JPS592938Y2 - Fluxer - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present application relates to a fluxer used for soldering printed circuit boards, and particularly to a spray set fluxer.

Fluxer is generally used for soldering printed circuit boards.
A porous hollow cylindrical tube called a foaming tube is immersed in a flux tank, and the flux is foamed by blowing air into the foaming tube.

A foaming type fluxer (hereinafter referred to as a foaming fluxer) sprays foamed Kerax in a mountain shape, and applies flux by bringing a printed circuit board into contact with the top of the jet.

When flux is applied to a printed circuit board using the foaming fluxer, the flux may ooze out from the component insertion hole, or the jetted flux may sneak around from the edge of the printed circuit board and seep out.

As a result, it not only deteriorates the appearance of the printed circuit board, but also may adhere to mounted electronic components, in which case the performance thereof may be significantly impaired.

In addition, the application state of foaming fluxer changes depending on the size of the bubbles, the height of the jet, etc., and because it is difficult to adjust these, there is a drawback that it is difficult to apply uniformly to printed circuit boards and control the amount of application. .

Recently, so-called spray set fluxers have appeared that spray flux in small droplets with air, but this is because the flux does not ooze out from the component insertion hole, and it is possible to control the amount of uniform application and the amount of application. It is suitable for soldering precision electronic equipment because it is easy to solder.

However, even with this spray set fluxer, small droplets of flux enter from the edges of the printed circuit board and adhere to the surface of the printed circuit board, and as with the foaming type described above, the adhesion of flux may have an adverse effect.

Conventionally, in order to prevent flux from seeping out from the component insertion holes of printed circuit boards, it has been proposed to install air nozzles with random ejection holes above a foaming type fluxer (1987). -37861).

The air nozzle used here is effective in preventing the foaming flux from seeping out from the holes drilled in the printed circuit board because the air nozzles are random, but the flux is sprayed in a straight line like a spray set fluxer. cannot be prevented from entering the surface of the printed circuit board.

The purpose of this application is to prevent the above-mentioned flux from entering the spray set fluxer, and its feature lies in the fact that a plurality of air nozzles are installed above the spray set fluxer.

Figure 1 is a plan view of the embodiment of the present invention, Figure 2 is Figure 1 ■■
-■■ line sectional view.

The spray set fluxer has a roll 1 having a cylindrical mesh, a flux tank 2, and a spray nozzle 3 as the main groove or part.

The roll 1 is rotated by a rotation device (not shown), and a portion of the roll 1 is immersed in flux in a flux tank 2.

The flux tank 2 is shaped so as to surround the roll 1, and has an adjustable gap 4 above for spraying flux.

The gap 4 can also be adjusted in the lateral direction according to the width of the printed circuit board.

A spray nozzle 3 is installed inside the roll 1 to spray air upward.

Air is supplied to the spray nozzle 3 from the rotating shaft of the roll 1, and its length is approximately the same as the length of the roll.

In the spray set fluxer constructed as described above, a roll 1 with flux adhered to the mesh rotates and the Kerax is blown off as fine droplets by air injected from a spray nozzle 2.

The spray area of the flux in the form of small droplets is adjusted in the gap 4 of the flux tank 2, and the flux is applied to the back surface of the printed circuit board that passes over the top of the fluxer, which is the solder part.

The amount of flux applied by the spray fluxer can be adjusted by the rotational speed of the roll and the air pressure from the spray nozzle.

With the spray set fluxer, when a printed circuit board is positioned above the fluxer, the pallet holding the printed circuit board turns on the limit switch for flux injection, and flux is sprayed while the printed circuit board passes through.

However, when the pallet approaches above the fluxer and the limit switch is turned on, the injected flux enters the printed circuit board from the front in the direction of movement and adheres to the surface of the circuit board.

Furthermore, the width of the gap in the flux tank is adjusted to match the width of the substrate, but since the flux jetting force is strong, when the substrate passes above the fluxer, it also enters from the side of the substrate.

Furthermore, the limit switch is turned off immediately after passing the board, but at this time it is also turned on from the rear of the board.

Therefore, when riding on a spray set fluxer, the substrate enters from the front just before it enters above the fluxer, from the side while passing through the fluxer, and from the rear immediately after passing.

In the present application, three air nozzles 5.
6 and 7 were installed.

The three air nozzles are installed in a state transverse to the direction in which the printed circuit board advances, and the air nozzle 6 in the center is located at a position corresponding to the ejection direction of the spray nozzle 3 of the fluxer.

Each air nozzle has a number of downwardly directed jet ports, from which air sent from a compressor (not shown) is jetted.

In the present invention, three air nozzles are installed above the spray set fluxer, and the central air nozzle is made to correspond to the spray nozzle for the following reasons.

First, since the first air nozzle 5 sprays air onto the printed circuit board before the flux is jetted from the spray nozzle 3, it prevents the flux from entering from the front of the circuit board.

Next, since the second air nozzle 6 in the center is located at a position corresponding to the spray nozzle 3, it prevents the flux from entering the substrate from directly above the spray nozzle.

Since the third air nozzle 7 continues to blow air onto the surface of the substrate even after the injection from the fluxer has stopped, it is possible to prevent flux from entering from behind the substrate.

In this way, the three air nozzles installed above the spray set fluxer prevent flux from entering the substrate at different positions.

Therefore, even if you install just one air nozzle in a position that corresponds to the spray nozzle, or even if you install three air nozzles, if the central air nozzle does not correspond to the gas spray nozzle, the effect will be halved. Furthermore, conventional air nozzles with random jet ports cannot be expected to have any effect.

As explained above, the invention of the present invention is a spray set fluxer that can completely prevent flux from entering the surface of the printed circuit board, so soldering not only does not spoil the aesthetic appearance of electronic devices afterwards. , which further improves reliability.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a plan view of an embodiment of the present invention, and FIG. 1 is a sectional view taken along the line II-II. Figure 2 shows 1...roll, 2...flux tank, 3...spray nozzle, 4...flux tank gap, 5.6, 7
...Air nozzle.

Claims (1)

[Scope of utility model registration request] Above the spray set fluxer, three air nozzles with jet ports are installed below, across the direction in which the printed circuit board advances, and the center air nozzle is located at a position corresponding to the spray nozzle. Featured fluxer