JPS5927552A - Mounting method for diode - Google Patents

Abstract

PURPOSE:To enable to complete an electrical bonding by initially electrically bonding the lower electrode of a pill type diode to the lower ground conductor of an MIC substrate. CONSTITUTION:A lower electrode 2 and a lower ground conductor 5 of an MIC substrate 4 are bonded with solder or conductive adhesive through the upper cap 11 of a diode to see the upper electrode 1 of a pill type diode 8 in the hole 6 of the substrate 4. A gap is eliminated between the electrode 2 of the diode 8 and the conductor 5 according to this method, thereby readily electrically bonding completely therebetween.

Description

Detailed Description of the Invention (a) Technical Field of the Invention The present invention provides a bill-shaped diode mounted between a housing and a microwave integrated circuit (hereinafter referred to as MIC) substrate, and a lower part 1η of the diode, a pole and f: between the housing and the lower ground conductor of the MIC board, and between the stud and lower electrode of the diode and most of the housing;
The present invention relates to a diode mounting method that allows complete electrical bonding between the lower electrode of the dimate and the lower ground conductor of the MIC substrate. , (b) Prior art and problems Figure 1 shows a side view (4) and a top view (4) of a bill-shaped diode.
B), Figure 2 is a cross-sectional view showing the hole through which the upper cap of the pill-shaped diode of the MIC board is passed, and Figure 3 is a cross-sectional view of the casing showing the hole through which the lower electrode and stud of the pill-shaped diode are attached. ■Figures 1 and 4 are cross-sectional views of the pill-shaped diode after installation, and Figure 5 is the conventional bill-shaped diode.
t 41434 is a perspective view showing an intermediate process.

In the figure, 1 is the upper pole, 2 is the lower electrode, 3 is the stud, 4 is the MIC board, 5 is the lower ground conductor of the MIC board, 6 is a large cap that passes through the top cap so that the top electrode of the pill-shaped diode can be seen, and 7 is the stud. Housing, 8 is a pill-shaped diode, 9 is the lower part of a bill-shaped diode 1]1. holes for mounting poles and studs;
Reference numerals 10 and 10' indicate an adhesive part of the casing that is electrically bonded to the lower ground conductor of the MIC board, and 11 indicates an upper cap of the bill-shaped diode.

In a pill-shaped diode, the diode element portion is shaped like a tower on a stud 3 as shown in FIG. fypLj
? The introductory part is tower-shaped, and the diode element part has an upper electrode 1 and a lower electrode 2. To install this bill-shaped diode between the housing and the MIC board, as shown in Figure 2,
The C substrate 4 has a building-shaped hole 6 through which an upper cap 11 is passed so that the upper electrode 1 of the diode can be seen, and a lower ground conductor 5. In addition, as shown in FIG. 3, the housing 7 has a hole 9 for mounting the lower electrode 2 and stud 3 of the pill-shaped diode, and also has a hole 9 for attaching the lower ground conductor 5 of the MIC board 4 and the turret, and an adhesive for air bonding. There are portions 10+10'. A fourth pill-shaped diode 8 is connected between this housing 7 and the MIC board 4.
Attach as shown in the figure, between the lower ground electrode 5 of the MIC board 4, the lower electrode 2 of the pig-type diode 8, and the adhesive portions 10 and 10' of the housing 7, and between the stud 3 of the pig-type diode 8, the lower electrode 2, and the housing. It is necessary to electrically bond most part 9 of 7゛.

Conventionally, to perform this electrical bonding, the bill-shaped diode 8 was attached to the wooden part 9 of the casing 70 as shown in FIG. ,
MIC board 4 and the upper part 11 of the building diode. Cover the tip of the sheath so that it can be seen from hole 6, and use solder with a slight resistance to the melting temperature in the case of air bonding.
With the adhesive of
It was 1J when I arrived at Denki@ with '. However, in this method, the hole 9t'2 in the housing 7 is slightly larger than the lower electrode 2 and stud 3 of the hill-shaped dimate for electrical bonding, so the bonded part 10,10'1 of the housing 7 and the pit-shaped diode It is difficult to align the 1h1 position of the lower electrode 2 of the MIC board 4, and often a gap is created between the lower ground conductor 5 of the MIC board 4 and the lower electrode 2, which changes the impedance near the pill-shaped diode 8, which adversely affects the circuit. It had some drawbacks.

(e) OBJECTS OF THE INVENTION An object of the present invention is to provide a diode mounting method that eliminates the above-mentioned drawbacks and allows complete electrical bonding between the lower electrode of the pill-shaped diode and the lower ground conductor of the MIC substrate.

(d) Structure of the Invention In order to achieve the above object, the present invention is characterized in that the lower electrode of the bill-shaped diode and the lower ground conductor of the MIC substrate are first electrically bonded.

(e) Examples of the invention DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

FIG. 6 is a side view showing a state in which the pill-shaped diode of embodiment i of the present invention and the lower conductor of the MIC board are electrically bonded, and the MIC board is shown in a cross section cut at the hole.

Components that are the same as those in FIGS. 1 to 5 are indicated by the same symbols. In the case of the present invention, first, as shown in FIG. Pass the upper cap 11 of the diode so that it is visible and lower the lower electrode 2.
and the lower ground electrode body 5 of the MIC board 4 are bonded together with solder or conductive adhesive. In this method, no gap is created between the lower electrode 2 of the bill-shaped diode 8 and the lower ground electrode 5 of the MIC substrate 4, and complete 11 gas bonding can be easily achieved. Next, as shown in FIG.
electrical bonding between the main part 9 of the housing and the lower part 'If of the bill-shaped diode 8, the pole 2 and the stud 3 and the housing 7.
0 (f ) In more detail than the effects of the invention) isf, Ql According to the present invention,
Is there no gap between the lower electrode of the pin diode and the lower ground conductor of the MIC board? L Has the effect of electrical adhesion.]

[Brief explanation of drawings]

Figure 3 is a cross-sectional view of the housing showing the hole through which the cap passes through the -E section of the diode. Figure 3 is a cross-sectional view of the housing showing the lower electrode of the bill-shaped diode and the hole for mounting the stud. Figure 4 is the lower electrode of the bill-shaped diode. FIG. 5 is a cross-sectional view after installation is completed; FIG. 5 is a perspective view showing an intermediate step in installing a conventional pill-shaped diode; FIG.
The figure is a side view showing a situation in which a bill-shaped diode according to an embodiment of the present invention and a lower conductor of a microwave integrated circuit board are electrically bonded. In the figure, 1 is the upper electrode, 2 is the lower electrode, 3 is the stud, 4 is the microwave integrated circuit board, 5 is the lower ground conductor, 6 is the hole through which the upper cap of the building-shaped die is passed, 7 is the housing, 8-bill-shaped diode, 9 is the hole for attaching the lower electrode and stud of the pill-shaped diode, 10.10' is the adhesive part of the housing, 11 is the upper cap. Prisoner 5 Figure 6

Claims (1)

[Claims] Between the bottom electrode of a building-shaped diode with a tower-shaped diode element on a stud, a casing with a hole for mounting the stud metal, and a microwave integrated circuit board with a hole machined through which the top electrode of the diode can be seen. The diode is mounted, and electrical connections are made between the lower electrode of the diode and the housing and the lower ground conductor of the microwave integrated circuit board, and between the stud and lower electrode of the diode and most of the housing. A method for mounting a diode, which comprises first electrically bonding a lower electrode of the diode and a lower ground conductor of the microwave integrated circuit board when bonding.