JPS5932142A - ワイヤボンダ - Google Patents

ワイヤボンダ

Info

Publication number
JPS5932142A
JPS5932142A JP57141139A JP14113982A JPS5932142A JP S5932142 A JPS5932142 A JP S5932142A JP 57141139 A JP57141139 A JP 57141139A JP 14113982 A JP14113982 A JP 14113982A JP S5932142 A JPS5932142 A JP S5932142A
Authority
JP
Japan
Prior art keywords
wire
bonding
ball
electrode
mixed gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57141139A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0338738B2 (enExample
Inventor
Kenichi Otsuka
大塚 憲一
Wahei Kitamura
北村 和平
Hiroshi Mikino
三木野 博
Hajime Sato
佐藤 始
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP57141139A priority Critical patent/JPS5932142A/ja
Publication of JPS5932142A publication Critical patent/JPS5932142A/ja
Publication of JPH0338738B2 publication Critical patent/JPH0338738B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711
    • H10W72/01551
    • H10W72/07141
    • H10W72/075
    • H10W72/07511
    • H10W72/50
    • H10W72/536
    • H10W72/5363
    • H10W72/5524
    • H10W72/884
    • H10W74/00
    • H10W90/736
    • H10W90/756

Landscapes

  • Wire Bonding (AREA)
JP57141139A 1982-08-16 1982-08-16 ワイヤボンダ Granted JPS5932142A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57141139A JPS5932142A (ja) 1982-08-16 1982-08-16 ワイヤボンダ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57141139A JPS5932142A (ja) 1982-08-16 1982-08-16 ワイヤボンダ

Publications (2)

Publication Number Publication Date
JPS5932142A true JPS5932142A (ja) 1984-02-21
JPH0338738B2 JPH0338738B2 (enExample) 1991-06-11

Family

ID=15285071

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57141139A Granted JPS5932142A (ja) 1982-08-16 1982-08-16 ワイヤボンダ

Country Status (1)

Country Link
JP (1) JPS5932142A (enExample)

Also Published As

Publication number Publication date
JPH0338738B2 (enExample) 1991-06-11

Similar Documents

Publication Publication Date Title
US4976393A (en) Semiconductor device and production process thereof, as well as wire bonding device used therefor
US3747198A (en) Tailless wedge bonding of gold wire to palladium-silver cermets
US4564734A (en) Wire bonder
JPS5832427A (ja) ボ−ルボンデイングの為のアルミニウムボ−ルを形成する装置及び方法
JPS5932142A (ja) ワイヤボンダ
US5087590A (en) Method of manufacturing semiconductor devices
JPH05211192A (ja) 半導体装置のワイヤボンディング方法
JPS63164230A (ja) ワイヤボンディング方法
JPS61119052A (ja) 非貴金属ワイヤボンデイング方法
JPH0530060B2 (enExample)
JPS63266845A (ja) ワイヤボンデイング装置
JPS5940540A (ja) ワイヤボンダ
JPS6146034A (ja) ワイヤポンダ
JPS63293933A (ja) ワイヤボンディング方法およびワイヤボンディング装置
JPH02125631A (ja) 半導体装置およびその製造方法並びにそれに使用されるワイヤボンディング装置
JPH0447972B2 (enExample)
JPS61117847A (ja) ボンデイング用金属突起の形成方法
JPS6158247A (ja) ワイヤボンデイング方法
JPS6154638A (ja) ワイヤボンデイング装置
JPH0656860B2 (ja) 超電導装置
JPS60177639A (ja) 半導体装置の製造方法
JPS59219935A (ja) ボンデイング方法
JPH0325019B2 (enExample)
JPS63300522A (ja) 半導体装置
JPS58161332A (ja) ワイヤボンデイング装置