JPS5932146A - 半導体ウエハ−の検査装置 - Google Patents

半導体ウエハ−の検査装置

Info

Publication number
JPS5932146A
JPS5932146A JP14284682A JP14284682A JPS5932146A JP S5932146 A JPS5932146 A JP S5932146A JP 14284682 A JP14284682 A JP 14284682A JP 14284682 A JP14284682 A JP 14284682A JP S5932146 A JPS5932146 A JP S5932146A
Authority
JP
Japan
Prior art keywords
wafers
inspection
wafer
semiconductor wafer
inspecting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14284682A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6256661B2 (cg-RX-API-DMAC7.html
Inventor
Seiichi Nakamura
誠一 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP14284682A priority Critical patent/JPS5932146A/ja
Publication of JPS5932146A publication Critical patent/JPS5932146A/ja
Publication of JPS6256661B2 publication Critical patent/JPS6256661B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Sorting Of Articles (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP14284682A 1982-08-18 1982-08-18 半導体ウエハ−の検査装置 Granted JPS5932146A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14284682A JPS5932146A (ja) 1982-08-18 1982-08-18 半導体ウエハ−の検査装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14284682A JPS5932146A (ja) 1982-08-18 1982-08-18 半導体ウエハ−の検査装置

Publications (2)

Publication Number Publication Date
JPS5932146A true JPS5932146A (ja) 1984-02-21
JPS6256661B2 JPS6256661B2 (cg-RX-API-DMAC7.html) 1987-11-26

Family

ID=15324968

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14284682A Granted JPS5932146A (ja) 1982-08-18 1982-08-18 半導体ウエハ−の検査装置

Country Status (1)

Country Link
JP (1) JPS5932146A (cg-RX-API-DMAC7.html)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6188240U (cg-RX-API-DMAC7.html) * 1984-11-15 1986-06-09
JPS6196544U (cg-RX-API-DMAC7.html) * 1984-11-30 1986-06-21
US6923077B2 (en) 2002-02-25 2005-08-02 Samsung Electronics Co., Ltd. Apparatus and method for wafer backside inspection
WO2023241729A1 (en) * 2022-06-14 2023-12-21 Tcl Zhonghuan Renewable Energy Technology Co., Ltd. Silicon wafer sorting mechanism and sorting machine equipped with sorting mechanism

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50145077A (cg-RX-API-DMAC7.html) * 1974-05-10 1975-11-21
JPS5572875A (en) * 1978-11-27 1980-06-02 Nec Corp Sorting method for semiconductor element

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50145077A (cg-RX-API-DMAC7.html) * 1974-05-10 1975-11-21
JPS5572875A (en) * 1978-11-27 1980-06-02 Nec Corp Sorting method for semiconductor element

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6188240U (cg-RX-API-DMAC7.html) * 1984-11-15 1986-06-09
JPS6196544U (cg-RX-API-DMAC7.html) * 1984-11-30 1986-06-21
US6923077B2 (en) 2002-02-25 2005-08-02 Samsung Electronics Co., Ltd. Apparatus and method for wafer backside inspection
WO2023241729A1 (en) * 2022-06-14 2023-12-21 Tcl Zhonghuan Renewable Energy Technology Co., Ltd. Silicon wafer sorting mechanism and sorting machine equipped with sorting mechanism
US12311409B2 (en) 2022-06-14 2025-05-27 Tcl Zhonghuan Renewable Energy Technology Co., Ltd. Silicon wafer sorting mechanism and sorting machine equipped with sorting mechanism

Also Published As

Publication number Publication date
JPS6256661B2 (cg-RX-API-DMAC7.html) 1987-11-26

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