CN202758854U - Injection device, stamping and injection linkage device and chip packaging system - Google Patents
Injection device, stamping and injection linkage device and chip packaging system Download PDFInfo
- Publication number
- CN202758854U CN202758854U CN2012204106336U CN201220410633U CN202758854U CN 202758854 U CN202758854 U CN 202758854U CN 2012204106336 U CN2012204106336 U CN 2012204106336U CN 201220410633 U CN201220410633 U CN 201220410633U CN 202758854 U CN202758854 U CN 202758854U
- Authority
- CN
- China
- Prior art keywords
- slicken solder
- injection device
- control valve
- injection
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model discloses an injection device, a stamping and injection linkage device and a chip packaging system. The stamping and injection linkage device comprises a driving base, an upper base convex die, a lower base concave die and the injection device, wherein the upper base convex die and the injection device are fixedly arranged under the driving base at an interval; the lower base concave die is arranged below the upper base convex die and the injection device; positions, which are corresponding to the upper base convex die and the injection device, on the lower base concave die are respectively provided with framework grooves used for placing framework chip loading tables. The utility model further discloses an injection device and a chip packaging system, the grooves are stamped on the framework chip loading tables, the soft solder arranged in the grooves cannot overflow, and the uneven phenomenon of the soft solder caused by the overflow of the soft solder due to the problems of Z-directional accuracy of welding head of the chip loader or unequal tin dipping properties in parts of the framework chip loading tables can be prevented, and the thickness and uniformity of the soft solder can be controlled according to the requirements, so that the thickness and uniformity of the soft solder can meet the standards; in addition, since the tin dripping and film pressing devices are removed and corresponding actions are omitted, the production efficiency can be improved, and the manufacturing requirements for the chip packaging system can be reduced.
Description
Technical field
The utility model relates to the integrated antenna package technology, relates in particular to injection device, punching press and injection linkage and chip package system.
Background technology
In semiconductor package process, power device especially, need to by slicken solder with chip attach to the lead frame slide holder, realize the function that is electrically connected of chip and lead frame.
Slicken solder thickness and uniformity are to consider the leading indicator of slicken solder bonding chip, and in traditional slicken solder load pattern, point was on framework slide holder surface after slicken solder melted.Because the slicken solder after melting is semicircle or spherical, has flowability, so that the thickness of slicken solder is difficult to control, and uniformity is bad, causes easily the conduction of slicken solder heat and poorly conductive, and conducting resistance differs greatly.In the power device package, the chip caloric value is larger, the coefficient of expansion between framework and the chip is different simultaneously, need slicken solder as the thermal stress buffering area, slicken solder thickness is not enough or inhomogeneous, easily produce die crack or cause the soft soldering bed of material with the framework slide holder between lamination, the reduction product reliability.For preventing that phenomenon is on the impact of product quality here, slicken solder thickness must be controlled at more than the 20um, and uniformity is controlled in the 10um.But because lead frame itself is stained with the lubricant nature impact to slicken solder, the size lead frame error, the loading device orbit error, equipment press mold Z value error etc. all can exert an influence to slicken solder thickness and uniformity.Therefore how guaranteed output device slicken solder thickness is the difficult problem that semiconductor power device encapsulates with uniformity always.
At present, loading device appends press mold technique, and the slicken solder after melting is being pressed shaping, the slicken solder shape is suppressed the shape that needs.Seeing also Fig. 6 A to Fig. 6 F, wherein, is each step schematic diagram of existing chip packaging method shown in Fig. 6 A to Fig. 6 F, and existing chip packaging method specifically comprises the steps:
The first step adopts some tin device 20 that slicken solder 30 is dripped on the framework slide holder 10;
Second step, extraction point tin device 20;
In the 3rd step, adopt film pressing device 40 with described slicken solder 30 press mold moulding;
In the 4th step, chip 50 is positioned on the described slicken solder 30;
In the 5th step, described slicken solder 30 is subject to the extruding of described chip 50, because the periphery of slicken solder 30 does not have obstacle, therefore, slicken solder 30 is irregular excessive around the framework slide holder 10 easily;
In the 6th step, owing to the effect that slicken solder 30 refluxes, slicken solder 30 can be towards the centre and is upwards tieed up very (namely keep and straighten), and the action that refluxes is finished, but owing to excessive unrestricted, causes easily the in uneven thickness of slicken solder 30 after the backflow.
By Fig. 6 A to Fig. 6 F as seen, existing chip packaging method and device have following defective
1. can't solve slicken solder 30 amount when too much or very few, slicken solder 30 shapes meet the requirements, thickness and the uniformity of remote-effects chip 50 below slicken solders 30;
2. it is higher that device rate is subject to the impact of a tin device 20 and film pressing device 50 and device fabrication difficulty and cost;
3. the extruding the when slicken solder 30 of press mold shaping is subject to loader soldering tip bonding die easily produces the excessive phenomenon of slicken solder, causes chip 50 below slicken solders, 30 thickness deficiencies or slicken solder 30 difference in thickness larger;
4. when the press mold technology is can't 10 tin sticky of solution framework slide holder bad, the slicken solder 30 bad less than normal or non-uniform phenomenon of slicken solder thickness that causes that refluxes.
The utility model content
In view of there are the problems referred to above in existing press mold technology, main purpose of the present utility model is to solve the prior art defective, a kind of injection device, punching press and injection linkage and chip package system are provided, can control as required slicken solder thickness and uniformity, make load glue thickness meet the requirements of thickness and uniformity index; And remove some tin, film pressing device and corresponding actions thereof, can enhance productivity, reduce the manufacturing requirement to the chip package system.
To achieve the above object, the utility model adopts following technical scheme:
The utility model discloses a kind of injection device, comprise that support body, electromagnetic pressure control valve, slicken solder melt chamber, slicken solder flow control valve and temperature control heating device, described slicken solder melts the inside that the chamber is arranged at described support body, described electromagnetic pressure control valve is arranged at and is used on the support body slicken solder is introduced in the described slicken solder thawing chamber, the bottom that described slicken solder melts the chamber is provided with the slicken solder flow control valve, and described temperature control heating device is arranged on the described support body.
Preferably, in above-mentioned injection device, described temperature control heating device comprises some all around calandria and heating power flow control valves that are arranged at the bottom of described support body and are positioned at described slicken solder thawing chamber, and described calandria is connected with described heating power flow control valve respectively.
Preferably, in above-mentioned injection device, described slicken solder flow control valve is the two automatically controlled and flow control valves of two five-ways.
Preferably, in above-mentioned injection device, also be provided with for detection of and show the digital controlled pressure table of the pressure of the slicken solder in the described slicken solder thawing chamber on the described support body.
The invention also discloses a kind of punching press and inject linkage, comprise and drive pedestal, seat of honour punch, a lower die and aforesaid injection device, described seat of honour punch and described injection device interval are fixedly installed on the below of described driving pedestal, a described lower die is positioned at the below of described seat of honour punch and described injection device, and the position of corresponding described seat of honour punch and described injection device is offered respectively for the frame slot of placing the framework slide holder on the described lower die.
Preferably, at above-mentioned punching press and injection linkage, described electromagnetic pressure control valve is arranged at the top that described slicken solder melts the chamber, the position of the corresponding described electromagnetic pressure control valve of described seat of honour punch is provided with the slicken solder passage, one end of described slicken solder passage is connected with described electromagnetic pressure control valve, and the other end is as dog-house.
The invention also discloses a kind of chip package system, comprise aforesaid punching press and inject linkage and loading device that described loading device comprises for loading and heating the loading device track of described framework slide holder and be used for chip is put into loader soldering tip on the slicken solder of thawing.
The injection device that the utility model provides, punching press and injection linkage and chip package system, by in the framework slide holder, stamping out groove, slicken solder can be injected in the described groove, the sidewall of groove can stop described slicken solder excessive, therefore can not exist because of loader soldering tip Z-direction precision or the local tin sticky of the framework problem that differs and cause the excessive slicken solder phenomenon in uneven thickness that causes of slicken solder, make the thickness of load glue (being the slicken solder after the load) meet the requirements of thickness and uniformity index, but also can save the anti-overflow groove technique of framework slide holder edge punching press, groove can also increase the adhesion between plastic-sealed body and the framework simultaneously, to preventing that layering has positive effect between slide holder and chip slicken solder.On the other hand, the utility model, abandon the processing step (i.e. material technique and press mold technique) that loading device point slicken solder in traditional encapsulation process and press mold be shaped and put accordingly materials device and film pressing device, can avoid occurring the phenomenon that impact that slicken solder is subjected to framework slide holder surface tin sticky situation/loader soldering tip Z-direction precision produces the in uneven thickness and person's thickness deficiency of slicken solder, simultaneously, owing to reduced some material, press mold technique, the manufacturing of chip package system requires to reduce, speed promotes, and has saved cost.
In addition, the utility model is in the framework slide holder drawing stage, utilize diel originally, append working terminal, use linkage structure, namely by described seat of honour punch and described injection device interval being fixedly installed on the below of described driving pedestal, a described lower die is positioned at the below of described seat of honour punch and described injection device, the position of corresponding described seat of honour punch and described injection device is offered respectively for the frame slot of placing the framework slide holder on the described lower die, can finish synchronously the groove punching press of different frames slide holder and slicken solder and inject, Effective Raise operating efficiency.
Description of drawings
Injection device of the present utility model, punching press and injection linkage and chip package system are provided by following embodiment and accompanying drawing.
Fig. 1 be the utility model one embodiment the chip package system in punching press and the structural representation that injects before the linkage punching press.
Fig. 2 is the structural representation after the injection device of the utility model one embodiment is finished punching press.
Fig. 3 is the punching press of the utility model one embodiment and injects the structural representation that linkage unclamps the framework slide holder.
Fig. 4 is the structural representation of the injection device of the utility model one embodiment.
Fig. 5 A to Fig. 5 D is each substep schematic diagram in the 5th step in the method for packing of chip package system of the utility model one embodiment.
Fig. 6 A to Fig. 6 F is each step schematic diagram of existing chip packaging method.
Among the figure, 1-framework slide holder, 2-groove, 3-slicken solder, the 4-chip, 5-drives pedestal, 6-seat of honour punch, the lower die of 7-, the 8-injection device, the 81-support body, 82-electromagnetic pressure control valve, the 83-slicken solder melts the chamber, 84-slicken solder flow control valve, 85-calandria, 86-heating power flow control valve, the digital controlled pressure table of 87-, 9-slicken solder passage, 91-dog-house, 10-framework slide holder, 20-point tin device, the 30-slicken solder, 40-film pressing device, 50-chip.
Embodiment
Below with reference to accompanying drawings the utility model is described in more detail, has wherein represented preferred embodiment of the present utility model, should be appreciated that those skilled in the art can revise the utility model described here and still realize advantageous effects of the present utility model.Therefore, following description is appreciated that extensively knowing for those skilled in the art, and not as to restriction of the present utility model.
For the purpose of this utility model, feature are become apparent, below in conjunction with accompanying drawing embodiment of the present utility model is further described.It should be noted that accompanying drawing all adopts very the form of simplifying and all uses non-accurately ratio, only in order to convenient, the purpose of aid illustration the utility model embodiment lucidly.
See also Fig. 1 to Fig. 3, wherein, Figure 1 shows that punching press and the structural representation that injects before the linkage punching press in the chip package of the present utility model system, the injection device that Figure 2 shows that the utility model one embodiment is finished the structural representation after the punching press, the punching press that Figure 3 shows that the utility model one embodiment and the structural representation that injects linkage and unclamp the framework slide holder.The chip package system that present embodiment provides, comprise punching press and inject linkage and loading device, described punching press is injected the slicken solder 3 that melts with the injection linkage for stamping out at framework slide holder 1 be used to the groove 2 that holds slicken solder and at described groove 2, described loading device is used for described slicken solder being melted and chip 4 being cohered at described slicken solder 3, and described loading device comprises for loading and heating the loading device track of described framework slide holder 1 and be used for chip 4 is put into the loader soldering tip of the slicken solder 3 of thawing.This chip package system, by in framework slide holder 1, stamping out groove 2, slicken solder 3 can be injected in the described groove 2, on the one hand, therefore the sidewall of groove 2 can be used as body of wall and surrounds slicken solder, can not occur causing that because of loader soldering tip Z-direction precision or the local tin sticky of the framework slide holder problem that differs slicken solder 3 excessive institutes cause non-uniform phenomenon; On the other hand, can also save the anti-overflow groove technique of framework slide holder edge punching press, thereby save processing step, enhance productivity; Again on the one hand, groove 2 can increase plastic-sealed body and 1 adhesion of framework slide holder, the effect of described plastic-sealed body is with framework slide holder, slicken solder and chip package together, by setting up groove, can make framework slide holder 1, slicken solder 3 and 4 combinations of chip more reliable, prevent that steam from entering, therefore reduce the layering of framework slide holder, slicken solder and the chip chamber of plastic-sealed body inside.
Wherein, described punching press and injection linkage, comprise and drive pedestal 5, seat of honour punch 6, lower seat die 7 and injection device 8, described seat of honour punch 6 and described injection device 8 intervals are fixedly installed on the below of described driving pedestal 5, a described lower die 7 is positioned at the below of described seat of honour punch 6 and described injection device 8, corresponding described seat of honour punch 6 is offered respectively for the frame slot of placing framework slide holder 1 with the position of described injection device 8 on the described lower die 7, the position of corresponding described seat of honour punch 6 is offered be used to placing framework slide holder 1 to be punched on the wherein said lower die 7, and the position of corresponding described injection device 8 is offered be used to the frame slot of placing punching press place groove and treat the framework slide holder 1 that slicken solder injects on the described lower die 7.Adopt the as above punching press and injection linkage of structure, can be in the drawing stage of framework slide holder 1, utilize diel originally, append working terminal, use linkage structure, can finish synchronously groove 2 punch steps and slicken solder 3 implantation steps of different frames slide holder 1, thereby, Effective Raise operating efficiency.
See also Fig. 4, and please in conjunction with Fig. 1 to Fig. 3, described injection device 8 specifically comprises support body 81, electromagnetic pressure control valve 82, slicken solder melts chamber 83, slicken solder flow control valve 84 and temperature control heating device, described slicken solder melts the inside that chamber 83 is arranged at described support body 81, described electromagnetic pressure control valve 82 is arranged at and is used on the support body 81 slicken solder 3 is introduced in the described slicken solder thawing chamber 83, the bottom that described slicken solder melts chamber 83 is provided with slicken solder flow control valve 84, this slicken solder flow control valve 84 can be controlled injection rate and the charge velocity of described slicken solder 3, described temperature control heating device is arranged on the described support body 81, is used for described slicken solder 3 is heated to required state.Adopt the injection device of said structure, have the advantage that the slicken solder implantation dosage is accurate, injection technology is stable.
Better, in the present embodiment, described temperature control heating device comprises some all around calandria 85 and heating power flow control valves 86 that are arranged at the bottom of described support body 81 and are positioned at described slicken solder thawing chamber 83, and described calandria 85 is connected with described heating power flow control valve 86 respectively.The calandria 85 all around that is positioned at described slicken solder thawing chamber 83 can melt the slicken solder 3 in chamber 83 by the described slicken solder of homogeneous heating, the calandria that is arranged at the bottom of described support body 81 can heat the slicken solder 3 that has been injected in the groove, prevents that slicken solder 3 from stopping to flow so that slicken solder 3 injection deficiencies because solidifying.
Better, in the present embodiment, described slicken solder flow control valve 84 is the two automatically controlled and flow control valves of two five-ways, it has compact conformation, the accurate advantage of flow control.
Better, in the present embodiment, described electromagnetic pressure control valve 82 is arranged at the top that described slicken solder melts chamber 83, the position of described seat of honour punch 6 corresponding described electromagnetic pressure control valves 82 is provided with slicken solder passage 9, one end of described slicken solder passage 9 is connected with described electromagnetic pressure control valve 82, and the other end is as dog-house 91.Adopt this structure, simple in structure, slicken solder 3 can utilize gravity to flow into electromagnetic pressure control valve 82.
Better, in the present embodiment, also be provided with for detection of and show the digital controlled pressure table 87 of the pressure of the slicken solder 3 in the described slicken solder thawing chamber 83 on the described support body 81.Operating personnel can monitor and control the pressure that slicken solder melts the slicken solder 3 in the chamber 83 by digital controlled pressure table 87.
Please in conjunction with Fig. 1 to Fig. 4.The method for packing of the chip package system that present embodiment provides comprises the steps:
The first step, at framework slide holder 1(or be called lead frame) stamp out the groove 2 that holds slicken solder;
Second step injects the slicken solder 3 that melts in described groove 2;
In the 3rd step, described slicken solder 3 cooling postforming are stand-by, better, and in the chip packaging method of present embodiment, in described the 3rd step, it is stand-by that described slicken solder 3 cools off postforming naturally.
In the 4th step, in the loading device track, described slicken solder 3 is melted;
The 5th step, chip 4 is cohered on described slicken solder 3, described slicken solder 3 refluxes and cools off, and finishes load work.Preferably, see also Fig. 5 A to Fig. 5 D, Fig. 5 A to Fig. 5 D is each substep schematic diagram in the 5th step in the method for packing of chip package system of the utility model one embodiment.In the chip packaging method of present embodiment, described the 5th step comprises following substep:
The 51st step, please specifically consult Fig. 5 A, framework slide holder 1 is heated in the loading device track, so that the slicken solder 3 in its groove 2 melts;
The 52nd step, please specifically consult Fig. 5 B, chip 4 is placed in the described slicken solder 3;
The 53rd goes on foot, and please specifically consults Fig. 5 C, and slicken solder 3 is subject to chip 4 extruding to flowing, because reeded sidewall stops that therefore, slicken solder can't be excessive all around all around;
The 54th step, please specifically consult Fig. 5 D, slicken solder 3 to intermediate reflux, that is to say that under effect of inertia slicken solder 3 refluxes to move and finishes because the effect of inertia can also make progress dimension very towards the centre.
In sum, the injection device that the utility model provides, punching press and injection linkage and chip package system, by in the framework slide holder, stamping out groove, slicken solder can be injected in the described groove, the sidewall of groove can stop described slicken solder excessive, therefore can not exist because of loader soldering tip Z-direction precision or the local tin sticky of the framework problem that differs and cause the excessive slicken solder phenomenon in uneven thickness that causes of slicken solder, make the thickness of load glue (being the slicken solder after the load) meet the requirements of thickness and uniformity index, but also can save the anti-overflow groove technique of framework slide holder edge punching press, groove can also increase the adhesion between plastic-sealed body and the framework simultaneously, to preventing that layering has positive effect between slide holder and chip slicken solder.On the other hand, the utility model, abandon the processing step (i.e. material technique and press mold technique) that loading device point slicken solder in traditional encapsulation process and press mold be shaped and put accordingly materials device and film pressing device, can avoid occurring the phenomenon that impact that slicken solder is subjected to framework slide holder surface tin sticky situation/loader soldering tip Z-direction precision produces the in uneven thickness and person's thickness deficiency of slicken solder, simultaneously, owing to reduced some material, press mold technique, the manufacturing of chip package system requires to reduce, speed promotes, and has saved cost.
In addition, the utility model is in the framework slide holder drawing stage, utilizes diel originally, appends working terminal, uses linkage structure, and groove punching press and the slicken solder that can finish synchronously the different frames slide holder inject, thereby, Effective Raise operating efficiency.
Obviously, those skilled in the art can carry out various changes and modification to the utility model and not break away from spirit and scope of the present utility model.Like this, if of the present utility model these are revised and modification belongs within the scope of the utility model claim and equivalent technologies thereof, then the utility model also is intended to comprise these changes and modification interior.
Claims (8)
1. injection device, comprise that support body, electromagnetic pressure control valve, slicken solder melt chamber, slicken solder flow control valve and temperature control heating device, described slicken solder melts the inside that the chamber is arranged at described support body, described electromagnetic pressure control valve is arranged at and is used on the support body slicken solder is introduced in the described slicken solder thawing chamber, the bottom that described slicken solder melts the chamber is provided with the slicken solder flow control valve, and described temperature control heating device is arranged on the described support body.
2. injection device according to claim 1, it is characterized in that, described temperature control heating device comprises some all around calandria and heating power flow control valves that are arranged at the bottom of described support body and are positioned at described slicken solder thawing chamber, and described calandria is connected with described heating power flow control valve respectively.
3. injection device according to claim 1 is characterized in that, described slicken solder flow control valve is the two automatically controlled and flow control valves of two five-ways.
4. injection device according to claim 1 is characterized in that, also is provided with for detection of and shows the digital controlled pressure table of the pressure of the slicken solder in the described slicken solder thawing chamber on the described support body.
A punching press with inject linkage, it is characterized in that, comprise and drive pedestal, seat of honour punch, a lower die and such as the described injection device of any one in the claim 1 ~ 4, described seat of honour punch and described injection device interval are fixedly installed on the below of described driving pedestal, a described lower die is positioned at the below of described seat of honour punch and described injection device, and the position of corresponding described seat of honour punch and described injection device is offered respectively for the frame slot of placing the framework slide holder on the described lower die.
6. punching press according to claim 5 and injection linkage, it is characterized in that, described electromagnetic pressure control valve is arranged at the top that described slicken solder melts the chamber, the position of the corresponding described electromagnetic pressure control valve of described seat of honour punch is provided with the slicken solder passage, one end of described slicken solder passage is connected with described electromagnetic pressure control valve, and the other end is as dog-house.
7. chip package system, comprise punching press as claimed in claim 5 and inject linkage and loading device that described loading device comprises for loading and heating the loading device track of described framework slide holder and be used for chip is put into loader soldering tip on the slicken solder of thawing.
8. chip package system, comprise punching press as claimed in claim 6 and inject linkage and loading device that described loading device comprises for loading and heating the loading device track of described framework slide holder and be used for chip is put into loader soldering tip on the slicken solder of thawing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012204106336U CN202758854U (en) | 2012-08-17 | 2012-08-17 | Injection device, stamping and injection linkage device and chip packaging system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012204106336U CN202758854U (en) | 2012-08-17 | 2012-08-17 | Injection device, stamping and injection linkage device and chip packaging system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202758854U true CN202758854U (en) | 2013-02-27 |
Family
ID=47738021
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012204106336U Withdrawn - After Issue CN202758854U (en) | 2012-08-17 | 2012-08-17 | Injection device, stamping and injection linkage device and chip packaging system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202758854U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102810489A (en) * | 2012-08-17 | 2012-12-05 | 杭州士兰集成电路有限公司 | Chip packaging system, chip packaging method, injecting device, and stamping and injecting linkage device |
-
2012
- 2012-08-17 CN CN2012204106336U patent/CN202758854U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102810489A (en) * | 2012-08-17 | 2012-12-05 | 杭州士兰集成电路有限公司 | Chip packaging system, chip packaging method, injecting device, and stamping and injecting linkage device |
| CN102810489B (en) * | 2012-08-17 | 2015-01-21 | 杭州士兰集成电路有限公司 | Chip packaging system, chip packaging method, injecting device, and stamping and injecting linkage device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104465595B (en) | CSP type MEMS package parts and production method based on custom lead-frame | |
| CN105428266B (en) | The product of flip-chip eutectic bonding method and acquisition with medium bridge | |
| CN107170694A (en) | Position adjusting mechanism, resin encapsulation equipment, the manufacture method of resin encapsulation method and resin-encapsulated product | |
| KR102220397B1 (en) | Resin molding apparatus and method for manufacturing resin-molded component | |
| KR102184809B1 (en) | Resin molding apparatus and method for manufacturing resin-molded component | |
| CN104124216A (en) | Substrate chip carrier CSP package and production method thereof | |
| CN202758854U (en) | Injection device, stamping and injection linkage device and chip packaging system | |
| CN102810489B (en) | Chip packaging system, chip packaging method, injecting device, and stamping and injecting linkage device | |
| TW201628107A (en) | Manufacturing method of semiconductor device | |
| CN106158783B (en) | Radiator fin device with anti-overflow plastic structure | |
| JP2019034445A (en) | Resin molding apparatus, and manufacturing method of resin molded product | |
| CN107275459A (en) | Potted element and its manufacture method | |
| CN109545769A (en) | Silicon chip package lead frame and its packaging method | |
| CN204067330U (en) | A kind of substrate chip support C SP packaging part | |
| CN102097340A (en) | Method for manufacturing SMD (surface mounted device) by COB (chip on board) glue filling and encapsulating | |
| CN108269778A (en) | A kind of biradical island SOP chip-packaging structures | |
| CN105448881A (en) | Framework exposed multi-core multi-lapping, tiling and core-sandwiching packaging structure and technological method thereof | |
| CN104810462A (en) | ESOP8 lead frame of medium-and high-power LED driving chip | |
| KR102527948B1 (en) | Resin molding device and manufacturing method of resin molding | |
| CN208608224U (en) | A kind of LED encapsulation structure of flip-chip formal dress | |
| CN207753004U (en) | A kind of biradical island SOP chip-packaging structures | |
| CN208164166U (en) | A kind of mechanism for QFN encapsulation | |
| CN105633051A (en) | Multi-chip multi-matching tiled sandwiched core package structure with partial framework exposed and process method of structure | |
| CN206819986U (en) | A kind of IC package structure for strengthening heat dispersion | |
| CN204596842U (en) | A kind of ESOP8 lead frame of middle great power LED driving chip |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20130227 Effective date of abandoning: 20150121 |
|
| RGAV | Abandon patent right to avoid regrant |