JPS5933839A - Metal mold for resin sealing of semiconductor - Google Patents

Abstract

PURPOSE:To enable to form easily the radiation fin buried type resin sealed product, etc., by a method wherein an ejector pin is so provided in the metal mold main body as to enable one edge part thereof to go and out by the prescribed quantity in a cavity. CONSTITUTION:The hollow part 21 to form the external shape of the resin sealed product is formed on the upper part of a bottom force 20, and a pin inserting hole 22 to communicate with the bottom of the cavity 21 is penetrated. The ejector pin 23 is inserted sliding freely in the inserting hole 22 thereof by introducing the edge part from the bottom force 20. Another edge part drawn out from the hole is fixed to an elevating base 24 provided facing to the lower face of the bottom force 20, and the elevating base 24 is separated by the prescribed interval from the bottom force being interposed with a spring 25 between the bottom force 20. The elevating mechanism is constructed of a cam 27 fixed rotation freely to the side of the elevating base 24 and a rotary lever 28. By a simple operation only to operate the rotary lever 28, the quantity of projection of the ejector pin 23 in the cavity 21, or the quantity of drawing out from the cavity 21 can be set up to the prescribed value.

Description

[Detailed description of the invention] [Technical field of invention] The present invention relates to a mold for resin encapsulating a semiconductor.

[Technical background of the invention and its problems]

2. Description of the Related Art Conventionally, resin-sealed semiconductor devices have been used in which desired elements are sealed with a resin-sealed body. As shown in FIGS. 1(A) and 1(B), a resin-sealed semiconductor device is manufactured by placing a lead frame 1 on which an element is mounted into a semiconductor resin-sealing mold (
Hereinafter, it will simply be referred to as a mold. ), a resin sealing body 2 is formed thereon, and the excess frame portion of the lead frame 1 is cut off. The obtained semiconductor device has
As shown in FIG. 2, only the element 3 is buried in the resin molding body 2, and as shown in FIG. 3, the element 3 and a part of the radiation fin 4 are buried in the resin molding body 2. There is.

In order to mold the semiconductor device A in which only the element 3 is buried, as shown in FIG. A mold 1o having a structure in which the tip of the bottle 8 protrudes by a width L10.05 to 015 mm is used. In addition, in order to mold the semiconductor device 6 having a structure in which a part of the radiation fin 4 and the element 3 are buried, an ejector bin is used, as shown in FIG. A mold No. 1 with a structure in which the tip of No. 8 is lowered is used. Note that 10a in FIGS. 4 and 5.

11a is an upper mold, and 10b and 11b are lower molds.

It was necessary to prepare mold units 0 and 11 having an appropriate structure according to the structure of the semiconductor device 5.6 to be manufactured in this manner. The molds 10 and 11 are expensive and cause high manufacturing costs. In order to eliminate this drawback, the sixth
As shown in the figure, the lower end metal mold 12 of the ejector bin 8 is taken out and connected to the lifting table 13, and the lifting table 13 and the lower mold 12 are connected to the lifting table 13.
The length of the ejector bin 8 that moves in and out of the cavity 7 can be fully adjusted by inserting a spring 14 between them and attaching a lifting support 15 to the lower part of the lower mold 12 by penetrating the lifting platform 13 from the back side thereof. A mold holder J has been developed that allows this. Further, a base 18 is provided on the lower surface of the lifting table 13 via a spacer 17, and the ejector bin 8 is
It has also been developed to be able to move up and down. Such mold 1
In No. 6, the tightening of the hanging capacitor 15 required a lot of effort to adjust the amount of the acid and the intervening operation of the spacer 17, which had the disadvantage of poor workability.

[Purpose of the invention]

SUMMARY OF THE INVENTION An object of the present invention is to provide a mold for resin-sealing semiconductors that can easily manufacture resin-sealed products with embedded heat dissipation fins.

[Summary of the invention]

The present invention provides semiconductor resin encapsulation that allows an ejector bin to be placed in the mold body so that one end of the ejector bin can move in and out of the cavity by a predetermined amount, thereby making it possible to easily manufacture resin-sealed products with embedded radiation fins. This is a mold for use.

[Embodiments of the invention]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 7 is a cross-sectional view of one embodiment of the present invention.

In the figure, 20 is a lower mold that constitutes the mold body.

A hollow portion 21 (hereinafter referred to as a cavity) forming the outer shape of the resin-sealed product is formed in the upper part of the lower mold 20.

A bottle insertion hole 22 that communicates with the bottom of the cavity 21 is inserted through the lower mold 20 . An ejector bin 23 is slidably inserted into the bin insertion hole 22 so that one end of the ejector bin 23 is led out from the lower die 20 . The led-out end portion is attached to a lifting platform 24 provided opposite to the lower surface of the lower mold 20. A spring 25 is installed between the lifting platform 24 and the lower mold 20.
The lifting platform 24 is spaced apart from the lower surface of the base 20 at a predetermined distance. The elevating table 24 is provided on a base 26 so as to be movable up and down by an elevating mechanism. The elevating mechanism includes a cam 27 that is rotatably attached to the side surface of the elevating table 24 so that its circumferential side abuts the surface of the base 260, and a rotation lever 28 that is attached to the cam 27.

According to the semiconductor resin encapsulant m30 configured in this way, the amount of protrusion into the cavity 21 of the ejector bin 23 or the amount of the cavity can be adjusted via the lifting platform 24 by an extremely simple operation of only operating the rotary lever 28. The amount derived from 21 can be set to a predetermined value. As a result, a resin-sealed product in which only an element is embedded in a resin-sealed body, or a resin-sealed product in which an element and heat dissipation fins are embedded, can be easily manufactured using a single mold, reducing manufacturing costs. It is possible to reduce this and improve productivity.

Note that by setting the distance from the bottom of the cavity 21 to the tip surface of the ejector bin 23 to a predetermined value,
As shown in FIG. 8, it is possible to easily form a resin-sealed product 32 in a desired shape, such as one in which protrusions 31 are formed on the lower surface of the resin-sealed product.

〔Effect of the invention〕

As explained above, the mold for semiconductor resin encapsulation according to the present invention has remarkable effects such as being able to easily manufacture resin-sealed products with embedded radiation fins.

−6=

[Brief explanation of the drawing]

Fig. 1 (4) is a plan view showing a state in which a resin molded body is formed on a lead frame, Fig. 1 (B) is a front view of the lead frame, and Fig. 2 is a cross section of a resin molded semiconductor device. Fig. 3 is a sectional view of a resin-sealed semiconductor device with embedded radiation fins, Fig. 4 is a sectional view of a conventional mold for molding the resin-sealed semiconductor device shown in Fig. 2, and Fig. 5 6 is a cross-sectional view of a conventional mold for molding the resin-sealed semiconductor device shown in FIG.
The figure is a sectional view of a conventional mold provided with an ejector pin elevating mechanism, FIG. 7 is a sectional view of an embodiment of the present invention, and FIG. 8 is a mold for semiconductor resin encapsulation of the same embodiment. It is an explanatory view of a resin-sealed product molded with. 20... Lower mold, 21... Cavity, 22... Pin insertion hole, 23... Ejector pin, 24... Lifting platform, 25... Spring, 26... Base, 27... ...Cam, 28--Rotary lever, 30--Mold for semiconductor resin sealing, 31--Protrusion, 32--Resin-sealed product. =7- O6 figure off 1 13-O / 6 O8 figure 2

Claims (2)

[Claims] (1) A mold body having a hollow part forming the outer shape of the molded product, a bottle insertion hole formed in the mold body so as to communicate with the hollow part, and a pin insertion hole that can freely slide into the pin insertion hole. A semiconductor resin encapsulation characterized by comprising an inserted ejector bin, an elevating table connected to one end of the ejector bin led out from the mold body, and an elevating mechanism attached to the elevating table. Mold for use. (2) The elevating mechanism is composed of a cam rotatably attached to the surface of the base on which the elevating table is placed, and a rotary lever attached to the cam. A mold for semiconductor resin encapsulation according to scope 1.