JPS5935954Y2 - リ−ド端子 - Google Patents
リ−ド端子Info
- Publication number
- JPS5935954Y2 JPS5935954Y2 JP17113979U JP17113979U JPS5935954Y2 JP S5935954 Y2 JPS5935954 Y2 JP S5935954Y2 JP 17113979 U JP17113979 U JP 17113979U JP 17113979 U JP17113979 U JP 17113979U JP S5935954 Y2 JPS5935954 Y2 JP S5935954Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead terminal
- lead
- wire
- view
- solder alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 8
- 229910000978 Pb alloy Inorganic materials 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 17
- 229910045601 alloy Inorganic materials 0.000 description 14
- 239000000956 alloy Substances 0.000 description 14
- 239000004020 conductor Substances 0.000 description 10
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 6
- 238000005476 soldering Methods 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000005219 brazing Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Non-Insulated Conductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17113979U JPS5935954Y2 (ja) | 1979-12-12 | 1979-12-12 | リ−ド端子 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17113979U JPS5935954Y2 (ja) | 1979-12-12 | 1979-12-12 | リ−ド端子 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5689168U JPS5689168U (enExample) | 1981-07-16 |
| JPS5935954Y2 true JPS5935954Y2 (ja) | 1984-10-04 |
Family
ID=29681975
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17113979U Expired JPS5935954Y2 (ja) | 1979-12-12 | 1979-12-12 | リ−ド端子 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5935954Y2 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6699539B2 (ja) * | 2016-12-19 | 2020-05-27 | 住友電装株式会社 | 導電部材の製造方法及び導電部材 |
-
1979
- 1979-12-12 JP JP17113979U patent/JPS5935954Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5689168U (enExample) | 1981-07-16 |
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