JPS59225307A - Ball diameter measuring apparatus in wire bonding - Google Patents
Ball diameter measuring apparatus in wire bondingInfo
- Publication number
- JPS59225307A JPS59225307A JP10021483A JP10021483A JPS59225307A JP S59225307 A JPS59225307 A JP S59225307A JP 10021483 A JP10021483 A JP 10021483A JP 10021483 A JP10021483 A JP 10021483A JP S59225307 A JPS59225307 A JP S59225307A
- Authority
- JP
- Japan
- Prior art keywords
- ball
- diameter
- ball diameter
- wire
- wire bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/08—Measuring arrangements characterised by the use of optical techniques for measuring diameters
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/024—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by means of diode-array scanning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
Description
【発明の詳細な説明】
（発明の利用分野）
本発明はワイヤボンディングにおけるボール径の計測装
置に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Application of the Invention) The present invention relates to a ball diameter measuring device in wire bonding.
（発明の背景）
ワイヤボンディングｌこおいては、第１ボンディング点
へのボンディングに先立ち、ワイヤの先端に電気トーチ
又は火炎トーチ等によりボールを形成する。このボール
径の良、不良はボンディングの品質（こ微妙（こ影響を
及ぼす。(Background of the Invention) In wire bonding, a ball is formed at the tip of a wire using an electric torch, a flame torch, or the like prior to bonding to a first bonding point. The quality of this ball diameter will have a subtle effect on the bonding quality.
従来、ボール径を計測する方法として、例えば特公昭５
４．−３５０６５号公報に示すように、電気１・−チの
放電によりワイヤに流れる電流を計測してボールの出来
具合を判別する方法が知られている。しっ）シながら、
この方法はボールそのものを計測するのではなく、放電
時ζこおける電流の流れを計測して判別するので、ボー
ル径の良、不良を正確に判別することは困難である。ま
たこの方法は放電時による判別であるので、ボールを火
炎１〜−チによって形成する場合には判別できないとい
う欠点を有する。Conventionally, as a method of measuring the ball diameter, for example,
4. As shown in Japanese Patent No. 35065, a method is known in which the quality of the ball is determined by measuring the current flowing through a wire due to electric discharge. While shushing,
This method does not measure the ball itself, but rather measures and determines the current flow during discharge, so it is difficult to accurately determine whether the ball diameter is good or bad. In addition, this method has the disadvantage that since the discrimination is based on the time of discharge, it cannot be discriminated when the ball is formed by flames 1 to 1.
（発明の目的）
本発明の目的は、ボール径を直接計測することができる
ワイヤボンディングにおけるボール径の計測装置を提供
することにある。(Object of the Invention) An object of the present invention is to provide a ball diameter measuring device in wire bonding that can directly measure the ball diameter.
（発明の実施例） 以下、本発明の一実施例を図により説明する。(Example of the invention) Hereinafter, one embodiment of the present invention will be described with reference to the drawings.
キャピラリ１の下端より延出したワイヤ２の先端には図
示しない電気トーチ又は火炎トーチ等によってボール３
が形成される。A ball 3 is attached to the tip of the wire 2 extending from the lower end of the capillary 1 using an electric torch or flame torch (not shown).
is formed.
前記ボール３には、レーザ１０の光がビームエキスパン
ダー１１によってビーム径を拡げられ、かつ平行光にさ
れて照射される。これζこよってボール３の影ができる
。このボール３の影はレンズ１２によって拡大され、−
次元ダイオードアレイなど力）らなる検出器１３に投影
される。検出器１３はボール３の影を検出して電気出力
に変え、マイクロコンピュータ１４１こ入力する。マイ
クロコンピュータ１４には実験によって求められたボー
ル径と出力との関係が予め記憶されており゛、前記検出
器１３の出力と比較してボール径を算出し、このボール
径をチンピモニタ１５上（こ表示させると共に、ボール
径の良、不良を判定する。The ball 3 is irradiated with light from a laser 10 whose beam diameter is expanded by a beam expander 11 and made into parallel light. This ζ creates the shadow of ball 3. This shadow of the ball 3 is magnified by the lens 12, and -
It is projected onto a detector 13 consisting of a dimensional diode array or the like. The detector 13 detects the shadow of the ball 3, converts it into electrical output, and inputs it to the microcomputer 141. The microcomputer 14 stores in advance the relationship between the ball diameter and the output, which has been determined through experiments, and calculates the ball diameter by comparing it with the output of the detector 13, and displays this ball diameter on the chimp monitor 15 (this In addition to displaying the information, it is also determined whether the ball diameter is good or bad.
このようにボール３に光を当て、ボール３そのものを直
接計測するので、瞬時にボール径の良、不良を正確に判
別することができる。またボール３そのものを計測する
ので、ボール３の形成方法は如何なる方法によってもよ
い。Since the ball 3 is illuminated with light and the ball 3 itself is directly measured in this way, it is possible to instantly and accurately determine whether the ball diameter is good or bad. Further, since the ball 3 itself is measured, the ball 3 may be formed by any method.
（発明の効果）
本発明によれば、瞬時ζこボール径を正確に計測するこ
とができる。(Effects of the Invention) According to the present invention, the instantaneous diameter of the ball can be accurately measured.
図は本発明の一実施例を示すブロック図である。
２・・・ワイヤ、 ３・・・ボール、】０・・・
レーザ、 １１・・・ビームエキスパンター、１２
・・・レンズ、 １３・・・検出器、１４・・・マ
イクロコンピュータ。The figure is a block diagram showing one embodiment of the present invention. 2...Wire, 3...Ball, ]0...
Laser, 11... Beam expander, 12
...Lens, 13...Detector, 14...Microcomputer.
Claims (1)
光（こしてワイヤの先端（こ形成されたボールに照射す
るビームエキスパンダーと、このビームエキスパンダー
により照射されてできる前記ボールの影を拡大するレン
ズと、このレンズにより拡大された影を電気出力Ｇこ変
える検出器と、この検出器の出力（こよりボール径を判
定するマイクロコンピュータと７ハらなるワイヤボンデ
ィングにおけるボール径の計測装置。A beam expander is used to expand the beam diameter of the light from the laser and the collimated light (through the tip of the wire), which irradiates the formed ball, and expands the shadow of the ball that is irradiated by this beam expander. A device for measuring the diameter of balls in wire bonding, which consists of a lens, a detector that changes the shadow magnified by this lens by an electric output G, and a microcomputer that determines the diameter of the ball from the output of this detector.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10021483A JPS59225307A (en) | 1983-06-07 | 1983-06-07 | Ball diameter measuring apparatus in wire bonding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10021483A JPS59225307A (en) | 1983-06-07 | 1983-06-07 | Ball diameter measuring apparatus in wire bonding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59225307A true JPS59225307A (en) | 1984-12-18 |
Family
ID=14268045
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10021483A Pending JPS59225307A (en) | 1983-06-07 | 1983-06-07 | Ball diameter measuring apparatus in wire bonding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59225307A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6237705U (en) * | 1985-08-26 | 1987-03-06 | ||
| JPS62188906A (en) * | 1985-10-30 | 1987-08-18 | シベレク、ソシエテ、アノニム | Optical beam device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5237063A (en) * | 1975-09-18 | 1977-03-22 | Daido Steel Co Ltd | Size measuring method without contact |
| JPS57116205A (en) * | 1981-01-09 | 1982-07-20 | Matsushita Electric Ind Co Ltd | Measuring device for dimension |
-
1983
- 1983-06-07 JP JP10021483A patent/JPS59225307A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5237063A (en) * | 1975-09-18 | 1977-03-22 | Daido Steel Co Ltd | Size measuring method without contact |
| JPS57116205A (en) * | 1981-01-09 | 1982-07-20 | Matsushita Electric Ind Co Ltd | Measuring device for dimension |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6237705U (en) * | 1985-08-26 | 1987-03-06 | ||
| JPS62188906A (en) * | 1985-10-30 | 1987-08-18 | シベレク、ソシエテ、アノニム | Optical beam device |
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