JPH0116004B2 - - Google Patents

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to a method for manufacturing a resin-sealed electronic component, and in particular, a method for removing thin burrs attached to the surface of a metal part of the component during resin molding. Regarding.

[Technical background of the invention and its problems] Conventionally, methods for removing thin burrs attached to metal parts, for example, the surface of lead wires during resin molding of resin-sealed electronic components, include (1) using a cutter such as a knife; (2) using a barrel machine; (3) sandblasting method in which powder is sprayed onto the surface of the lead wire.

The method (1) above has the disadvantage that it is complicated and time-consuming because it is performed manually, and that it is easily damaged because the blade is directly applied to the soft metal lead wire.

The barrel method according to (2) above eliminates the need for complicated work due to the use of machines, but it also increases replacement costs due to abrasion of the abrasive powder and makes it difficult to remove thin burrs at the root end of the resin-sealed part. It has drawbacks such as the lead wires being easily bent due to collision of powder and entanglement of the lead wires.

In addition, the method according to (3) above requires expensive equipment, requires a mask to protect the areas other than those to be blasted, and requires the effort of cleaning again after blasting. It has its drawbacks.

[Object of the invention] The present invention has been made based on the above circumstances, and does not involve mechanical or physical methods.
It is an object of the present invention to provide a method for manufacturing a resin-sealed electronic component in which thin burrs can be removed easily and inexpensively by a chemical method.

[Summary of the Invention] That is, the present invention provides a method for removing thin burrs attached to a metal part of a resin-sealed electronic component during resin molding, in which the electronic component after resin molding is placed in a heated solution containing a surfactant. This method of manufacturing a resin-sealed electronic component is characterized in that the thin burr is removed by immersing the component in water and applying vibration.

[Embodiments of the Invention] In the drawings, a boiling tank 1 is filled with an aqueous solution containing a surfactant.

This aqueous solution is, for example, a solution in which a surfactant and water are mixed at a ratio (cc) of 50:1000. In addition, in this example, Chemsolve (CHEM-
SOLV)-(trade name) was used.

This Chemsolve has a structural formula that contains sodium hydroxide and a biologically degradable non-ionized activator in a mixed solution. A sufficient cleaning effect can be obtained.

A heater 2 is installed in the boiling tank 1 to heat the aqueous solution.

In the above method, the basket 3 containing a predetermined amount of resin-molded metal parts is placed on the stand 4 in the boiling tank 1, and heated by the heater 2 for about 3 minutes.

Through this process, an aqueous solution in which a surfactant is dissolved penetrates between the lead wire surface of the electronic component and the thin burr formed during resin molding, and the thin burr is easily peeled off.

Next, the entire basket 3 is transferred into the ultrasonic cleaning tank 5 and cleaned for about 3 minutes.

Through this step, the thin burrs that have become easy to peel off in the previous step are mechanically peeled off by ultrasonic vibration.

Note that this ultrasonic cleaning tank 5 is provided with a water supply pipe 6 and a drain pipe 7 so that normal water is always supplied.

Next, the entire basket 3 is transferred to a running water washing tank 8, and a final washing is performed for about 3 minutes.

This cleaning tank 8 is also provided with a water supply pipe 6 and a drain pipe 9 for discharging running water, as described above.

After the final cleaning in the running water cleaning tank 8, it is transferred to a constant temperature bath or the like and dried.

[Effects of the Invention] According to the present invention, a resin-sealed component on which thin burrs are formed as described above is immersed in a solution containing a surfactant, and heated to a predetermined temperature to make it easy to peel off the thin burrs. After that, vibration is applied using an ultrasonic cleaning bath.
Since it is mechanically peeled off, the thin burr can be easily and quickly removed without damaging the metal surface of the electronic component.

In the examples of the present invention, Chemsolve was used as the surfactant, but the surfactant is not limited to this, and any surfactant that allows the solution to easily enter between the thin burrs on the surface of the metal part Good.

Furthermore, no particularly expensive equipment is required, and its maintenance is also unnecessary.

Furthermore, since no mechanical impact is applied to metal parts, especially lead wires, there is no possibility of bending or damage.

[Brief explanation of drawings]

The drawings are explanatory diagrams showing a thin burr removal process according to an embodiment of the present invention. 1... Boiling tank, 2... Heater, 3... Basket, 4
...stand, 5...ultrasonic cleaning tank, 8...running water cleaning tank.

Claims (1)

[Claims] 1. A method for manufacturing an electronic component that removes thin burrs attached to metal parts of a resin-sealed electronic component during resin molding, including the step of immersing the electronic component after resin molding in a heated solution containing a surfactant. A method for manufacturing a resin-sealed electronic component, the method comprising: removing the thin burr, and then applying ultrasonic vibration to the electronic component.