JPS59221002A - Microstrip line unit - Google Patents

Abstract

PURPOSE:To attain an extremely assured structure of connection and at the same time to simplify greatly the production process for a microstrip line unit, by soldering a projection formed to a carrier plate on the rear side of a substrate directly to a pattern on the front side of the substrate through a through hole of the substrate. CONSTITUTION:A projection 8 is formed to a carrier plate 6 with correspondence to a through hole 2 formed at an earth connection point of a substrate 1 having a microstrip line formed as a surface pattern 4. The projection 8 is put through the hole 2, and the tip of the projection 8 is soldered to the pattern 4. With this connection between the projection 8 and the pattern 4, the pattern 4 can be connected directly to the plate 6 which serves as an earth conductor. As a result, a connection parts between the front and rear surface such as a holdfast, etc. can be excluded to simplify greatly the production process of a microstrip line unit having high workability.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a highly practical microstrip line unit suitable for use, for example, in an outdoor unit of a SHF satellite broadcasting receiver.

[Technical background of the invention and its problems]

Generally, a SHF satellite broadcasting receiver is constructed using a so-called microstrip channel with a carrier solate. As is well known, the microstrip line constitutes inductance, capacitance, etc. by surface conductors and turns formed on an insulating substrate, and uses the conductor pattern itself as a circuit element.

However, in this type of microstrip line,
It is often necessary to connect the ground point of the IJZ conductor to the ground conductor on the back side of the board, that is, the surface of the carrier plate, at the shortest possible distance. Conventionally, a through hole is provided in the substrate itself, or a through hole 2 is provided in a substrate 1 made of Teflon or the like as shown in FIG. 1, and an eyelet 3 is inserted into the through hole 2. After caulking this, the surface of the substrate 1/? The front pattern 4 and the carrier grate 6 are connected by soldering to the turns 4 and the back pattern 5, respectively. In this case, the carrier plate 6rri also serves to prevent deformation, bending, etc. of the relatively thin substrate 1 of J-≠. Note that 7 in the figure indicates a solder layer.

However, in such a conventional microstrip line unit structure, it is necessary to insert the hole 3 into the through hole 2 provided at the ground connection point and to caulk it, resulting in high manufacturing costs. Ta. Moreover, this...
Due to the tabs 3, the surface of the substrate 10 became uneven, which caused problems such as making uniform application of cream solder extremely difficult.

[Object of the Invention] The present invention has been made in consideration of the above-mentioned circumstances, and its purpose is to easily and reliably perform ground connection of a microstrip line constituted by a surface glossy turn. Moreover, it is an object of the present invention to provide a microstrip line unit having an inexpensive and highly practical configuration that suppresses unevenness on the surface of a board and enables uniform application of 1-norm solder.

[Summary of the invention]

In the present invention, a protrusion is provided on a carrier plate provided on the back surface of a substrate formed with a microstrip line as a front surface/mother turn, and the protrusion is inserted into a through hole provided in the substrate. It is characterized by an IJ tube line unit with a structure in which the tip, the surface of the board, the groove, and all soldering are connected.

〔Effect of the invention〕

Thus, according to the present invention, the protrusions provided on the carrier plate pass through the through holes of the substrate and the surface pattern IC is directly connected by soldering, so that the connection structure becomes extremely reliable. Moreover, since no eyelets are used, the manufacturing process can be greatly simplified and costs can be reduced. Furthermore, since the bumps on the surface caused by two-tone marks are removed, Ri1
Great effects such as making uniform application of Norm solder easier can be achieved.

[Embodiments of the invention]

Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

FIG. 2 is a schematic cross-sectional view showing the structure of the microstrip line unit according to the embodiment, and the same parts as those shown in FIG. 1 are denoted by the same reference numerals. The feature of this structure is that a protrusion 8 is formed on the carrier plate 6 in correspondence with the through hole 2 provided at the ground connection point of the substrate l, which has a microstrip line formed as a surface or turn 4. This protrusion 8'? f: Said through hole 2
and insert the tip into the surface pattern 4 of the front base &1.
It is located at the point where it is soldered to. By soldering the protrusions 8 and the surface pattern 4, the surface pattern 4 is directly connected to the carrier plate 6 as a ground conductor.

Thus, with this structure, there is no need for conventional connecting parts between the front and back surfaces such as the eyelet 3, and it is possible to significantly simplify the manufacturing process and reduce costs. Unlike the conventional method, there is no need to connect the front and back surfaces using eyelets 3 in advance, so the board 1 can be easily connected when no components are mounted.
There are no irregularities on the surface, and therefore, uniform print application of cream solder as a pretreatment can be carried out extremely well. Therefore, it is possible to improve the soldering properties of various parts and to improve the polarity of the microstrip line circuit. Moreover, since the assembly is performed by inserting the protrusion 8 of the carrier plate 6 into the through hole 2 of the substrate 1, the displacement can be reduced and the assembly accuracy can be improved.

As a result, it becomes possible to fully extract the necessary credit for micro strips and tube lines, and a great practical effect can be achieved.

As described above, according to the present invention, it is possible to provide a microstrip line unit with good workability and high reliability at a low cost, and its effects are tremendous.

Note that the through hole 2 of the substrate 1 and the protrusion 8 of the carrier plate 6
For example, they may be provided as appropriate depending on the circuit specifications of the microstrip line, and the number thereof is not limited. Further, the size of the protrusion 8 may be determined depending on the thickness of the substrate 1 and the diameter of the through hole 2.

[Brief explanation of drawings]

FIG. 1 is a cross-sectional configuration diagram showing an example of a conventional microstrip line unit, and FIG. 2 is a cross-sectional configuration diagram showing the structure of a microstrip line unit according to an embodiment of the present invention. 1... Substrate, 2... Through hole, 3... Eyelet, 4...
・Surface Guturn (microstrip line), 5...
・Back side・Turn, 6...Carrier Great, 7...
・Solder layer, 8...Protrusion. Applicant's agent Patent attorney Takehiko Suzue Figure 1 Figure 5 Figure 2

Claims (1)

[Claims] A substrate formed with microstrip narrow paths as a surface pattern, a metal carrier plate on which this substrate is placed and fixed and which serves as a grounding part for the microstrip line, and a protrusion formed on this carrier plate. The microstrip 7' is inserted into a hole provided in the substrate, and the tips of the protrusions are connected to the surface pattern of the substrate by soldering.