JPS59100590A - Waxing processor for soldering device - Google Patents

Waxing processor for soldering device

Info

Publication number
JPS59100590A
JPS59100590A JP20928882A JP20928882A JPS59100590A JP S59100590 A JPS59100590 A JP S59100590A JP 20928882 A JP20928882 A JP 20928882A JP 20928882 A JP20928882 A JP 20928882A JP S59100590 A JPS59100590 A JP S59100590A
Authority
JP
Japan
Prior art keywords
wax
molten wax
valve
gear pump
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP20928882A
Other languages
Japanese (ja)
Other versions
JPH0145753B2 (en
Inventor
近藤 権士
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP20928882A priority Critical patent/JPS59100590A/en
Publication of JPS59100590A publication Critical patent/JPS59100590A/en
Publication of JPH0145753B2 publication Critical patent/JPH0145753B2/ja
Granted legal-status Critical Current

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  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 この発明は、はんだ付けされるべき電子部品を装着した
プリント基板に溶融ワックスを吹き付けて仮固定するは
んだ付は装置のワックス処理部に関するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a wax processing section of a soldering device that sprays molten wax onto a printed circuit board on which electronic components to be soldered are attached to temporarily fix the soldering device.

第1図は従来のはんだ付は装置の一例を示すブロック図
で、1ははんだ付は装置の全体を示し、2は予備はんだ
付は処理装置、3はカッティング装置、4は仕上げはん
だ付は処理装置である。こttうの装置で、5,9はフ
ランクス処理器、6110は予備加熱器、7はディップ
式のはんだ槽、8、12は冷却器、11は噴流式のはん
だ槽である。
Fig. 1 is a block diagram showing an example of conventional soldering equipment, where 1 shows the entire soldering equipment, 2 shows the processing equipment for preliminary soldering, 3 shows the cutting equipment, and 4 shows the processing equipment for final soldering. It is a device. In this apparatus, 5 and 9 are Franks processors, 6110 is a preheater, 7 is a dip type solder bath, 8 and 12 are coolers, and 11 is a jet type solder bath.

第2図は電子部品がプリント基板に装Hされた態様な示
す部分側断面図で、13はプリント基板、14は抵抗器
、コンデンサ、IC等の電子部品、15は前記電子部品
14のリード線(fたはリード端子)、16は前記リー
ド線(またはリード端子)15Y挿通するスルーホール
である。
FIG. 2 is a partial side cross-sectional view showing a mode in which electronic components are mounted on a printed circuit board, where 13 is a printed circuit board, 14 is an electronic component such as a resistor, capacitor, IC, etc., and 15 is a lead wire of the electronic component 14. (f is a lead terminal), 16 is a through hole through which the lead wire (or lead terminal) 15Y is inserted.

このように、従来のはんだ付は装置では、予備はんだ付
は処理と仕上げはんだ付は処理の2回にわたってプリン
ト基板13乞加熱して溶融はんだを付着させるためはん
だの消耗が多く、かつプリント基板13と電子部品14
とが熱影響を受け、また、IC部品のリード端子15乞
プリント基板13のスルーホール16に挿通してから仕
上げはんだ付は処理を行うとき、噴流はんだの勢により
IC部品が浮き上がってしまう等の欠点があった。
In this way, with conventional soldering equipment, the printed circuit board 13 is heated and molten solder is applied twice, once for preliminary soldering and once for final soldering, resulting in a large amount of solder consumption. and electronic components 14
In addition, when final soldering is performed after inserting the lead terminals 15 of IC components into the through holes 16 of the printed circuit board 13, the IC components may be lifted up by the force of the solder jet. There were drawbacks.

また、予備はんだ付は処理装置2は仕上げはんだ付は処
理装置4と同様の設備を有するため、はんだ付は装置1
全体が太ぎくなり、はんだ付は装置1′?:設置する場
合に広い場所を必要とするので経費がかかる欠点があっ
に0 この発明は、上記の欠点乞解消するためになされkもの
で、溶融ソックスtプリント基板の上面に吹き付けた後
、冷却して電子部品をワックスで覆ってプリント基板に
仮固定するようにしたはんだ付は装置のワックス処理部
を設けたものである。
In addition, since processing equipment 2 for preliminary soldering has the same equipment as processing equipment 4 for finishing soldering, equipment 1 for soldering
The whole thing is thicker, and the soldering is done using device 1'? :The disadvantage is that it requires a large space to install and is expensive.This invention was made to solve the above disadvantages.After spraying the melting socks onto the top surface of the printed circuit board, For soldering, in which electronic components are covered with wax and temporarily fixed to a printed circuit board, a wax processing section of the device is provided.

以下、この発明を図面に基づいて説明する。The present invention will be explained below based on the drawings.

第3図はこの発明の一実施例を示す概略構成図で、21
はキャリアレスのはんだ付は侍会装置の全体を示す。2
2Aは固定側の搬送チェノ、22Bは可動側の搬送チェ
ノ、23はワックス付は処理装置、24はワックス処理
部、25は加熱により液状の流体となった溶融ワックス
である。また、第1図、第2図と同じ符号は同一のもの
を示す。
FIG. 3 is a schematic configuration diagram showing an embodiment of the present invention.
shows the entire Samurai device with carrier-less soldering. 2
Reference numeral 2A indicates a fixed-side conveying chino, 22B a movable-side conveying chino, 23 a processing device with wax, 24 a wax processing section, and 25 molten wax that has been turned into a liquid fluid by heating. Further, the same reference numerals as in FIGS. 1 and 2 indicate the same parts.

次に、第3図の動作について説明ゴーな。Next, let me explain the operation shown in Figure 3.

プリント基板13に電子部品14を装着してリード線1
5を下方へ突出させる。
Mount the electronic component 14 on the printed circuit board 13 and connect the lead wire 1
5 protrudes downward.

次に、ワックス処理部24でプリント基板13の上面に
溶融ワックス25が吹き付けられ、その後、吹き付けら
れた溶融ワックス25は冷却器8で固化されるので、プ
リント基板13上に電子部品14は固化したワックスで
覆われて固定される。
Next, molten wax 25 is sprayed onto the top surface of the printed circuit board 13 in the wax processing section 24, and then the sprayed molten wax 25 is solidified in the cooler 8, so that the electronic components 14 are solidified on the printed circuit board 13. Covered with wax and fixed.

まπ、IC部品の場合は、リード端子15とスルーポー
ル16との間にも溶融ワックス25が浸透して固定され
る。
In the case of an IC component, the molten wax 25 also penetrates between the lead terminal 15 and the through pole 16 and is fixed.

矢に、カッティング装置3でリード線15が切断され、
仕上げはんだ付は処理装置4でフラックス処理器9.予
備加熱器10.はんだ槽11.冷却器12の各処理工程
を経てはんだ付げされる。
The lead wire 15 is cut by the cutting device 3,
Finish soldering is done using processing device 4 and flux processing device 9. Preheater 10. Solder bath11. The cooler 12 is soldered through each processing step.

第4図(a) 、  (b)は第3図のワックス処理部
24を示すもので、第4図(a)は一部破断斜視図、第
4図(b)は第4図(a)のX−X腺による拡大側断面
図である。これらの図において1第3図と同一符号は同
じもの欠示し、26は前記溶融ワックス25を貯溜j◇
ワックス槽本体、2Tは前記溶融ソックス25乞加圧し
て送り出すためワックス槽本体26のF方に設けた歯車
ポンプ、28は前記歯車ポンプ27を駆動するモータ、
29は前記溶融ソックス25の流量と圧力を調整する制
御弁、30は前記溶融ワックス250通路、31は前記
溶融ワックス25中に混在するごみを取り除くフィルタ
、32は前記フィルタ31でろ過された溶融ワックス2
5の通る通路、33は前記通路32かも分岐して並列に
接続された複数本のパイプ、34は前記パイプ33の外
周に巻かれ1こフレキシフルのケープヒータで、パイプ
33の中′?:辿7)浴融ワックス25が固化しないよ
5に加熱している。
4(a) and 4(b) show the wax processing section 24 of FIG. 3, FIG. 4(a) is a partially cutaway perspective view, and FIG. 4(b) is a partially cutaway perspective view of FIG. 4(a). FIG. 2 is an enlarged side sectional view taken along the line XX. In these figures, the same reference numerals as in Fig. 1 and 3 are omitted, and 26 indicates a reservoir for storing the molten wax 25.
2T is a gear pump provided on the F side of the wax tank body 26 to pressurize and send out the melting sock 25; 28 is a motor that drives the gear pump 27;
29 is a control valve that adjusts the flow rate and pressure of the melting sock 25; 30 is a passageway for the melted wax 250; 31 is a filter that removes dust mixed in the melted wax 25; and 32 is the melted wax that has been filtered by the filter 31. 2
33 is a plurality of pipes branched from the passage 32 and connected in parallel; 34 is a flexible cape heater wrapped around the outer circumference of the pipe 33; :Trace 7) The bath melting wax 25 is heated to 5 to prevent it from solidifying.

35は前記ケープヒータ34の外周ン覆う保温材、36
は前記溶融ワックス25を噴射する噴射装置で、接続金
具37’a’介して複数本のパイプ33のそれぞれに1
個ずつ取り付けられており、第3図のはんだ付は装置2
1の搬送チェ722A、22Bにより搬送されるプリン
ト基板130走行方向に対して直角方向に複数個配設さ
れている。38は前記ワックス槽本体26内におけΦ浴
f泗ソックス25の温度を検知丁ωザーモスタソI・で
ある。なお、39は前記フィルタ31の中のごみ等を取
9除くため着脱可能の蓋、40は制御盤である。
35 is a heat insulating material covering the outer periphery of the cape heater 34; 36;
is a spraying device for spraying the molten wax 25, and one sprayer is used to spray the molten wax 25 onto each of the plurality of pipes 33 via the connecting fittings 37'a'.
They are attached one by one, and the soldering shown in Figure 3 is done on device 2.
A plurality of printed circuit boards 130 are arranged in a direction perpendicular to the running direction of the printed circuit boards 130 that are transported by one of the transport chees 722A and 22B. 38 is a thermostat for detecting the temperature of the socks 25 in the wax tank body 26. Note that 39 is a removable lid for removing dust and the like from the filter 31, and 40 is a control panel.

歯車ポンプ27において、41は駆動軸で、モータ28
に連結されている。42は従動軸である。
In the gear pump 27, 41 is a drive shaft, and the motor 28
is connected to. 42 is a driven shaft.

第4図(b)において、43は前記歯車ポンプ27を組
み立てるためのツノ“イドと1求句カイト軸、44は前
記歯車ポンプ27”lワックス槽本体26に固定するた
めに使用される半円形に形成した固尾具、45は円板状
の上ケース、46.47は一対の平歯車で、第4図(b
)中の斜線部分−ご互に噛み合っておワ、平歯車46は
駆動軸41に、平歯車41は従動軸42に:固着されて
いる。4Bは前記上ケース45の下面で平歯車46,4
γの側面2囲んで収納する歯車ケース、49は前記歯車
ケース48\ 2Tを組み立てる′hじである。また、44aは前記固
冗具44に形成し1こ溶融ワックス25の導入「」、4
5a、48aは前記導入口44aからの浴比された溶融
ワックス25乞送9出丁送出孔、51は前記歯車ポンプ
2Tからの溶融ワックス25を通路30へ供給する供給
孔、49b、52は前記通路30.32から制御弁29
Y経て還流されろ溶融ワックス25の還流孔である。
In FIG. 4(b), reference numeral 43 indicates a horn id for assembling the gear pump 27, and a semicircular kite shaft 44 is used for fixing the gear pump 27 to the wax tank body 26. 45 is a disc-shaped upper case, 46.47 is a pair of spur gears, as shown in Fig. 4 (b).
) - The spur gear 46 is fixed to the drive shaft 41 and the spur gear 41 is fixed to the driven shaft 42 by meshing with each other. 4B is the spur gear 46, 4 on the lower surface of the upper case 45.
A gear case 49 is housed by enclosing the side surface 2 of γ and is the same as when the gear case 48\2T is assembled. In addition, 44a is formed on the hard fitting 44, and 44a is used for introducing the molten wax 25.
Reference numerals 5a and 48a refer to delivery holes for supplying the molten wax 25 which has been mixed with the liquid from the introduction port 44a, 51 refers to supply holes for supplying the molten wax 25 from the gear pump 2T to the passage 30, and 49b and 52 refer to the above-mentioned Control valve 29 from passage 30.32
The molten wax 25 is refluxed through the reflux hole.

次に、第4図(a)、  (b)の動作を説明する。Next, the operations shown in FIGS. 4(a) and 4(b) will be explained.

ワックス槽本体26内に挿入されたワックスはヒータ(
図示せず)により加熱されて溶融ワックス25となり、
ザーモスタント38により温度が検知され、制御盤40
での操作により一定温度に保持される。
The wax inserted into the wax tank body 26 is heated by a heater (
(not shown) to become a molten wax 25,
The temperature is detected by the thermostat 38 and the control panel 40
The temperature is maintained at a constant temperature by operation at .

モータ28が駆動して歯車ポンプ2Tの一対の平歯車4
6.47が回転すると、ワックス槽本体26内の溶融ワ
ックス25は吸引されて導入口44aに入り、供給孔4
5a、48a’l’通って(矢印A)平歯車46.47
により加圧され、さらに送出孔48b、49a、供給孔
51を通って通路30内に入る(矢印B)。
The motor 28 drives the pair of spur gears 4 of the gear pump 2T.
6.47 rotates, the molten wax 25 in the wax tank body 26 is sucked and enters the inlet 44a, and enters the supply hole 4.
5a, 48a'l' (arrow A) spur gear 46.47
, and further enters the passage 30 through the delivery holes 48b, 49a and the supply hole 51 (arrow B).

通路30内の溶融ワックス25はフィルタ31の内部に
入り、ごみ等が取9除かれてがら通路32を通って(矢
印C)複数本のバイブ33に分岐され(矢印D)、それ
ぞれの噴射量[36から噴射してプリント基板13と、
その上面に装Nされた電子部品14の全体に吹き付けろ
The molten wax 25 in the passage 30 enters the inside of the filter 31, passes through the passage 32 (arrow C) after removing dust, etc., and branches into a plurality of vibrators 33 (arrow D), each of which has a different injection amount. [Injected from 36 and printed circuit board 13,
Spray the entire electronic component 14 mounted on the top surface.

一方、通路32.30内の溶融ワックス25は制御弁2
9により流量と圧力が制御され、通路32゜30から第
4図(b)の矢印E、  Fで示すように制御弁29を
通って矢印Gで示すように還流孔52を経て平歯車46
.47へ還流される。
On the other hand, the molten wax 25 in the passage 32.30 is
9 controls the flow rate and pressure, and from the passage 32.degree. 30, the flow passes through the control valve 29 as shown by arrows E and F in FIG.
.. It is refluxed to 47.

第5図は歯車ポンプ27′5r:分解して示し1ニ斜視
図で、第4図(a)、  (b)と同一部分は同じ符号
で示し、44 c、  45 cは前記駆動軸41を回
転自在に挿通する挿通孔、49cは前記駆動軸41の支
承孔、44d、45dは前記従動軸42を回転自在に挿
通する挿通孔、49dは前記従動軸42の支承孔、46
cは前記駆動軸41に平歯車46乞固27iするムニめ
の固定孔、47cは前記従動軸42に平歯車47を固着
jるための固定孔、44e。
FIG. 5 is an exploded perspective view of the gear pump 27'5r. The same parts as in FIGS. 49c is a support hole for the drive shaft 41; 44d and 45d are insertion holes for the driven shaft 42 to be rotatably inserted; 49d is a support hole for the driven shaft 42; 46;
47c is a small fixing hole for fixing the spur gear 46 to the driven shaft 42; 44e is a fixing hole for fixing the spur gear 47 to the driven shaft 42;

45 e、  48 e、  49 eは前記ガイド軸
43乞挿組み立てに際しては、駆動軸41.従動軸42
゜ガイド軸43な基台49に取9付け、次に平歯車46
.47乞噛合させて駆動軸41.従動軸42に固着する
。次に、歯車ケース48を基台49に載置してから平歯
車46.47Y収納し、次に、上ケース45を歯車ケー
ス48の上部にかぶせて平歯車46.47’Y密閉し、
さらに固定具44を載置してねじ50で全体を締め付け
て歯車ポンプ27を形成し、4fHMiPワックス槽本
体26に取り付け、駆動軸41乞モータ28に接続する
45 e, 48 e, 49 e are the drive shafts 41. when the guide shaft 43 is inserted and assembled. Driven shaft 42
゜Attach the guide shaft 43 to the base 49, and then attach the spur gear 46
.. 47 and drive shaft 41. It is fixed to the driven shaft 42. Next, the gear case 48 is placed on the base 49, and the spur gears 46.47'Y are housed. Next, the upper case 45 is placed over the top of the gear case 48 to seal the spur gears 46.47'Y.
Furthermore, the fixture 44 is placed and the whole is tightened with screws 50 to form the gear pump 27, which is attached to the 4fHMiP wax tank body 26 and connected to the drive shaft 41 and motor 28.

なお、第5図の歯車ポンプ27の動作については第4図
(a)、  (b)のところで説明したので、ここでは
省略jる。
Note that the operation of the gear pump 27 shown in FIG. 5 has been explained in FIGS. 4(a) and 4(b), so it will be omitted here.

第6図は制御弁29の詳細を示す側断面図で、第4図(
b)と同一符号は同じ部分を示し、61は前記制御弁2
9の弁箱で、ワックス惜本体26Vこ嵌合されている。
FIG. 6 is a side sectional view showing details of the control valve 29, and FIG.
The same reference numerals as in b) indicate the same parts, and 61 is the control valve 2.
9, the wax valve body 26V is fitted.

62は前記弁箱61に螺合された調整弁で、回動により
溶融ワックス25の流量乞調整する。63は安全弁で、
ld融ワックス25の圧力を自動的に調整′1″心。6
4は前記調整弁62の弁座、65は前記安全弁630弁
座、66は前記安全弁63を弁座65Vc押圧するばね
、67は前記弁箱61の長手方向の一端に設けた調整弁
62側の導入孔、68は前記弁箱61の長手方向の他端
に設けた安全弁63側の尋人孔、69は前記各導入孔6
7.68の中間に設けた還流孔52側の吐出孔、70は
水土用のOリングである。
Reference numeral 62 denotes an adjustment valve screwed into the valve box 61, which adjusts the flow rate of the molten wax 25 by rotating. 63 is a safety valve,
Automatically adjust the pressure of the LD melting wax 25′1″ center.6
4 is a valve seat of the adjustment valve 62, 65 is a valve seat of the safety valve 630, 66 is a spring that presses the safety valve 63 against the valve seat 65Vc, and 67 is a valve seat on the adjustment valve 62 side provided at one longitudinal end of the valve box 61. An introduction hole 68 is a hole on the safety valve 63 side provided at the other longitudinal end of the valve box 61, and 69 is an introduction hole 6.
The discharge hole on the reflux hole 52 side provided in the middle of 7.68, 70 is an O-ring for water and soil.

次に、第6図の動作について説明する。Next, the operation shown in FIG. 6 will be explained.

歯車ポンプ2Tの平歯車46.47の回転により加圧さ
れた溶融ワックス25は供給孔511通路30から第4
図(a)のフィルタ31を経て通路32、各パイプ33
を通って噴射装置36かも噴射されるが、この噴射量ン
調差したい場合には、調整弁62を回して調整弁62と
弁座64との隙間をあげると通路32の溶融ワックス2
5の一部が分流して導入孔67から弁箱61内に入り、
ざらしく弁座64.吐出孔69を経て還流孔52へ送ら
れ旬。一方、溶融ワックス25は流量の調整。
The molten wax 25 pressurized by the rotation of the spur gears 46 and 47 of the gear pump 2T flows from the supply hole 511 passage 30 to the fourth
Passage 32 and each pipe 33 through filter 31 in figure (a)
The molten wax 2 in the passage 32 is also injected through the injection device 36, but if you want to adjust the amount of injection, turn the adjustment valve 62 to increase the gap between the adjustment valve 62 and the valve seat 64.
5 is diverted and enters the valve box 61 from the introduction hole 67,
Rough valve seat 64. The water is sent to the reflux hole 52 through the discharge hole 69 and is then used. On the other hand, the flow rate of the molten wax 25 is adjusted.

噴射の停止前により所定の圧力より高くなった場合、通
路30内の溶融ワックス25の一部が分流して導入孔6
8内に人9、安全弁63がはね66の押圧力に抗し℃抑
圧され、弁座65乞あけるので弁箱61内に入り、吐出
孔69を経て還流孔52へ送られろ。
If the pressure becomes higher than the predetermined pressure before stopping the injection, a part of the molten wax 25 in the passage 30 is diverted to the introduction hole 6.
The safety valve 63 resists the pressing force of the spring 66 and is suppressed, and the valve seat 65 opens, so that it enters the valve box 61 and is sent to the reflux hole 52 via the discharge hole 69.

第7図は第4図Ca)の噴射装置11136の1個につ
いてその詳細2示す側面図で、第4図(a)と同一符号
は同じ部分を示し、11は弁箱で、接続金具37がねじ
部72により螺合されてい心。73は前記弁箱T1の側
方に設けた溶融ワックス25の導入孔、T4は弁軸、T
5は弁、T6は弁座、77は前記弁座T6を備え、弁箱
T1の一端に保合する接続金具、78.79は吹口金具
、80はノズ稟 ル、81は前記ノズル80の取付具、82は前記弁75
乞弁座76rこ押圧する方向に作用するばね、83はパ
ツキン、84はエアシリンダ、85は前記弁箱T1の他
端に突出した弁軸74と一体に固着したピストンである
FIG. 7 is a side view showing details 2 of one of the injection devices 11136 in FIG. 4 Ca), where the same reference numerals as in FIG. The core is screwed together by a threaded portion 72. 73 is an introduction hole for the molten wax 25 provided on the side of the valve box T1, T4 is a valve stem, and T
5 is a valve, T6 is a valve seat, 77 is a connecting fitting that is equipped with the valve seat T6 and is fitted to one end of the valve box T1, 78 and 79 are outlet fittings, 80 is a nozzle edge, and 81 is a mounting of the nozzle 80. 82 is the valve 75
A spring acts in a direction to press the valve seat 76r, 83 is a gasket, 84 is an air cylinder, and 85 is a piston fixed integrally with the valve shaft 74 protruding from the other end of the valve box T1.

次に、第7図の動作について説明する。Next, the operation shown in FIG. 7 will be explained.

第3図のワックス槽本体26の歯車ポンプ2Tで加圧さ
れた溶融ワックス25は通路30.フィルタ312通路
32乞経て、第7図のバイブ33内を通り、弁箱71内
の導入孔T3から弁箱71の内部に入る。
The molten wax 25 pressurized by the gear pump 2T of the wax tank main body 26 in FIG. The filter 312 passes through the passage 32, passes through the vibrator 33 shown in FIG.

ブリット基板13が噴射装置36の下方を通過すると、
図示しない光電管等の検知器の検知によりエアシリフタ
84内に加圧空気が導入されピストン85が作動して弁
軸74’rはね82の押圧力に抗して押圧するので、弁
T5は弁座T6から開放される。弁座T6の開放により
弁箱71内の溶融ワックス25は吹口金具78.79を
通ってノズル80かも噴射され、プリント基板13に吹
き付けられる。
When the bullet board 13 passes below the injection device 36,
Pressurized air is introduced into the air cylinder 84 by detection by a detector such as a phototube (not shown), and the piston 85 is actuated to press the valve shaft 74'r against the pressing force of the spring 82, so that the valve T5 is pressed against the valve seat. Released from T6. When the valve seat T6 is opened, the molten wax 25 in the valve box 71 is also injected through the nozzle 80 through the outlet fittings 78 and 79, and is sprayed onto the printed circuit board 13.

゛ なお、ノズル80は接続金具T1の弁座76に直接
取り付けてもよい。
゛ Note that the nozzle 80 may be directly attached to the valve seat 76 of the connecting fitting T1.

以上説明したようにこの発明は、溶融ワックス馨貯溜す
るワックス槽本体を有し、このワックス槽本体内の溶融
ワックスを一対の平歯車の駆動に、につ加圧して送り出
す歯車ポンプをワックス槽本体の下方に設け、歯車ポン
プから送り出された溶融ワックスの一部を歯車ポンプへ
還流させることにより溶融ワックスの流量と圧力を制御
する制御弁を設け、歯車ポンプから制御弁を経て送り出
された溶融ワックスを噴射させる複数個の噴射装置ンプ
リント基板の走行方向と直角方向に順次配設したので、
電子部品を仮固定する予備はんだ付は装置が不要となっ
て、予備はんだ付は処理に使用するはんだの消耗がな(
なるとともに、予備加熱がないので電子部品とプリント
基板の熱影響による損傷や変形が防止できる。また、溶
融ワックスをシリンド基板の上面全体に吹き付けで固化
したワックスで覆って固着するので、仕上げはんだ付は
処理を行うとき、噴流はんだの勢によってIC部品がシ
リンド基板から浮き上がるのを防止することができるた
め不良品が減少し、プリント基板の品質向上がはかれる
。また、予備加熱装置が不要で、かつワックス処理部全
体が小形に形成できゐことに、r、9はんだ付は装置全
体が小形になり、はんだ付は装置で消費される電力、設
備費等を低減することができる利点を有する。
As explained above, the present invention has a wax tank body that stores molten wax, and a gear pump that drives a pair of spur gears to pressurize and send out the molten wax in the wax tank body. A control valve is provided below to control the flow rate and pressure of the molten wax by returning a portion of the molten wax sent from the gear pump to the gear pump, and the molten wax sent from the gear pump via the control valve is provided with a control valve that controls the flow rate and pressure of the molten wax. A plurality of injection devices are arranged in sequence in a direction perpendicular to the running direction of the printed circuit board.
Pre-soldering, which temporarily fixes electronic components, does not require equipment, and pre-soldering does not consume the solder used in the process (
In addition, since there is no preheating required, damage and deformation of electronic components and printed circuit boards due to heat effects can be prevented. In addition, since molten wax is sprayed onto the entire top surface of the cylinder board to cover it with solidified wax and fix it, it is possible to prevent the IC components from lifting off from the cylinder board due to the force of the jet solder during the final soldering process. This reduces the number of defective products and improves the quality of printed circuit boards. In addition, since a preheating device is not required and the entire wax processing section can be made compact, the entire device for r,9 soldering is compact, and soldering reduces the power consumed by the device, equipment costs, etc. It has the advantage of being able to reduce

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来のはんだ付は装置の一例を示すブρンク図
、第2図は電子部品がプリント基板に装着された態様を
示す部分側断面図、第3図はこの発明の一実施例を示す
概略構成図、第4図(a)。 (b)は第3図のワックス処理部を示すもので、第4図
(a)は一部破断斜視図、第4図(b)li第4図(a
)のX−X線による拡大側断面図、第5図は歯車ポンプ
を分解して示した拡大斜視図、第6図は制御弁の詳#I
を示す拡大側断面図、第7図は噴射装置の詳細を示す拡
大側断面図である。 図中、3はカッティング装置、4は仕上げはんだ付は処
理装置、8は冷却器、9(′j−フランクス処理器、1
0は予備加熱器、11ははんだ槽、13はプリント基板
、14は電子部品、15はリード線(またはリード端子
)、16はスルーホール、21ははんだ付は装置、22
A、22Bは搬送チJ−ン、23にワックス伺は処理装
置、24はワックス処理部、25は石齢ワックス、26
はワックス(3本体、2Tは歯車ポンプ、28は七−夕
、29は制御弁、30.32は通路、31はフィルタ、
33はバイン、34はテービヒータ、35は保温材、3
6は噴射装置、3Tは接続金具、3Bはサーモスタット
、39は傑、40は制御盤、41は駆動軸、42は従動
軸、43はガ・イド軸、44は固定具、45は上ケース
、46.47は平歯車、48は歯車ケース、49は基台
、50は固足ねじ、51は供給孔、52は還流孔、61
は弁箱、62は調整弁、63は安全弁、64.65は弁
座、6tiはばね、67.68は導入孔、69は吐出孔
、71は弁箱、12はねじ部、73は導入孔、14は弁
軸、75は弁、T6i′r、弁座、80はノズル、82
はばね、84はエアシリンク、85はピストンである。 第4図(b) 第5図 第6図 第7図
Fig. 1 is a blank diagram showing an example of a conventional soldering device, Fig. 2 is a partial side cross-sectional view showing how electronic components are mounted on a printed circuit board, and Fig. 3 is an embodiment of the present invention. A schematic diagram showing the configuration, FIG. 4(a). 4(b) shows the wax processing section in FIG. 3, FIG. 4(a) is a partially cutaway perspective view, and FIG.
), Fig. 5 is an enlarged perspective view showing the gear pump disassembled, and Fig. 6 is a detailed view of the control valve #I.
FIG. 7 is an enlarged side sectional view showing details of the injection device. In the figure, 3 is a cutting device, 4 is a processing device for final soldering, 8 is a cooler, 9 ('j-Franks processing device, 1
0 is a preheater, 11 is a soldering bath, 13 is a printed circuit board, 14 is an electronic component, 15 is a lead wire (or lead terminal), 16 is a through hole, 21 is a soldering device, 22
A, 22B are conveyance chains, 23 is a wax processing device, 24 is a wax processing section, 25 is a stone age wax, 26
is wax (3 main body, 2T is gear pump, 28 is Tanabata, 29 is control valve, 30.32 is passage, 31 is filter,
33 is Vine, 34 is a TV heater, 35 is a heat insulator, 3
6 is the injection device, 3T is the connection fitting, 3B is the thermostat, 39 is the main body, 40 is the control panel, 41 is the drive shaft, 42 is the driven shaft, 43 is the guide shaft, 44 is the fixture, 45 is the upper case, 46. 47 is a spur gear, 48 is a gear case, 49 is a base, 50 is a fixed foot screw, 51 is a supply hole, 52 is a return hole, 61
is the valve box, 62 is the adjustment valve, 63 is the safety valve, 64.65 is the valve seat, 6ti is the spring, 67.68 is the introduction hole, 69 is the discharge hole, 71 is the valve box, 12 is the threaded part, 73 is the introduction hole , 14 is a valve shaft, 75 is a valve, T6i'r is a valve seat, 80 is a nozzle, 82
84 is an air cylinder, and 85 is a piston. Figure 4 (b) Figure 5 Figure 6 Figure 7

Claims (1)

【特許請求の範囲】[Claims] 浴融ワックス2貯溜丁ゐワックス槽本体乞イ1゛シ、こ
のワックス槽本体内の溶融ワックスン一対の平歯車の駆
1llIIvCより加圧して送り出丁歯車ポンプ7前記
ワックス槽本体の下方に設け、前記歯車ポンプから送り
出された前記溶融ワックスの一部ン前記歯車ポンプへ還
流させることにより前記溶融ワックスの流量と圧力を制
御する制御弁を設け、さらに前記歯車ポンプから前記制
御弁を経て送り出された前記溶融ワックス欠噴射させる
複数個の噴射装置χプリント基板の走行方向と直角方向
に順次配波したこと2%徴とjるはんだ付は装置のワッ
クス処理部。
The molten wax 2 is stored in the wax tank main body 1, and the molten wax is pressurized by a pair of spur gear drives 1llIIvC in the wax tank main body, and the gear pump 7 is installed below the wax tank main body. A control valve is provided for controlling the flow rate and pressure of the molten wax by returning a portion of the molten wax sent from the gear pump to the gear pump, and further includes a control valve for controlling the flow rate and pressure of the molten wax sent from the gear pump via the control valve. The plurality of injection devices for injecting the molten wax intermittently were distributed sequentially in a direction perpendicular to the running direction of the printed circuit board.
JP20928882A 1982-12-01 1982-12-01 Waxing processor for soldering device Granted JPS59100590A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20928882A JPS59100590A (en) 1982-12-01 1982-12-01 Waxing processor for soldering device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20928882A JPS59100590A (en) 1982-12-01 1982-12-01 Waxing processor for soldering device

Publications (2)

Publication Number Publication Date
JPS59100590A true JPS59100590A (en) 1984-06-09
JPH0145753B2 JPH0145753B2 (en) 1989-10-04

Family

ID=16570457

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20928882A Granted JPS59100590A (en) 1982-12-01 1982-12-01 Waxing processor for soldering device

Country Status (1)

Country Link
JP (1) JPS59100590A (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS523164A (en) * 1975-06-27 1977-01-11 Aiwa Co Method of securing electric components printed circuit board
JPS55139867A (en) * 1979-04-16 1980-11-01 Nordson Corp Method and device for distributing heat sensitive liquid polymer composition
JPS5687262U (en) * 1979-12-06 1981-07-13
JPS592938U (en) * 1982-06-30 1984-01-10 富士重工業株式会社 Soundproof engine driven generator

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS523164A (en) * 1975-06-27 1977-01-11 Aiwa Co Method of securing electric components printed circuit board
JPS55139867A (en) * 1979-04-16 1980-11-01 Nordson Corp Method and device for distributing heat sensitive liquid polymer composition
JPS5687262U (en) * 1979-12-06 1981-07-13
JPS592938U (en) * 1982-06-30 1984-01-10 富士重工業株式会社 Soundproof engine driven generator

Also Published As

Publication number Publication date
JPH0145753B2 (en) 1989-10-04

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