JPS59224101A - Method of producing resin-sealed electronic part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to a method for manufacturing a resin-sealed electronic component, and in particular, a method for removing thin particles attached to the surface of a metal part of the component during resin molding. Regarding.

[Technical background of the invention and its problems] Conventionally, methods for removing thin particles adhering to the surface of metal parts, such as lead wires, during resin molding of resin-sealed electronic components include (1) using a cutter such as a knife; (2) a method using a barrel machine; and (3) a sandblasting method in which powder is sprayed onto the surface of the lead wire.

The method (1) above has the disadvantage that it is complicated and time-consuming because it is performed manually, and that it is easily damaged because the blade is directly applied to the soft metal lead wire.

The barrel method according to (2) above eliminates the need for complicated work due to the use of machines, but it also increases replacement costs due to abrasion of the abrasive powder and makes it difficult to remove thin flakes at the root end of the resin-sealed part. It has drawbacks such as the lead wires being easily bent due to collision of powder and entanglement of the lead wires.

In addition, the method according to (3) above requires expensive equipment, requires a mask to protect the areas other than those to be blasted, and requires the effort of cleaning again after blasting. It has its drawbacks.

[Object of the Invention] The present invention has been made based on the above-mentioned circumstances, and provides a resin-sealed type that allows book burrs to be removed easily and inexpensively by a chemical method rather than a mechanical or physical method. The purpose is to provide a method for manufacturing electronic components.

[Summary of the Invention] That is, the present invention provides a metal part of a resin-sealed electronic component (
= A method for removing base particles during resin molding, which is characterized in that the electronic component after resin molding is immersed in a heated solution containing a surfactant, and vibration is applied to remove the base particles. This is a method for manufacturing sealed electronic components.

[Embodiments of the Invention] In the drawings, a boiling tank 1 is filled with an aqueous solution containing a surfactant.

This aqueous solution has, for example, a ratio of surfactant to water (c
c) is mixed at a ratio of 50:1000. In this example, CHEM-3OLV (trade name) manufactured by Mallinckrodt was used as a surfactant.

This Chemsolve 1 has a structural formula that contains a biologically degradable non-ionized activator together with sodium hydroxide in a mixed solution, and can be prepared at room temperature by diluting it with distilled water or pure water in a predetermined ratio. is sufficient to obtain a cleaning effect.

A heater 2 is installed in the boiling tank 1 and configured to heat the aqueous solution.

In the above system, the basket 3 containing a predetermined amount of resin-molded electronic components is placed on the stand 4 in the boiling tank 1;
Heat with heater 2 for about 3 minutes.

Through this step, an aqueous solution in which a surfactant is dissolved penetrates between the lead wire surface of the electronic component and the burr formed during resin molding, making it easy to peel off the base burr.

Next, the three pieces are transferred to Basquera 1 in the ultrasonic cleaning tank 5 and washed for about 3 minutes.

In this step, the base material, which has become easy to peel off in the previous step, is mechanically peeled off by ultrasonic vibration.

Note that this ultrasonic cleaning tank 5 is provided with a water supply pipe 6 and a drain pipe 7 so that normal water is always supplied.

Next, the basket 3 is transferred to a running water washing tank 8, and a final washing is performed for about 3 minutes.

This cleaning tank 8 is also provided with a water supply pipe 6 and a drain pipe 9 for discharging running water, as described above.

After the final cleaning in the running water cleaning tank 8, it is transferred to a constant temperature bath or the like and dried.

[Effect of the invention 1] The present invention involves immersing a resin-sealed component on which a base burr has been formed as described above in a solution containing a surfactant and heating it to a predetermined temperature to make it easy to remove the thin burr. Afterwards, vibration was applied in an ultrasonic cleaning bath to mechanically remove the electronic components, without damaging the metal surfaces of the electronic components.
Base particles can be removed easily and in a short time.

In the examples of the present invention, Chemsolve was used as the surfactant, but the surfactant is not limited to this, and any surfactant that allows the solution to easily enter between the surface of the metal part and the base metal may be used. Good.

Furthermore, no particularly expensive equipment is required, and its maintenance is also unnecessary.

Furthermore, since no mechanical impact is applied to metal parts, especially lead wires, there is no possibility of bending or damage.

[Brief explanation of drawings]

The drawings do not show one embodiment of the present invention, but are explanatory diagrams showing a thin burr removal process. 1... Boiling tank 2... Heater 3... To Basquera 1 4... Unit 5... Ultrasonic cleaning tank 8... Running water cleaning tank Application agent Patent attorney Kikuchi Gobu

Claims (1)

[Claims] In a method for removing thin flakes attached to metal parts of resin-sealed electronic components during resin molding, the electronic components after resin molding are immersed in a solution containing a surfactant to remove the thin flakes. Features: A method for manufacturing resin-sealed electronic components.