JPS5937285B2 - Photo and thermosetting resin composition - Google Patents

Photo and thermosetting resin composition

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Publication number
JPS5937285B2
JPS5937285B2 JP251581A JP251581A JPS5937285B2 JP S5937285 B2 JPS5937285 B2 JP S5937285B2 JP 251581 A JP251581 A JP 251581A JP 251581 A JP251581 A JP 251581A JP S5937285 B2 JPS5937285 B2 JP S5937285B2
Authority
JP
Japan
Prior art keywords
resin composition
parts
acid value
acid
comparative example
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP251581A
Other languages
Japanese (ja)
Other versions
JPS57117519A (en
Inventor
寿 西垣
雄次 四十物
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP251581A priority Critical patent/JPS5937285B2/en
Publication of JPS57117519A publication Critical patent/JPS57117519A/en
Priority to US06/580,710 priority patent/US4564646A/en
Publication of JPS5937285B2 publication Critical patent/JPS5937285B2/en
Expired legal-status Critical Current

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  • Polymerisation Methods In General (AREA)
  • Macromonomer-Based Addition Polymer (AREA)

Description

【発明の詳細な説明】 本発明は、光及び熱硬化性樹脂組成物に関するもので、
電気機器の絶縁及び固着に用いられ、特にエナメル銅線
としてポリエステル銅線(以下PEWと略す。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a photo- and thermosetting resin composition,
Polyester copper wire (hereinafter abbreviated as PEW) is used for insulating and fixing electrical equipment, and is particularly used as an enamelled copper wire.

)又はウレタン銅線(以下、UEWと略す。)を使用し
た場合、すぐれた適合性を与え、電気機器の信頼性及び
性能の向上を計り、且つ電気機器の絶縁処理の時間を短
縮することが可能な光及び熱硬化性樹脂組成物に関する
ものである。最近、電気機器は小型軽量化、使用条件の
過酷化、信頼性向上などの傾向が一段と強まり、絶縁用
ワニスには、接着強度、耐クラック性、耐熱性、耐薬品
性などの向上が望まれるようになり、従来から広く使用
されている溶剤型ワニスに代つて、これらの特性にすぐ
れた不飽和ポリエステル樹脂が、一方では、不飽和ポリ
エステル樹脂よりも接着強度、耐クラック性、耐薬品性
などにすぐれた不飽和エポキシエステル樹脂が回転機器
の絶縁用ワニスとして使用されてきた。
) or urethane copper wire (hereinafter abbreviated as UEW) provides excellent compatibility, improves the reliability and performance of electrical equipment, and shortens the time for insulation processing of electrical equipment. The present invention relates to possible photo- and thermosetting resin compositions. Recently, there has been a growing trend toward smaller and lighter electrical equipment, harsher operating conditions, and improved reliability, and insulating varnishes are desired to have improved adhesive strength, crack resistance, heat resistance, chemical resistance, etc. In order to replace the conventionally widely used solvent-based varnishes, unsaturated polyester resins, which have excellent properties, have improved adhesive strength, crack resistance, chemical resistance, etc. than unsaturated polyester resins. Unsaturated epoxy ester resins with excellent properties have been used as insulating varnishes for rotating equipment.

回転機器には、高い信頼性が要求され、絶縁ワニスは、
使用されているエナメル線との相性のよいものが必要で
あり、従来の不飽和エポキシエステルは通常、酸価が1
0〜20程度であり、これらをα・β=不飽和エチレン
性単量体に溶解した絶縁ワニスの中には、特に、耐溶剤
性が劣る場合や焼付条件が適切でないPEW、UEWを
用いた場合、加熱硬化時にPEW、UEW皮膜のはくり
やふくれを起こし、著しく電気絶縁性が劣る場合があつ
た。
Rotating equipment requires high reliability, and insulating varnish is
A material that is compatible with the enameled wire being used is required, and conventional unsaturated epoxy esters usually have an acid value of 1.
0 to 20, and among insulating varnishes in which these are dissolved in α and β = unsaturated ethylenic monomers, PEW and UEW with poor solvent resistance or with inappropriate baking conditions may be used. In some cases, the PEW and UEW films peeled or blistered during heat curing, resulting in significantly poor electrical insulation properties.

また、促進剤としてナフテン酸コバルト、オクテン酸コ
バルト、ナフテン酸マンガン、ナフテン酸鉛などの金属
石けんを添加すると、経日で沈降物が発生するなどの欠
点もあつた。また、これらの絶縁ワニスの加熱硬化は、
一般に100〜140℃で2〜5時間加熱する必要があ
り、処理時間が比較的長い。また、硬化中に架橋性単量
体が揮散し省資源、公害的見地からも問題があるなどの
欠点があつた。本発明者らは種々検討した結果、(1)
ポリエポキシドとα・β一不飽和一塩基酸とを反応させ
て得られる酸価が5を超える不飽和エポキシエステルの
モノエポキシドを反応させて得られる酸価が5以下の反
応生成物、(2)α・β一不飽和エチレン性単量体なら
びに(3)光増感剤及び過酸化物を含有する光及び熱硬
化性樹脂組成物で、モーターのステーター、アマチユア
等の電気機器を含浸処理し、表面を光照射して硬化させ
たあと、熱良通電、高周波、遠赤外線などにより加熱を
行なうことにより、これらの欠点の改良が可能となるこ
とを見出した。
Furthermore, when metal soaps such as cobalt naphthenate, cobalt octenoate, manganese naphthenate, and lead naphthenate are added as accelerators, there are also drawbacks such as the formation of sediment over time. In addition, heat curing of these insulating varnishes
Generally, it is necessary to heat at 100 to 140°C for 2 to 5 hours, and the processing time is relatively long. Further, the crosslinking monomer volatilizes during curing, which poses problems from the viewpoint of resource saving and pollution. As a result of various studies, the present inventors found that (1)
A reaction product with an acid value of 5 or less obtained by reacting a monoepoxide of an unsaturated epoxy ester with an acid value of more than 5 obtained by reacting a polyepoxide with an α/β monounsaturated monobasic acid, (2) Impregnating electrical equipment such as motor stators and armatures with a photo- and thermosetting resin composition containing an α/β monounsaturated ethylenic monomer and (3) a photosensitizer and a peroxide, It has been found that these defects can be improved by curing the surface by irradiating it with light and then heating it with heat current, high frequency, far infrared rays, etc.

本発明は、(1)ポリエポキシドとα・β一不飽和一塩
基酸とを反応させて得られる酸価が5を超える不飽和エ
ポキシエステルにモノエポキシドを反応させて得られる
酸価が5以下の反応生成物、(2)α・β一不飽和エチ
レン性単量体ならびに(3)光増感剤及び過酸化物を含
有してなる光及び熱硬化性樹脂組成物に関する。
The present invention provides (1) an unsaturated epoxy ester with an acid value of more than 5 obtained by reacting a polyepoxide with an α/β monounsaturated monobasic acid and an unsaturated epoxy ester with an acid value of 5 or less obtained by reacting a monoepoxide with an The present invention relates to a photo- and thermosetting resin composition comprising a reaction product, (2) an α/β monounsaturated ethylenic monomer, and (3) a photosensitizer and a peroxide.

本発明において酸価とは、JISC2lO5一1979
によつて測定される値(試料1V中の酸を中和するため
に要した水酸化カリウムの〜数)を意味する。
In the present invention, acid value refers to JISC21O5-1979
(the number of potassium hydroxide required to neutralize the acid in sample 1V) measured by

本発明の、酸価が5を超える不飽和エポキシエステルは
、ポリエポキシドとほぼ当量のα・β不飽和一塩基酸を
反応させて得られるものであり、特に、製造条件の制限
はなく、例えば触媒を用いて、100〜130℃で5〜
10時間反応させて合成される。
The unsaturated epoxy ester of the present invention having an acid value exceeding 5 is obtained by reacting polyepoxide with approximately equivalent amount of α/β unsaturated monobasic acid, and there are no particular restrictions on the manufacturing conditions, such as catalyst 5~ at 100~130℃ using
It is synthesized by reacting for 10 hours.

エナメル線との適合性から不飽和エポキシエステルにモ
ノエポキシドを反応させて得られる反応生成物の酸価は
5以下とされる。
The acid value of the reaction product obtained by reacting an unsaturated epoxy ester with a monoepoxide is set to be 5 or less for compatibility with enameled wire.

本発明に用いられるポリエポキシドとは分子あたり1個
以上のエポキシ基を有する化合物で多価アルコール又は
多価フエノールのグリシジルポリエーテル、エポキシ化
脂肪酸又はエポキシ化乾性油脂肪酸、エポキシ化ジオレ
フイン、エポキシ化ジ不飽和酸のエステル、エポキシ化
飽和酸のエステル、エポキシ化飽和ポリエステルなどが
用いられる。
The polyepoxide used in the present invention is a compound having one or more epoxy groups per molecule, such as glycidyl polyether of polyhydric alcohol or polyphenol, epoxidized fatty acid or epoxidized drying oil fatty acid, epoxidized diolefin, and epoxidized diolefin. Saturated acid esters, epoxidized saturated acid esters, epoxidized saturated polyesters, etc. are used.

α・β一不飽和一塩基酸としては、メタクリル酸、アク
リル酸、クロトン酸などが用いられ、これらを併用して
もさしつかえない。
As the α/β monounsaturated monobasic acid, methacrylic acid, acrylic acid, crotonic acid, etc. are used, and these may be used in combination.

触媒としては塩化亜鉛、塩化リチウム等のハロゲン化物
、ジメチルサルフアイド、メチルフエニルサルフアイド
等のサルフアイド類、ジメチルスルフオキサイド、メチ
ルスルフオキサイド、メチルエチルスルフオキサイド等
のスルフオキサイド類、N−N−ジメチルアニリン、ピ
リジン、トリエチルアミン、ヘキサメチレンジアミン等
の第3級アミン及びその塩酸塩又はしゆう酸塩、テトラ
メチルアンモニウムクロライド、トリメチルドデシルベ
ンジルアンモニウムクロライド等の第4級アンモニウム
塩、パラ−トルエンスルホン酸等のスルホン酸類、エチ
ルメルカプタン、プロピルメルカプタン等のメルカプタ
ン類などが用いられる。
Catalysts include halides such as zinc chloride and lithium chloride, sulfides such as dimethyl sulfide and methyl phenyl sulfide, sulfoxides such as dimethyl sulfoxide, methyl sulfoxide and methyl ethyl sulfoxide, N - Tertiary amines such as N-dimethylaniline, pyridine, triethylamine, hexamethylene diamine and their hydrochlorides or oxalates, quaternary ammonium salts such as tetramethylammonium chloride, trimethyldodecylbenzylammonium chloride, para-toluene Sulfonic acids such as sulfonic acid, mercaptans such as ethyl mercaptan and propyl mercaptan, and the like are used.

また、酸価が5を超える不飽和エポキシエステルと反応
させるモノエポキシドには、特に制限はなく、フエニル
グリシジルエーテル、ブチルグリシジルエーテル等のグ
リシジルエーテル類、パラターシャリブチル安息香酸の
グリシジルエステル、脂肪酸のモノグリシジルエステル
等のグリシジルエステル類などが使用できる。また、反
応条件としては特に制限はないが、反応生成物の酸価が
、5以下となるような添加量とされ、モノエポキシドの
分子量によつて添加量は異なつてくる。
In addition, there are no particular restrictions on the monoepoxides to be reacted with unsaturated epoxy esters having an acid value of more than 5, including glycidyl ethers such as phenyl glycidyl ether and butyl glycidyl ether, glycidyl esters of paratertiary butyl benzoic acid, and fatty acids. Glycidyl esters such as monoglycidyl esters can be used. Although there are no particular restrictions on the reaction conditions, the amount added is such that the acid value of the reaction product is 5 or less, and the amount added varies depending on the molecular weight of the monoepoxide.

例えば、酸価が15前後の不飽和エポキシエステル10
0重量部にフエニルグリシジルエーテルまたは脂肪酸の
モノグリシジルエステルであるカージユラE(シエル化
学社製、エポキシ当量240〜250)を反応させる場
合は、フエニルグリシジルエーテルの場合は2.5〜6
重量部、カージユラEの場合は4〜10重量部加えて、
酸価が5以下となるように、110〜120℃で2〜3
時間反応させる。
For example, unsaturated epoxy ester 10 with an acid value of around 15
When reacting phenyl glycidyl ether or a monoglycidyl ester of fatty acid Cardiura E (manufactured by Ciel Chemical Co., Ltd., epoxy equivalent: 240 to 250) to 0 parts by weight, in the case of phenyl glycidyl ether, 2.5 to 6
parts by weight, in the case of Cardiura E, add 4 to 10 parts by weight,
2-3 at 110-120℃ so that the acid value is 5 or less
Allow time to react.

α・β一不飽和エチレン性単量体としては、スチレン、
ビニルトルエン、エチルビニルベンゼン、ジビニルベン
ゼン、ジアリルフタレート、α−メチルスチレン、2−
ヒドロキシエチルアクリレート又は2−ヒドロキシエチ
ルメタクリレート、1・6−ヘキサンジオールジアクリ
レート又は1・6一ヘキサンジオールジメタクリレート
、トリメチロールプロパントリアクリレート又はトリメ
チロールプロパントリメタクリレート、ポリエチレング
リコールジアクリレート又はポリエチレングリコールジ
メタクリレート等のアクリル酸エステル類またはメタク
リル酸エステル類などが単独で又は2種以上組み合わせ
て使用され、好ましくは、不飽和エポキシエステル又は
不飽和エポキシエステルとモノエポキシドとの反応生成
物30〜70重量部に対して、α・β一不飽和エチレン
性単量体は70〜30重量部の範囲とされる。
Examples of α/β monounsaturated ethylenic monomers include styrene,
Vinyltoluene, ethylvinylbenzene, divinylbenzene, diallyl phthalate, α-methylstyrene, 2-
Hydroxyethyl acrylate or 2-hydroxyethyl methacrylate, 1,6-hexanediol diacrylate or 1,6-hexanediol dimethacrylate, trimethylolpropane triacrylate or trimethylolpropane trimethacrylate, polyethylene glycol diacrylate or polyethylene glycol dimethacrylate, etc. Acrylic esters or methacrylic esters are used alone or in combination of two or more, preferably based on 30 to 70 parts by weight of an unsaturated epoxy ester or a reaction product of an unsaturated epoxy ester and a monoepoxide. The amount of α/β monounsaturated ethylenic monomer is in the range of 70 to 30 parts by weight.

光増感剤としては、ベンゾイン、ベンゾインメチルエー
テル、ベンゾインエチルエーテル、ベンゾインイソプロ
ピルエーテル等のベンゾインアルキルエーテル類、アセ
トフエノン、2・2−ジメトキシ−2−フエニルアセト
フエノン、2・2ジエトキシ−2−フエニルアセトフエ
ノン等のアセトフエノン類、ベンゾイン−ミヒラ−ケト
ン、ベンゾインチオエーテル類、ベンゾフエノン、アン
トラキノン類、塩化デシルなどが使用できる。
Examples of photosensitizers include benzoin, benzoin alkyl ethers such as benzoin methyl ether, benzoin ethyl ether, and benzoin isopropyl ether, acetophenone, 2,2-dimethoxy-2-phenylacetophenone, and 2,2-diethoxy-2- Acetophenones such as phenylacetophenone, benzoin-Michler-ketone, benzinthioethers, benzophenone, anthraquinones, decyl chloride, and the like can be used.

光増感剤の添加量は、不飽和エポキシエステルとモノエ
ポキシドとの反応生成物とα・β一不飽和エチレン性単
量体との総量に対して0.1〜3重量%の範囲が好まし
い。過酸化物としては、ベンゾイルパーオキサイド、ア
セチルパーオキサイド等のアシルパーオキサイド、ター
シヤリブチルパーオキサイド、キユメンヒドロパーオキ
サイド等のヒドロパーオキサイド、メチルエチルケトン
パーオキサイド、シクロヘキサノンパーオキサイド等の
ケトンパーオキサイド、ジターシャリブチルパーオキサ
イド、ジクミルパーオキサイド等のジアルキルパーオキ
サイド、ターシヤリブチルパーオキシアセテート等のオ
キシパーオキサイドなどが用いられる。
The amount of the photosensitizer added is preferably in the range of 0.1 to 3% by weight based on the total amount of the reaction product of the unsaturated epoxy ester and monoepoxide and the α/β monounsaturated ethylenic monomer. . Examples of peroxides include acyl peroxides such as benzoyl peroxide and acetyl peroxide, hydroperoxides such as tertiary butyl peroxide and kyumene hydroperoxide, ketone peroxides such as methyl ethyl ketone peroxide and cyclohexanone peroxide, and dither. Dialkyl peroxides such as shalybutyl peroxide and dicumyl peroxide, oxyperoxides such as tertiary butyl peroxy acetate, etc. are used.

その添加量は、不飽和エポキシエステルとモノエポキシ
ドとの反応生成物とα・β一不飽和エチレン性単量体と
の総量に対して0.5〜3重量%が好ましい。必要に応
じて、促進剤としてナフテン酸マンガン、ナフテン酸鉛
、ナフテン酸コバルト、オクテン酸コバルト等の金属石
けんなどが用いられ、必要に応じてアミンなどを使用し
てもよい。重合禁止剤としてハイドロキノン、ターシャ
リブチルカテコール、p−ベンゾキノン、2・5−ジタ
ーシャリブチルハイドロキノンなどが用いられる。本発
明になる光及び熱硬化性樹脂組成物は、モーターのステ
ーター、アマチユアなどの電気機器の絶縁及び固着用に
適している。
The amount added is preferably 0.5 to 3% by weight based on the total amount of the reaction product of the unsaturated epoxy ester and monoepoxide and the α/β monounsaturated ethylenic monomer. If necessary, a metal soap such as manganese naphthenate, lead naphthenate, cobalt naphthenate, cobalt octenoate, etc. may be used as an accelerator, and an amine or the like may be used if necessary. Hydroquinone, tert-butylcatechol, p-benzoquinone, 2,5-ditertibutylhydroquinone, etc. are used as the polymerization inhibitor. The photo- and thermosetting resin composition of the present invention is suitable for insulating and fixing electrical equipment such as motor stators and armatures.

以下に本発明の実施例を説明する。Examples of the present invention will be described below.

部とあるのは重量部である。比較例 1 4・4′−イソプロピリデンジフエノールのジグリシジ
ルエーテル(シエル化学製、Ep−828、エポキシ当
量188)376部、メタクリル酸172部、ベンジル
ジメチルアミン2部、ハイドロキノン0.05部を仕込
み、115℃で酸価を測定しながら反応させ、酸価16
の不飽和エポキシエステル〔A〕および酸価7.6の不
飽和エポキシエステル〔B〕を合成し、〔A〕、〔B〕
を各々45音Lスチレン55部、オクテン酸コバルト6
% 0.3部、ベンゾイルパーオキサイド1部とした樹
脂組成物〔A−1〕、〔B−1〕を作成した。
Parts are by weight. Comparative Example 1 376 parts of diglycidyl ether of 4,4'-isopropylidene diphenol (manufactured by Ciel Chemical, Ep-828, epoxy equivalent 188), 172 parts of methacrylic acid, 2 parts of benzyldimethylamine, and 0.05 part of hydroquinone were charged. , the reaction was carried out at 115°C while measuring the acid value, and the acid value was 16.
unsaturated epoxy ester [A] and unsaturated epoxy ester [B] with an acid value of 7.6 were synthesized, [A], [B]
45 parts each of L styrene 55 parts, cobalt octenoate 6 parts
% and 1 part of benzoyl peroxide were prepared.

比較例 2比較例1の〔A−1〕、〔B−1〕、各々1
00部にベンゾインイソプロピルエーテル2部を添加し
、樹脂組成物〔A−2〕、〔B−2〕とした。
Comparative Example 2 [A-1] and [B-1] of Comparative Example 1, 1 each
00 parts and 2 parts of benzoin isopropyl ether were added to prepare resin compositions [A-2] and [B-2].

比較例 3 比較例1と同じ配合、合成工程で合成し、酸価が17と
なつた時、カージユラE35部を添加し、115℃で酸
価を測定しながら反応を続け、酸価が9.0の反応生成
物〔C〕、酸価が6.2の反応生成物〔D〕及び酸価が
4.6の反応生成物〔E〕を合成した。
Comparative Example 3 Synthesis was carried out using the same formulation and synthesis steps as in Comparative Example 1. When the acid value reached 17, 35 parts of Cardiura E was added and the reaction was continued while measuring the acid value at 115°C until the acid value reached 9. A reaction product [C] with an acid value of 0, a reaction product [D] with an acid value of 6.2, and a reaction product [E] with an acid value of 4.6 were synthesized.

〔C〕、〔D〕、〔E〕を各々45部、スチレン55部
、オクテン酸コバルト6%0.3部、ベンゾイルパーオ
キサイド1部とした樹脂組成物〔C−1〕、〔D−1〕
、〔E−1〕を作成した。比較例 4 比較例3で得た〔C−1〕、〔D−1〕を各々100部
にベンゾインイソプロピルエーテル2部を添加しJ樹脂
組成物〔C−2〕、〔D−2〕とした。
Resin compositions [C-1] and [D-1] containing 45 parts each of [C], [D], and [E], 55 parts of styrene, 0.3 parts of 6% cobalt octenoate, and 1 part of benzoyl peroxide. ]
, [E-1] was created. Comparative Example 4 2 parts of benzoin isopropyl ether was added to 100 parts each of [C-1] and [D-1] obtained in Comparative Example 3 to prepare J resin compositions [C-2] and [D-2]. .

実施例 1 比較例3で得た〔E−1〕100部にベンゾインイソプ
ロピルエーテル2部を添加し樹脂組成物〔E−2〕を作
成した。
Example 1 2 parts of benzoin isopropyl ether was added to 100 parts of [E-1] obtained in Comparative Example 3 to prepare a resin composition [E-2].

比較例 5 比較例1と同じ配合、合成工程で合成し、酸価が15と
なつた時、ブチルグリシジルエーテル16部を添加し、
115℃で酸価を測定しながら反応を続け、酸価が8.
5の反応生成物〔F〕、酸価が6.0の反応生成物〔G
〕、酸価が4.2の反応生成物〔H〕を合成した。
Comparative Example 5 Synthesized using the same formulation and synthesis process as Comparative Example 1, and when the acid value reached 15, 16 parts of butyl glycidyl ether was added,
The reaction continued at 115°C while measuring the acid value, and the acid value reached 8.
5 reaction product [F], reaction product with acid value 6.0 [G
], a reaction product [H] with an acid value of 4.2 was synthesized.

CF〕、〔G〕、〔H〕を各々45部、スチレン55部
、オクテン酸コバルト6%0.3部、ベンゾイルパーオ
キサイド1部とした樹脂組成物〔F−1〕、〔G−1〕
、〔H1〕を作成した。比較例 6 比較例5で得た樹脂組成物〔F−1〕、〔G1〕を各々
100部にベンゾインイソプロピルエーテル2部を添加
し、樹脂組成物〔F−2〕、〔G−2〕とした。
Resin compositions [F-1], [G-1] containing 45 parts each of CF], [G], and [H], 55 parts of styrene, 0.3 parts of 6% cobalt octenoate, and 1 part of benzoyl peroxide.
, [H1] was created. Comparative Example 6 2 parts of benzoin isopropyl ether was added to 100 parts each of the resin compositions [F-1] and [G1] obtained in Comparative Example 5 to form resin compositions [F-2] and [G-2]. did.

実施例 2 比較例5で得た樹脂組成物〔H−1〕100部にベンゾ
インイソプロピルエーテル2部を添加し、樹脂組成物〔
H−2〕とした。
Example 2 2 parts of benzoin isopropyl ether was added to 100 parts of the resin composition [H-1] obtained in Comparative Example 5, and the resin composition [H-1] was added.
H-2].

以上の比較例2、比較例4、比較例6、実施例1〜2で
得られた樹脂組成物に、紫外線を3分照射したあと、1
20℃で20分加熱し、又、比較例1、比較例3、比較
例5で得られた樹脂組成物を120℃で2時間加熱して
硬化物を作成し、特性を比較した。
After irradiating the resin compositions obtained in Comparative Example 2, Comparative Example 4, Comparative Example 6, and Examples 1 to 2 for 3 minutes with ultraviolet rays,
The resin compositions obtained in Comparative Example 1, Comparative Example 3, and Comparative Example 5 were heated at 120° C. for 2 hours to prepare cured products, and their properties were compared.

その結果を表1に示す。また、0.6φ(直径0.6菖
m)IPEWを用いた単相、125Wステーター(コア
寸法140×110×35前麗)を上記の実施例及び比
較例で得た樹脂組成物で処理し、120℃で加熱した場
合と、紫外線で照射後120℃で加熱した場合の硬化性
、エナメル銅線との適合性、耐クラツク性などについて
比較して表1に示す。
The results are shown in Table 1. In addition, a single-phase, 125W stator (core dimensions 140 x 110 x 35 mm) using 0.6φ (diameter 0.6 yam) IPEW was treated with the resin composition obtained in the above examples and comparative examples. Table 1 shows a comparison of hardenability, compatibility with enameled copper wire, crack resistance, etc. when heated at 120° C. and when heated at 120° C. after irradiation with ultraviolet rays.

<紫外線照射条件> ランプリオーク製作所、0RC− AHH一1000、
1に槁圧水銀灯、2灯照射距離:20(V7l 照射時間:3分 試験法 (1)スチレンとの相溶性 18φ試験管に高さ180nまで樹脂組成物を入れ、密
封し、o℃に5日間放置したあと、樹脂組成物の外観を
観察した。
<Ultraviolet irradiation conditions> Lamprie Oak Manufacturing Co., Ltd., 0RC-AHH-1000,
1 is a high-pressure mercury lamp, 2 lamps Irradiation distance: 20 (V7L Irradiation time: 3 minutes Test method (1) Compatibility with styrene Put the resin composition in an 18φ test tube to a height of 180n, seal it, and heat it to 50°C. After standing for a day, the appearance of the resin composition was observed.

○:外観変化なし、相溶性良好、△:外観、不透明、相
性やや劣る、×:相分離あり、相性劣る。
○: No change in appearance, good compatibility; △: Appearance, opaque, slightly poor compatibility; ×: Phase separation, poor compatibility.

(2)経日でのワニス安定性 ブリキ製300CC丸缶に樹脂組成物を300v入れ、
40℃に10日間放置したあと、樹脂組成物の外観を観
察した。
(2) Varnish stability over time Pour 300V of the resin composition into a 300CC round tin can,
After being left at 40° C. for 10 days, the appearance of the resin composition was observed.

〇:外観変化なし、△:若干沈降物の発生あり。〇: No change in appearance, △: Slight occurrence of sediment.

(3)表面硬化性 18×5×0.25tmmのブリキ板に樹脂組成物を塗
布したあと、紫外線照射又は120℃で加熱し、表面が
硬化するまでの時間を測定した。
(3) Surface hardening After applying the resin composition to a tin plate of 18 x 5 x 0.25 tmm, the resin composition was irradiated with ultraviolet rays or heated at 120°C, and the time required for the surface to harden was measured.

(4)モノマ逸散量60φ×12mwLの金属製シャー
レに樹脂組成物をIOV入れ、120℃で2時間加熱し
た場合と、紫外線を3分照射後、120℃で20分加熱
した場合のモノマ逸散量を硬化前後の質量差から求めた
(4) Monomer loss amount When the resin composition is placed in an IOV of a 60φ x 12 mwL metal petri dish and heated at 120°C for 2 hours, and after irradiated with ultraviolet rays for 3 minutes, it is heated at 120°C for 20 minutes. The amount of dispersion was determined from the difference in mass before and after curing.

(5)せん断接着力 JISC2lO5に準じて第1図に示す 2.0φ(直径2.0mwL)IPEW−1で作成した
ストラツカー試験片に樹脂組成物を含浸し120℃で2
時間加熱した場合と、紫外線を3分照射後、120℃で
20分加熱した場合のせん断接着力を23℃で測定した
(5) Shear adhesive strength A Strucker test piece made of 2.0φ (diameter 2.0 mwL) IPEW-1 shown in Figure 1 was impregnated with a resin composition in accordance with JISC21O5 and heated at 120°C for 2 hours.
The shear adhesive strength was measured at 23° C. when heated for a certain period of time and when heated at 120° C. for 20 minutes after irradiation with ultraviolet rays for 3 minutes.

第1図において2はつき合わせ部、3はエナメル線(線
径0.29mm)、数字の単位は7nmである。
In FIG. 1, 2 is an abutting portion, 3 is an enameled wire (wire diameter 0.29 mm), and the unit of numbers is 7 nm.

(6)モデルコイルでのPEWとの適合性堅型試焼炉(
炉長4.5m)ダイス7回通し、炉温、下部300℃、
中央350℃、上部400℃)を用い焼付速度を変えて
試焼した0.8φ(直径0.8m7n)のPEW−1(
線速9m/wl)およびPEW− 2(線速11m/M
m)を用いて、第2図に示すようにパラ巻きで30回タ
ーンさせたモデルコイルに樹脂組成物を処理し、120
℃で2時間加熱した場合と、紫外線を3分照射後120
℃で20分加熱した場合のPEW皮膜の外観観察と、線
間の絶縁破壊電圧(BDVと略す)を測定した。
(6) Compatibility with PEW in model coil Rigid trial furnace (
Furnace length: 4.5 m) Pass through the die 7 times, Furnace temperature: 300°C at the bottom,
0.8φ (diameter 0.8m7n) PEW-1 (350°C in the center, 400°C in the upper part) with different baking speeds
Linear speed 9m/wl) and PEW-2 (Linear speed 11m/M
m), the resin composition was applied to a model coil that had been turned 30 times in a para-wound manner as shown in Figure 2.
120°C when heated for 2 hours and after 3 minutes of ultraviolet irradiation
The appearance of the PEW film was observed when heated at ℃ for 20 minutes, and the dielectric breakdown voltage (abbreviated as BDV) between the lines was measured.

〇:外観異常なし、BDVIO〜12にV、○〜△:1
部に微小なふくれあり、BDVIO〜12にV、△;ふ
くれあり、BDV7〜10にV)×:ふくれの度合いが
大きい、BDV2〜5にV第2図において4は0.8φ
IPEW、5は綿糸であり数字の単位はm麗である。
〇: No abnormality in appearance, V on BDVIO ~ 12, ○ ~ △: 1
There is a slight bulge on the part, V on BDVIO to 12, △: There is a bulge, V on BDV 7 to 10) ×: The degree of bulge is large, V on BDV 2 to 5 In Fig. 2, 4 is 0.8φ
IPEW, 5 is cotton thread, and the unit of number is mrei.

(7)硬化時間 125Wステーターに樹脂組成物を含浸し、120℃で
50分加熱した場合と紫外線を3分照射後120℃で1
7分加熱した場合の樹脂組成物の硬化性を、ステーター
の線間の絶縁抵抗から判定した。
(7) Curing time: 125W stator impregnated with resin composition and heated at 120℃ for 50 minutes, and 125W stator heated at 120℃ for 3 minutes after irradiation with ultraviolet rays.
The curability of the resin composition when heated for 7 minutes was determined from the insulation resistance between the wires of the stator.

絶縁抵抗が飽和した時間を硬化時間とした。(8)硬化
後のエナメル線との適合性 125Wステーターに樹脂組成物を含浸し、120℃で
2時間加熱した場合と紫外線を3分照射後120℃で2
0分加熱した場合のPEW皮膜の外観観察と、線間のB
DVを測定した。
The time when the insulation resistance was saturated was defined as the curing time. (8) Compatibility with enameled wire after curing A case in which a 125W stator is impregnated with a resin composition and heated at 120℃ for 2 hours, and a case in which it is heated at 120℃ for 3 minutes after irradiation with ultraviolet rays.
Observation of appearance of PEW film after heating for 0 minutes and B between lines
DV was measured.

(外観)〇:はくり、ふくれなし、△:若干微小なふく
れあり、×ふくれあり(BDV) ○:10〜12にV)△:7 〜10KV)×2〜5に
V(9)耐クラツク性 (8)と同様に硬化させた125Wステーターを用いて
、25℃/1時間Θ低温/1時間のヒートサイクルを5
回行ない、ワニス硬化物にクラツクが発生しなければ低
温側を10℃ずつ低下して、同様にヒートサイクルを行
ないクラツクが発生する温度を確認した。
(Appearance) 〇: No peeling or blistering, △: Some slight bulging, × Bulging (BDV) ○: V on 10-12) △: V on 7-10 KV) x 2-5 (9) Cracking resistance Using a 125W stator hardened in the same manner as in (8), heat cycles of Θ low temperature/1 hour at 25°C/1 hour were carried out for 5
The heat cycle was repeated, and if no cracks were generated in the cured varnish, the temperature was lowered by 10° C., and the heat cycle was repeated in the same manner to confirm the temperature at which cracks occurred.

表1の結果から、本発明になる光及び熱硬化性樹脂組成
物を用いて、光照射し、加熱硬化することによつて絶縁
処理の硬化時間は、加熱硬化の場合の約1/ 2.5と
なり、また、エナメル線との適合性が向上するため、信
頼性にすぐれた電気機器の製造が可能となる。
From the results in Table 1, it can be seen that the curing time of insulation treatment using the photo- and thermosetting resin composition of the present invention by light irradiation and heat curing is approximately 1/2 that of heat curing. 5, and the compatibility with the enamelled wire is improved, making it possible to manufacture electrical equipment with excellent reliability.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は実施例で行なつたせん断接着力測定に用いた試
験片、第2図は実施例で行なつたPEWとの適合性試験
に用いたモデルコイルである。 符号の説明、1 ・・・・・・20φIPEW、2・・
・・・・つき合わせ部、3・・・・・・エナメル線、4
・・・・・・0.8φ1PEW、5・・・・・・綿糸。
FIG. 1 shows a test piece used in the shear adhesive strength measurement conducted in the example, and FIG. 2 shows a model coil used in the compatibility test with PEW conducted in the example. Explanation of symbols, 1...20φIPEW, 2...
...Butting part, 3...Enameled wire, 4
...0.8φ1PEW, 5...cotton thread.

Claims (1)

【特許請求の範囲】[Claims] 1(1)ポリエポキシドとα・β−不飽和一塩基酸とを
反応させて得られる酸価が5を超える不飽和エポキシエ
ステルにモノエポキシドを反応させて得られる酸価が5
以下の反応生成物、(2)α・β−不飽和エチレン性単
量体ならびに(3)光増感剤及び過酸化物を含有してな
る光及び熱硬化性樹脂組成物。
1 (1) The acid value obtained by reacting a polyepoxide with an α/β-unsaturated monobasic acid is more than 5. The acid value obtained by reacting an unsaturated epoxy ester with a monoepoxide is 5.
A photo- and thermosetting resin composition comprising the following reaction product, (2) an α/β-unsaturated ethylenically monomer, and (3) a photosensitizer and a peroxide.
JP251581A 1981-01-10 1981-01-10 Photo and thermosetting resin composition Expired JPS5937285B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP251581A JPS5937285B2 (en) 1981-01-10 1981-01-10 Photo and thermosetting resin composition
US06/580,710 US4564646A (en) 1981-01-10 1984-02-16 Light- and thermosetting resin composition and insulated electrical machinery and appliances using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP251581A JPS5937285B2 (en) 1981-01-10 1981-01-10 Photo and thermosetting resin composition

Publications (2)

Publication Number Publication Date
JPS57117519A JPS57117519A (en) 1982-07-22
JPS5937285B2 true JPS5937285B2 (en) 1984-09-08

Family

ID=11531503

Family Applications (1)

Application Number Title Priority Date Filing Date
JP251581A Expired JPS5937285B2 (en) 1981-01-10 1981-01-10 Photo and thermosetting resin composition

Country Status (1)

Country Link
JP (1) JPS5937285B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018051801A1 (en) 2016-09-13 2018-03-22 サカタインクス株式会社 Printing ink compositon for film and use thereof

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57202304A (en) * 1981-06-08 1982-12-11 Toshiba Chem Corp Curing of photo-curing resin composition
US4703338A (en) * 1983-10-14 1987-10-27 Daicel Chemical Industries, Ltd. Resin composition to seal electronic device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018051801A1 (en) 2016-09-13 2018-03-22 サカタインクス株式会社 Printing ink compositon for film and use thereof

Also Published As

Publication number Publication date
JPS57117519A (en) 1982-07-22

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