JPS59225514A - 電子部品の製造方法 - Google Patents
電子部品の製造方法Info
- Publication number
- JPS59225514A JPS59225514A JP58101076A JP10107683A JPS59225514A JP S59225514 A JPS59225514 A JP S59225514A JP 58101076 A JP58101076 A JP 58101076A JP 10107683 A JP10107683 A JP 10107683A JP S59225514 A JPS59225514 A JP S59225514A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- solder
- substrate
- chip
- chips
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58101076A JPS59225514A (ja) | 1983-06-07 | 1983-06-07 | 電子部品の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58101076A JPS59225514A (ja) | 1983-06-07 | 1983-06-07 | 電子部品の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59225514A true JPS59225514A (ja) | 1984-12-18 |
JPH0141243B2 JPH0141243B2 (enrdf_load_stackoverflow) | 1989-09-04 |
Family
ID=14291005
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58101076A Granted JPS59225514A (ja) | 1983-06-07 | 1983-06-07 | 電子部品の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59225514A (enrdf_load_stackoverflow) |
-
1983
- 1983-06-07 JP JP58101076A patent/JPS59225514A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPH0141243B2 (enrdf_load_stackoverflow) | 1989-09-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH05129473A (ja) | 樹脂封止表面実装型半導体装置 | |
JPH06295962A (ja) | 電子部品搭載用基板およびその製造方法並びに電子部品搭載装置 | |
US5421081A (en) | Method for producing electronic part mounting structure | |
WO2001026147A1 (fr) | Dispositif a semi-conducteur, son procede de fabrication, carte de circuit imprime et dispositif electronique | |
JPH08321671A (ja) | バンプ電極の構造およびその製造方法 | |
DE102010000407A1 (de) | Halbleiter-Package mit einem aus Metallschichten bestehenden Band | |
JPS6072663A (ja) | 低融点金属球接続方法 | |
JPS59225514A (ja) | 電子部品の製造方法 | |
TW475245B (en) | Semiconductor device, external connecting terminal body structure and method for producing semiconductor devices | |
JP3118509B2 (ja) | チップ抵抗器 | |
JPS6160570B2 (enrdf_load_stackoverflow) | ||
JP4508558B2 (ja) | 電子部品及びその製造法 | |
JPH0528752Y2 (enrdf_load_stackoverflow) | ||
JPS6240422Y2 (enrdf_load_stackoverflow) | ||
JPS61150253A (ja) | 半導体リ−ドフレ−ム | |
JPS59993A (ja) | 金属板電極接合方法 | |
JPH06252310A (ja) | リードフレームならびにその製造方法 | |
JP3323140B2 (ja) | チップ抵抗器 | |
TWI650050B (zh) | Multilayer circuit board and manufacturing method thereof | |
JPS63265418A (ja) | ヒューズ付きチップ状固体電解コンデンサおよび製造方法 | |
WO2005091313A1 (ja) | 電子部品 | |
CN115515339A (zh) | 电路板连接结构及其制造方法 | |
JP6079329B2 (ja) | 部品内蔵配線板、部品内蔵配線板の製造方法 | |
CN118315197A (zh) | 卷绕型固态电解电容器的封装结构及其量产方法和与其量产用的中间组合件 | |
JPH0677285A (ja) | Ic素子の実装方法 |