JPS5939467A - クリ−ム状半田塗布装置 - Google Patents

クリ−ム状半田塗布装置

Info

Publication number
JPS5939467A
JPS5939467A JP57151607A JP15160782A JPS5939467A JP S5939467 A JPS5939467 A JP S5939467A JP 57151607 A JP57151607 A JP 57151607A JP 15160782 A JP15160782 A JP 15160782A JP S5939467 A JPS5939467 A JP S5939467A
Authority
JP
Japan
Prior art keywords
solder
turntable
creamy
work
creamy solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57151607A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6258823B2 (enExample
Inventor
Minoru Koike
子池　稔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Machinery Inc
Original Assignee
Nichiden Machinery Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichiden Machinery Ltd filed Critical Nichiden Machinery Ltd
Priority to JP57151607A priority Critical patent/JPS5939467A/ja
Publication of JPS5939467A publication Critical patent/JPS5939467A/ja
Publication of JPS6258823B2 publication Critical patent/JPS6258823B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP57151607A 1982-08-30 1982-08-30 クリ−ム状半田塗布装置 Granted JPS5939467A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57151607A JPS5939467A (ja) 1982-08-30 1982-08-30 クリ−ム状半田塗布装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57151607A JPS5939467A (ja) 1982-08-30 1982-08-30 クリ−ム状半田塗布装置

Publications (2)

Publication Number Publication Date
JPS5939467A true JPS5939467A (ja) 1984-03-03
JPS6258823B2 JPS6258823B2 (enExample) 1987-12-08

Family

ID=15522222

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57151607A Granted JPS5939467A (ja) 1982-08-30 1982-08-30 クリ−ム状半田塗布装置

Country Status (1)

Country Link
JP (1) JPS5939467A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6025292A (ja) * 1983-07-21 1985-02-08 ティーディーケイ株式会社 電子部品に対する半田付着方法
US4824006A (en) * 1987-02-09 1989-04-25 Kabushiki Kaisha Toshiba Die bonding apparatus
US5167361A (en) * 1991-05-16 1992-12-01 Motorola, Inc. Method and apparatus for two sided solder cladded surface mounted printed circuit boards

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6025292A (ja) * 1983-07-21 1985-02-08 ティーディーケイ株式会社 電子部品に対する半田付着方法
US4824006A (en) * 1987-02-09 1989-04-25 Kabushiki Kaisha Toshiba Die bonding apparatus
US5167361A (en) * 1991-05-16 1992-12-01 Motorola, Inc. Method and apparatus for two sided solder cladded surface mounted printed circuit boards

Also Published As

Publication number Publication date
JPS6258823B2 (enExample) 1987-12-08

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