JPS5942039U - 半導体部品の組立装置 - Google Patents

半導体部品の組立装置

Info

Publication number
JPS5942039U
JPS5942039U JP13731882U JP13731882U JPS5942039U JP S5942039 U JPS5942039 U JP S5942039U JP 13731882 U JP13731882 U JP 13731882U JP 13731882 U JP13731882 U JP 13731882U JP S5942039 U JPS5942039 U JP S5942039U
Authority
JP
Japan
Prior art keywords
semiconductor parts
pellet
assembly equipment
section
parts assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13731882U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0343718Y2 (cg-RX-API-DMAC7.html
Inventor
柳原　臣吾
山口　耕二
白山　正海
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP13731882U priority Critical patent/JPS5942039U/ja
Publication of JPS5942039U publication Critical patent/JPS5942039U/ja
Application granted granted Critical
Publication of JPH0343718Y2 publication Critical patent/JPH0343718Y2/ja
Granted legal-status Critical Current

Links

JP13731882U 1982-09-10 1982-09-10 半導体部品の組立装置 Granted JPS5942039U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13731882U JPS5942039U (ja) 1982-09-10 1982-09-10 半導体部品の組立装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13731882U JPS5942039U (ja) 1982-09-10 1982-09-10 半導体部品の組立装置

Publications (2)

Publication Number Publication Date
JPS5942039U true JPS5942039U (ja) 1984-03-17
JPH0343718Y2 JPH0343718Y2 (cg-RX-API-DMAC7.html) 1991-09-12

Family

ID=30308474

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13731882U Granted JPS5942039U (ja) 1982-09-10 1982-09-10 半導体部品の組立装置

Country Status (1)

Country Link
JP (1) JPS5942039U (cg-RX-API-DMAC7.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6384135A (ja) * 1986-09-29 1988-04-14 Tokyo Electron Ltd プロ−バにおけるウエハのθ調整方法
JPH01167236U (cg-RX-API-DMAC7.html) * 1988-05-14 1989-11-24

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51131274A (en) * 1975-05-10 1976-11-15 Fujitsu Ltd Tip bonding method
JPS5489474A (en) * 1977-12-08 1979-07-16 Gen Signal Corp Method of and device for arraying route of semiconductor wafers

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51131274A (en) * 1975-05-10 1976-11-15 Fujitsu Ltd Tip bonding method
JPS5489474A (en) * 1977-12-08 1979-07-16 Gen Signal Corp Method of and device for arraying route of semiconductor wafers

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6384135A (ja) * 1986-09-29 1988-04-14 Tokyo Electron Ltd プロ−バにおけるウエハのθ調整方法
JPH01167236U (cg-RX-API-DMAC7.html) * 1988-05-14 1989-11-24

Also Published As

Publication number Publication date
JPH0343718Y2 (cg-RX-API-DMAC7.html) 1991-09-12

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