JPS5941850A - Wafer chip feeding device - Google Patents

Abstract

PURPOSE:To make it possible to feed many kinds of wafer chips having different sizes, by selecting a sucking pin, which sucks the wafer chip and a pushing pin, which pushed up the wafer chip. CONSTITUTION:In correspondence with the size of a wafer chip 10 to be picked up, a sucking pin 13 and a pushing pin 16 are selected based on the instruction of a computer. By the driving of a cam, the sucking pin 13 is directed to the wafer chip 10 from the upper side and the pushing pin 16 is directed from the lower side. The wafer chip 10 is pushed by the pushing pin 16 and sucked by the vacuum sucking through a hole 13a of the sucking pin 13. Then only one wafer chip 10 is separated from a tacky tape 8. When the wafer chip 10 is lifted to a certain height, the pushing pin 16 is stopped, and the wafer chip 10 is held only by the sucking pin 13. The wafer chip 10 is moved to the upper part of a positioning table by the movement of a sucking pin slider. The pushing pin 16 is returned to the lower side. Finally, the wafer chip 10 is fed on the positioning table by the sucking pin 13.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an apparatus for supplying wafer chips of various types and sizes.

Structure of the Conventional Example and Current Issues Since the conventional wafer chip supply apparatus is designed to handle one type of chip, the supply of chips of various types and different sizes has become extremely complicated.

OBJECTS OF THE INVENTION In view of the above-mentioned drawbacks, the present invention provides a wafer chip supplying apparatus capable of supplying a wide variety of wafer chips of different sizes.

Structure of the Invention In order to achieve the above object, the present invention has a structure in which a suction bottle that attracts the wafer chip and a push-up bottle that pushes up the wafer chip are selected depending on the size of the wafer chip attached to the adhesive tape. be.

By changing the suction force by selecting a suction bottle and changing the push-up height by selecting a push-up bottle, it is possible to peel off various kinds of chips of different sizes from the adhesive tape one by one and supply them to a predetermined position.

DESCRIPTION OF EMBODIMENTS A wafer chip supply apparatus according to an embodiment of the present invention will be described below with reference to the drawings.

In FIG. 1, reference numeral 1 denotes an apparatus main body fixed to a base 2, and an upper part 12L of the apparatus main body 1 can be horizontally moved by an X-axis table 3 and a Y-axis table 4. A turntable 6 is attached to the upper part 1a of the apparatus main body 1, and wafer rings θ, 7 are attached above the turntable 6.

An adhesive tape 8 is stretched between the wafer rings 6 and 7 with its periphery sandwiched between the wafer rings 6 and 7, and Ueno 9 is pasted onto the adhesive tape 8.

The wafer 9 is made up of a plurality of wafer chips 1o, and above the wafer 9, a suction bin slider 11 is positioned so as to be slidable in the horizontal direction on the upper part 1a of the apparatus main body 1. At the lower end of the suction pin slider 11, suction pins 12 and 13 of different sizes, which are vertically slidable and have different suction forces, are provided.

Also, below the turntable 6 is a suction bottle slider 1.
1, a push-up pin slider 14 movable in the horizontal direction is located. At the upper end of the push-up pin slider 14, there is a push-up pin 15 that slides in the vertical direction.
．． Tension rings 17 and 18 are provided above the push-up pin slider 14 in a vertically movable state.

Note that the suction bottle slider 11 and the push-up pin slider 14
means that when peeling 1° of wafer chip from adhesive tape 8,
It operates so that the push-up pins 15.16 are positioned directly below the suction pins 12.13. The numeral 19 is a positioning table where the wafer chip 1o is placed.

Next, according to Fig. 2 (al to (d)),
The operation of the chip supply device will be explained.

As shown in FIG. 2 (2L), the suction pin 13 and the push-up pin 1 are adjusted according to the computer instructions inputted in advance according to the size of the wafer chip 1° to be taken out.
6 is selected. Then, by driving a cam (not shown), the suction pin 13 from the top surface and the push-up pin 16 from the bottom surface move toward the wafer chip 1°. At this time, the tension ring 18 applies tension to the adhesive tape 8, and the portion of the adhesive tape 8 to which the sea urchin chip 1o is attached is strongly stretched.

Next, as shown in FIG.
One liter of Ueno is sucked up by vacuum suction.
Only the chip 10 is peeled off from the adhesive tape 8.

As shown in FIG. 2 (C1), when the wafer chip 10 rises to a certain extent, the push-up pins 16 stop and the wafer chip 10 is held only by the suction pins 13.

Then, as shown in FIG. 2 (dJ), as the suction bottle slider 11 of FIG. The wafer chip 10 is supplied to a positioning table 19.

The push-up pins 15 and 16 have different diameters and different push-up heights, and are appropriately selected depending on the size of the wafer chip 10.

In addition, in the operation of FIG.
Depending on the size of the suction pin 12. Push-up pin 16
It goes without saying that these are selected and have similar operations and effects.

Effects of the Invention As described above, the present invention is configured to peel wafer chips from an adhesive tape using suction pins with different suction powers or sizes and push-up pins with different push-up heights or sizes. Wafer chips of different sizes can be reliably peeled off one by one from the adhesive tape and supplied to a predetermined location.

[Brief explanation of the drawing]

FIG. 2 is a cross-sectional view of the main parts of the device, showing the operation of the device. 6.7...Wafer ring, 8...Adhesive tape, 9...Wafer, 10...Wafer ring 7', 12.13... ...Suction pin, 15
．． 16... Push-up pin.

Claims (1)

[Claims] A wafer ring that supports the adhesive tape with sea urchins attached on its periphery, and multiple suction bottles located above or below the wafer ring that can move in the horizontal and vertical directions with different suction forces or sizes. and a plurality of push-up bins that are positioned on the opposite side of the suction bin while holding the adhesive tape and are movable in the horizontal and vertical directions with different pushing distances or sizes, and the push-up bins are movable in the horizontal and vertical directions to match the wafer chips of the wafer. A wafer chip supply device in which the suction bin and the push-up bin are selected by using the suction bin and the push-up bin.