JPS59222810A - Method and apparatus for inspecting wiring pattern - Google Patents

Abstract

PURPOSE:To detect a defective position easily in accordance with the difference of a color on an expanded picture by superposing a film having a colored wiring pattern to a light transmitting substrate on which the wiring pattern is formed and expanding the wiring pattern by a lens system. CONSTITUTION:The colored film 2 for test is fixed on a table at first, the substrate 3 is superposed to the surface of the film 2 and then a fitting tool for the film is moved in the X, Y and O directions by a micrometer to superpose the substrate 3 to the film 2 completely. After completing positioning, a picture expanded by 5 times and projected on a screen 5 is checked through eyes and a colored position is decided as a disconnection part. If a colored negative film is used in stead of a positive film, short can be detected. In the testing device, it is necessary to select the pattern expanding magnification out of 3-10 wide of a necessary and effective field.

Description

Detailed description of the invention [Description of the field to which the invention pertains] The present invention uses an optical method to inspect wiring patterns formed on glass substrates constituting various display panels such as fluorescent display tubes and plasma display panels. This paper relates to the method and apparatus used.

[Description of conventional technology]

Conventional inspection methods of this type have been broadly divided into two types: a method of electrically checking continuity, and a method of checking by enlarging the image using a projector or the like.

The former had a structure in which contact pins were placed at both ends of the wiring pattern, and an LED lamp would blink depending on whether there was continuity between them, and this could be used to check for disconnections, so (a) the pattern was complex. If the number of bins increases, such as t, the number of bins increases.

(b) If the pin contact is a point contact and the wiring pattern is minute, contact failures occur frequently.

(c) Since the pins are placed directly on the pattern, there are drawbacks such as damage to the wiring.

In addition, the effective field of view of the inspection method using a projector is relatively narrow, and in order to inspect all the wiring patterns on a glass substrate of the size generally used for display panels, the inspection must be performed while moving the glass substrate. There was a drawback.

[Purpose of the invention]

In order to solve these drawbacks, the present invention aims to make it easier to find defective locations by overlapping a colored film and a substrate to be inspected using an optical method. The present invention will now be described in detail.

[Structure and operation of the invention, clear]

FIG. 1 shows an embodiment of the present invention, in which 1 is a light source, 2 is a colored film for inspection, 3 is a substrate to be inspected, 4 is a lens, and 5 is a screen. The colored film for inspection No. 2 was prepared by forming a positive pattern colored sepia on a diazo photosensitive film (for example, Acros manufactured by Daicel Co., Ltd.) through exposure and development processing using a master film for exposure. At this time, the pattern is created by an exposure operation so that the line width of the pattern on the substrate to be inspected is approximately 10 μm.
Made in detail.

To operate this, first fix a colored film for inspection on a table, place the board to be inspected on top of the film,
Use a micrometer to measure the film fixing jig at X, Y, O.
Apply power in the direction to completely overlap. The board is fixed with 3 pins.

After the above alignment was completed, the 5x enlarged image displayed on the screen was visually checked, and areas that appeared colored were determined to be disconnected areas. Similarly, short circuits can be detected by using a colored negative film in place of a positive film. In this device, it is necessary to select a pattern magnification between 3 times and 10 times depending on the difficulty level of the wiring pattern and the required width of the effective field of view.

Further, as a colored film for inspection, in addition to a dian photosensitive film, a general color film or the like can be used.

By using the present invention, (1) It has become easier to find defective locations.

(11) The film surface is no longer scratched.

(liD inspection work has been shortened.

There were effects as described above.

[Brief explanation of the drawing]

FIG. 1 is a schematic diagram showing an embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Light source, 2... Colored film for inspection, 3... Board to be inspected, 4... Lens, 5... Screen. Figure 1

Claims (2)

[Claims] (1) When inspecting a wiring pattern formed on a transparent substrate by photoetching, a film with a colored wiring pattern and a transparent substrate on which the wiring pattern is formed are superimposed and magnified using a lens system. Particularly, an inspection method is characterized in that defective locations are discovered based on differences in color on the enlarged image. (2) An inspection apparatus for carrying out the above method, characterized by comprising a light source lens system and a fine adjustment mechanism for alignment.