にアルミナを用い空間（１ｍｍ厚さ）にポリ
エチレン又はアルミ粉未配合ゴムの電気絶縁層８を配置
した場合で、電気部品４として半導体レーザを用いる。
内部筐体シリンダ１の内面温度を基準として半導体レー
ザステムまでの温度を測定する。なお、従来構造におい
て空間にはへリウムガスを入れる。この結果、実線で示
す従来構造に比較して破線で示す本実施例構造では、半
導体レーザステムの温度上昇量を約３０％も大幅に低減
できることが判明した。以上実施例にて説明したように
本発明によれば、電気部品による発熱を、高熱伝導性の
回路基板と電気絶縁層とで金属支持板に非常に効率良く
伝えることができ、内部筐体端板に放熱したことにより
、中継器の信頼性を向上できるとともに電気部品の特性
安定化を図ることができた。In this case, the circuit board 3 is made of alumina, and the electrical insulating layer 8 made of polyethylene or rubber without aluminum powder is arranged in the space (1 mm thick), and a semiconductor laser is used as the electrical component 4.
The temperature up to the semiconductor laser stem is measured based on the inner surface temperature of the internal housing cylinder 1. Note that in the conventional structure, helium gas is introduced into the space. As a result, it was found that the structure of this embodiment shown by the broken line can significantly reduce the temperature rise of the semiconductor laser stem by about 30% compared to the conventional structure shown by the solid line. As explained above in the embodiments, according to the present invention, heat generated by electrical components can be transmitted very efficiently to the metal support plate using the highly thermally conductive circuit board and the electrical insulating layer, and By dissipating heat through the plates, we were able to improve the reliability of the repeater and stabilize the characteristics of the electrical components.
第１図Ａ，Ｂは従来の中継電気回路の放熱実装構造の一
例で、Ａは断面図、ＢはＡの部分拡大断面図、第２図Ａ
，Ｂは本発明による中継器電気回路の放熱実装構造の一
実施例で、Ａは断面図、ＢはＡの部分拡大断面図、第３
図は従来構造と本発明の実施例構造とを比較した放熱特
性線図である。Figures 1A and 1B are examples of the heat dissipation mounting structure of a conventional relay electric circuit, where A is a sectional view, B is a partially enlarged sectional view of A, and Figure 2A
, B are one embodiment of the heat dissipation mounting structure of the repeater electric circuit according to the present invention, A is a sectional view, B is a partially enlarged sectional view of A, and the third
The figure is a heat dissipation characteristic diagram comparing a conventional structure and an embodiment structure of the present invention.
Claims (1)
に実装された高熱伝導性電気絶縁材料よりなる回路基板
の裏面とこの回路基板を両端で支持する金属支持板との
空間に電気絶縁材料を充填したことを特徴とする中継器
電気回路の放熱実装構造。1. In a repeater electrical circuit unit, an electrical insulating material is filled in the space between the back side of a circuit board made of a highly thermally conductive electrical insulating material on which electrical components are mounted and the metal support plate that supports this circuit board at both ends. A heat dissipation mounting structure for a repeater electric circuit characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13146780A JPS5943118B2 (en) | 1980-09-24 | 1980-09-24 | Heat dissipation mounting structure of repeater electrical circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13146780A JPS5943118B2 (en) | 1980-09-24 | 1980-09-24 | Heat dissipation mounting structure of repeater electrical circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5757000A JPS5757000A (en) | 1982-04-05 |
| JPS5943118B2 true JPS5943118B2 (en) | 1984-10-19 |
Family
ID=15058636
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13146780A Expired JPS5943118B2 (en) | 1980-09-24 | 1980-09-24 | Heat dissipation mounting structure of repeater electrical circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5943118B2 (en) |
-
1980
- 1980-09-24 JP JP13146780A patent/JPS5943118B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5757000A (en) | 1982-04-05 |
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