JP4195735B2 - Pre-treatment method for resin component joint surface of electronic parts - Google Patents

Pre-treatment method for resin component joint surface of electronic parts Download PDF

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Publication number
JP4195735B2
JP4195735B2 JP21788297A JP21788297A JP4195735B2 JP 4195735 B2 JP4195735 B2 JP 4195735B2 JP 21788297 A JP21788297 A JP 21788297A JP 21788297 A JP21788297 A JP 21788297A JP 4195735 B2 JP4195735 B2 JP 4195735B2
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Japan
Prior art keywords
resin member
joint surface
resin
metal member
treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP21788297A
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Japanese (ja)
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JPH1161054A (en
Inventor
亨 松原
稔 田中
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Macoho Co Ltd
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Macoho Co Ltd
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Filing date
Publication date
Application filed by Macoho Co Ltd filed Critical Macoho Co Ltd
Priority to JP21788297A priority Critical patent/JP4195735B2/en
Publication of JPH1161054A publication Critical patent/JPH1161054A/en
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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal

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  • Chemical Treatment Of Metals (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Description

【0001】
【発明の属する技術分野】
本発明は、電子部品の樹脂部材接合面の前処理方法に関するものである。
【0002】
【従来の技術及び発明が解決しようとする課題】
従来、金属部材と樹脂部材とを接合した構造を有する半導体やプリント基板などの電子部品においては、金属部材に樹脂部材を接合する前に、金属部材に樹脂部材が良好に接合されるように、金属部材の樹脂部材接合面に化学的予備洗浄として酸やアルカリを用いて該金属部材の表面の脱脂処理を行ったり、また、酸やアルカリを用いて金属部材の表面を活性化したり(酸、アルカリによる洗浄)、また、酸などにより金属部材の表面の変質層を除去(エッチング)したり、また、バフ研磨やサンドブラスト処理により金属部材の表面の酸化被膜の除去、金属部材の表面の活性化及び金属部材の表面の変質層の除去をしたりしている。
【0003】
しかしながら、前述の従来の方法では、処理設備の構成が複雑であり、高価な設備投資が必要となり、製造コストが高くなると共に、化学的予備洗浄では、種々の薬品を使用するため、廃液による公害問題を発生させており、さらに、処理後の品質に大きなバラツキが生じたり、表面活性化が不十分である等の問題が生じている。
【0004】
また、金属部材にサビなどが生じ腐食する問題や、この腐食が進行して品質が劣化してしまう問題が生じ、この問題を解消するために前述の処理を行った後、金属部材にメッキ処理を行うなどの必要性もあった。
【0005】
従って、金属部材に樹脂部材を接合した場合、接合状態(密着性など)を良好にすることができず、所望の接合強度を確保することができなかったり、接合当初は所望の接合強度を確保できても接合面の品質が悪いため、時間の経過と共に接合強度が劣化して所望の接合強度を確保できないという問題が生じている。
【0006】
本発明は、前記従来の課題を解決するためになされたものであり、金属部材と樹脂部材との接合を高品質で信頼性の高い接合状態にする電子部品の樹脂部材接合面の前処理方法を提供するものである。
【0007】
【課題を解決するための手段】
添付図面を参照して本発明の要旨を説明する。
【0008】
金属部材1と樹脂部材4とを接合した構造を有する半導体やプリント基板などの電子部品の樹脂部材接合面の前処理方法であって、金属部材1の樹脂部材接合面10に樹脂部材4を接合する前にウエットブラスト加工を施し、その後、連続して化成処理を行うことを特徴とする電子部品の樹脂部材接合面の前処理方法に係るものである。
【0009】
また、請求項1記載の電子部品の樹脂部材接合面の前処理方法において、ウエットブラスト加工後に酸化防止処理を施し、その後、化成処理を行うことを特徴とする電子部品の樹脂部材接合面の前処理方法に係るものである。
【0010】
【発明の作用及び効果】
金属部材1の樹脂部材接合面10に、ウエットブラスト加工を施すから、金属部材1の樹脂部材接合面10は、酸化被膜が除去され且つ脱脂が行われると共に活性化し且つ変質層が除去され、さらに、ウエットブラスト加工では、金属部材1の樹脂部材接合面10を水で覆った状態で加工を行うため樹脂部材接合面10が酸化しにくくサビなどの発生を抑制することができ、ウエットブラスト加工後、連続して化成処理を施すので、樹脂部材接合面10が酸化する前に化成処理を施すことができ、密着性が良好で品質的にバラツキの少ない非常に信頼性の高い樹脂部材接合面10を形成することができ、この樹脂部材接合面10に樹脂部材4を接合するから両者の接合は密着性良く所望の接合強度で品質的にバラツキの少ない非常に信頼性の高いものとすることができる。
【0011】
また、ウエットブラスト加工後に酸化防止処理を施し、その後、化成処理を行うと、ウエットブラスト加工後の樹脂部材接合面10の酸化を確実に防止し得ることになる。
【0012】
【発明の実施の形態】
本発明の一実施例に係る電子部品の樹脂部材接合面の前処理方法に関して以下図面に基づき説明する。
【0013】
本実施例は、金属部材1と樹脂部材4とを接合した構造を有する半導体やプリント基板などの電子部品の一例として、樹脂封止型ICを採用する場合であり、以下、図1,2を基に説明する。
【0014】
この樹脂封止型ICは、半導体チップ6を載置するダイパット5の周囲にインナーリード7,タイバー3,アウターリード2を形成したリードフレーム1に、ダイパット5に半導体チップ6を載置し、半導体チップ6とインナーリード7とをボンディングワイヤ8で連接し、半導体チップ6とボンディングワイヤ8及びリードフレーム1のダイパット5,インナーリード7,タイバー3とを内包するように、モールド金型9をリードフレーム1に挟持させてモールド樹脂4を加圧注入してモールド樹脂4をリードフレーム1に接合するようにして硬化させる。ここで、リードフレーム1が金属部材1であり、モールド樹脂4が樹脂部材4である。
【0015】
前述のリードフレーム1にモールド樹脂4を接合する前に、リードフレーム1とモールド樹脂4との接合を良好にするために、リードフレーム1のモールド樹脂接合面10にウエットブラスト加工を施し、続いて、化成処理を可及的速やかに行う。
【0016】
ウエットブラスト加工は、水,砥材,エアの三要素で加工を行い、水に無数の砥材粒子を混合し、スラリー化した液体をポンプで圧送しながらエアで加速度を与えてノズルから噴射させ、この超高速で噴射されたスラリーを加工物に投射することで、加工物の表面に付着している残渣物や油脂分を剥ぎ取る。
【0017】
化成処理は、化学的または電気化学的処理によって金属自身を処理剤と反応させて金属の表面に新しい層(皮膜)を形成させる処理方法であり、塗装やメッキのように異種の物質を金属の表面に被覆させる方法とは反応機構が異なる。
【0018】
化成処理には、リン酸塩処理や酸化皮膜処理などがあるが、本実施例の電子部品の樹脂部材接合面の前処理方法には、酸化皮膜処理方法の内で黒化処理(黒色酸化処理)を用いており、黒化処理を用いると、金属部材1の樹脂部材接合面10をより密着性を良好に品質的にもバラツキの少ない非常に信頼性の高い樹脂部材接合面10を形成することができる。
【0019】
ウエットブラスト加工後に酸化防止処理を施した後、化成処理を行うと、ウエットブラスト加工後に樹脂部材接合面10が酸化することが防止され、化成処理を高品質に信頼性良く行うことができる。
【0020】
本実施例は、以上のように、金属部材1の樹脂部材接合面10に、ウエットブラスト加工を施すから、金属部材1の樹脂部材接合面10は、酸化被膜が除去され且つ脱脂が行われると共に活性化し且つ変質層が除去され、さらに、ウエットブラスト加工では、金属部材1の樹脂部材接合面10を水で覆った状態で加工を行うため樹脂部材接合面10が酸化しにくくサビなどの発生を抑制することができ、ウエットブラスト加工後、連続して化成処理を施すので、樹脂部材接合面10が酸化する前に化成処理を施すことができ、密着性が良好で品質的にバラツキの少ない非常に信頼性の高い樹脂部材接合面10を形成することができ、この樹脂部材接合面10に樹脂部材4を密着性良く接合して所望の接合強度で品質的にバラツキの少ない非常に信頼性の高いものとすることができる。
【0021】
そして、ウエットブラスト加工後に酸化防止処理を施し、その後、化成処理と樹脂部材接合面10の酸化を確実に防止できることになる。
【図面の簡単な説明】
【図1】本発明の一実施例に係る電子部品を示す斜視図である。
【図2】図1の断面図である。
【符号の説明】
1 金属部材
4 樹脂部材
10 樹脂部材接合面
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a pretreatment method for a resin member joint surface of an electronic component.
[0002]
[Prior art and problems to be solved by the invention]
Conventionally, in an electronic component such as a semiconductor or a printed circuit board having a structure in which a metal member and a resin member are joined, before the resin member is joined to the metal member, the resin member is favorably joined to the metal member. The surface of the metal member is degreased using acid or alkali as chemical preliminary cleaning on the resin member joint surface of the metal member, or the surface of the metal member is activated using acid or alkali (acid, (Washing with alkali), removal of an altered layer on the surface of the metal member with acid, etc. (etching), removal of the oxide film on the surface of the metal member by buffing or sandblasting, activation of the surface of the metal member In addition, the altered layer on the surface of the metal member is removed.
[0003]
However, in the above-described conventional method, the configuration of the processing equipment is complicated, and expensive equipment investment is required, the manufacturing cost is increased, and chemical precleaning uses various chemicals. In addition, there are problems such as large variations in quality after processing and insufficient surface activation.
[0004]
In addition, there is a problem of corrosion caused by rust on the metal member, and a problem that the corrosion progresses and the quality deteriorates. After performing the above-described treatment to solve this problem, the metal member is plated. There was also a need to do.
[0005]
Therefore, when a resin member is bonded to a metal member, the bonding state (adhesion, etc.) cannot be improved, and a desired bonding strength cannot be ensured, or a desired bonding strength is ensured at the beginning of bonding. Even if it can be done, the quality of the joint surface is poor, so that there is a problem that the joint strength deteriorates over time and the desired joint strength cannot be ensured.
[0006]
The present invention has been made in order to solve the above-described conventional problems, and a pretreatment method for a resin member bonding surface of an electronic component that makes a bonding between a metal member and a resin member a high-quality and reliable bonding state. Is to provide.
[0007]
[Means for Solving the Problems]
The gist of the present invention will be described with reference to the accompanying drawings.
[0008]
A pre-processing method for a resin member bonding surface of an electronic component such as a semiconductor or a printed circuit board having a structure in which a metal member 1 and a resin member 4 are bonded, and the resin member 4 is bonded to the resin member bonding surface 10 of the metal member 1 The present invention relates to a pretreatment method for a resin member joint surface of an electronic component, characterized in that wet blasting is performed before the chemical conversion, and then chemical conversion treatment is performed continuously.
[0009]
Further, in the pretreatment method for a resin member joint surface of an electronic component according to claim 1, before the resin member joint surface of the electronic component, the oxidation treatment is performed after the wet blasting, and then the chemical conversion treatment is performed. This relates to the processing method.
[0010]
[Action and effect of the invention]
Since the resin member bonding surface 10 of the metal member 1 is subjected to wet blasting, the resin member bonding surface 10 of the metal member 1 is activated and degreased as well as the oxidized layer is removed and the altered layer is removed. In the wet blasting process, the resin member bonding surface 10 of the metal member 1 is processed with water covered, so that the resin member bonding surface 10 is less likely to be oxidized and the occurrence of rust can be suppressed. Since the chemical conversion treatment is continuously performed, the chemical conversion treatment can be performed before the resin member bonding surface 10 is oxidized, and the resin member bonding surface 10 having excellent adhesion and less quality variation is highly reliable. Since the resin member 4 is bonded to the resin member bonding surface 10, the bonding between them should be highly reliable with a desired bonding strength and a small variation in quality. It can be.
[0011]
Further, if the oxidation treatment is performed after the wet blasting and then the chemical conversion treatment is performed, the oxidation of the resin member bonding surface 10 after the wet blasting can be surely prevented.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
A pretreatment method for a resin member joint surface of an electronic component according to an embodiment of the present invention will be described below with reference to the drawings.
[0013]
The present embodiment is a case where a resin-encapsulated IC is employed as an example of an electronic component such as a semiconductor or a printed circuit board having a structure in which the metal member 1 and the resin member 4 are joined. Based on the explanation.
[0014]
This resin-encapsulated IC has a semiconductor chip 6 mounted on the die pad 5 on a lead frame 1 in which inner leads 7, tie bars 3, and outer leads 2 are formed around a die pad 5 on which the semiconductor chip 6 is mounted. The chip 6 and the inner lead 7 are connected by the bonding wire 8, and the mold 9 is connected to the lead frame so that the semiconductor chip 6, the bonding wire 8 and the die pad 5 of the lead frame 1, the inner lead 7, and the tie bar 3 are contained. Then, the mold resin 4 is pressed and injected, and the mold resin 4 is cured so as to be bonded to the lead frame 1. Here, the lead frame 1 is the metal member 1, and the mold resin 4 is the resin member 4.
[0015]
Before the mold resin 4 is bonded to the lead frame 1, the mold resin bonding surface 10 of the lead frame 1 is subjected to wet blasting in order to improve the bonding between the lead frame 1 and the mold resin 4. , Perform chemical conversion as soon as possible.
[0016]
In wet blasting, processing is performed with three elements: water, abrasives, and air. A myriad of abrasive particles are mixed in water, and the slurryed liquid is pumped by a pump and accelerated by air and injected from a nozzle. By projecting the slurry sprayed at an ultra-high speed onto the workpiece, the residue and oils and fats adhering to the surface of the workpiece are peeled off.
[0017]
Chemical conversion treatment is a treatment method in which a metal itself reacts with a treatment agent by chemical or electrochemical treatment to form a new layer (film) on the surface of the metal. The reaction mechanism is different from the method of coating on the surface.
[0018]
The chemical conversion treatment includes phosphate treatment, oxide film treatment, etc. The pretreatment method for the resin component joint surface of the electronic component of this example is blackening treatment (black oxidation treatment) among the oxide film treatment methods. When the blackening treatment is used, the resin member bonding surface 10 of the metal member 1 is formed with a highly reliable resin member bonding surface 10 with better adhesion and less quality variation. be able to.
[0019]
When the chemical conversion treatment is performed after the wet blasting process, the resin member bonding surface 10 is prevented from being oxidized after the wet blasting process, and the chemical conversion process can be performed with high quality and high reliability.
[0020]
In the present embodiment, as described above, the resin member bonding surface 10 of the metal member 1 is subjected to wet blasting. Therefore, the resin member bonding surface 10 of the metal member 1 is subjected to degreasing and degreasing. In the wet blasting process, the resin member bonding surface 10 of the metal member 1 is covered with water, so that the resin member bonding surface 10 is less likely to be oxidized and rust is generated. Since the chemical conversion treatment is performed continuously after wet blasting, the chemical conversion treatment can be performed before the resin member joint surface 10 is oxidized. A highly reliable resin member bonding surface 10 can be formed, and the resin member 4 is bonded to the resin member bonding surface 10 with good adhesion, and the desired bonding strength and the variation in quality are very reliable. tall object It can be.
[0021]
Then, after the wet blasting process, the antioxidant treatment is performed, and thereafter, the chemical conversion treatment and the oxidation of the resin member bonding surface 10 can be surely prevented.
[Brief description of the drawings]
FIG. 1 is a perspective view showing an electronic component according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view of FIG.
[Explanation of symbols]
1 Metal member 4 Resin member
10 Resin member bonding surface

Claims (2)

金属部材と樹脂部材とを接合した構造を有する半導体やプリント基板などの電子部品の樹脂部材接合面の前処理方法であって、金属部材の樹脂部材接合面に樹脂部材を接合する前にウエットブラスト加工を施し、その後、連続して化成処理を行うことを特徴とする電子部品の樹脂部材接合面の前処理方法。A pretreatment method for a resin member joint surface of an electronic component such as a semiconductor or a printed circuit board having a structure in which a metal member and a resin member are joined, and wet blasting before joining the resin member to the resin member joint surface of the metal member A pretreatment method for a resin member joint surface of an electronic component, characterized in that a chemical conversion treatment is performed after processing. 請求項1記載の電子部品の樹脂部材接合面の前処理方法において、ウエットブラスト加工後に酸化防止処理を施し、その後、化成処理を行うことを特徴とする電子部品の樹脂部材接合面の前処理方法。2. A pretreatment method for a resin member joint surface of an electronic component according to claim 1, wherein an antioxidation treatment is performed after the wet blasting, followed by a chemical conversion treatment. .
JP21788297A 1997-08-12 1997-08-12 Pre-treatment method for resin component joint surface of electronic parts Expired - Lifetime JP4195735B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21788297A JP4195735B2 (en) 1997-08-12 1997-08-12 Pre-treatment method for resin component joint surface of electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21788297A JP4195735B2 (en) 1997-08-12 1997-08-12 Pre-treatment method for resin component joint surface of electronic parts

Publications (2)

Publication Number Publication Date
JPH1161054A JPH1161054A (en) 1999-03-05
JP4195735B2 true JP4195735B2 (en) 2008-12-10

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002326252A (en) * 2001-05-02 2002-11-12 Idemitsu Petrochem Co Ltd Metal inserted polyphenylene sulfide resin molded part
JP4124761B2 (en) 2004-09-10 2008-07-23 富士通株式会社 Mg or Mg alloy casing and manufacturing method thereof
JP4346541B2 (en) 2004-11-26 2009-10-21 日東電工株式会社 Wiring circuit board and manufacturing method thereof

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