JPH0625910Y2 - Jig for aligning and mounting board mounted connectors - Google Patents

Jig for aligning and mounting board mounted connectors

Info

Publication number
JPH0625910Y2
JPH0625910Y2 JP4404390U JP4404390U JPH0625910Y2 JP H0625910 Y2 JPH0625910 Y2 JP H0625910Y2 JP 4404390 U JP4404390 U JP 4404390U JP 4404390 U JP4404390 U JP 4404390U JP H0625910 Y2 JPH0625910 Y2 JP H0625910Y2
Authority
JP
Japan
Prior art keywords
jig
board
mounting
land
aligning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP4404390U
Other languages
Japanese (ja)
Other versions
JPH045091U (en
Inventor
顕彦 林
Original Assignee
株式会社マックエイト
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社マックエイト filed Critical 株式会社マックエイト
Priority to JP4404390U priority Critical patent/JPH0625910Y2/en
Publication of JPH045091U publication Critical patent/JPH045091U/ja
Application granted granted Critical
Publication of JPH0625910Y2 publication Critical patent/JPH0625910Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Manufacturing Of Electrical Connectors (AREA)

Description

【考案の詳細な説明】 〔産業上の利用分野〕 本考案は、リード線と基板の回転を接続するコネクタ
を、基板上に略等間隔で一例に並んでいるランドに対し
てハンダ付けで取り付けるための基板実装コネクタの整
列取付用治具に関する。
[Detailed Description of the Invention] [Industrial field of application] The present invention attaches a connector for connecting the rotation of a lead wire and a substrate by soldering to lands that are lined up in an example at substantially equal intervals on the substrate. And a jig for aligning and mounting a board-mounted connector for the purpose.

〔従来の技術〕[Conventional technology]

従来のこの種の基板実装コネクタの一例を、第6図、第
7図に示し、以下これについて説明する。
An example of a conventional board-mounted connector of this type is shown in FIGS. 6 and 7, which will be described below.

図面において、Aは、一面から他面に貫通孔1を穿設し
た受体で、燐青銅等の導電体で、直方体或いは立方体等
のように、少なくとも貫通孔1と平行な2つの平面が形
成されており、一方の平面がプリント基板のパターン上
に直接にハンダ付けされるようになっている。
In the drawing, A is a receiving body having a through hole 1 formed from one surface to the other surface, and is a conductor such as phosphor bronze, and at least two planes parallel to the through hole 1 are formed, such as a rectangular parallelepiped or a cube. One surface is soldered directly onto the pattern on the printed circuit board.

この受体Aの貫通孔1内には、第7図に示す挿入体Cが
挿入されている。
The insert C shown in FIG. 7 is inserted into the through hole 1 of the receiver A.

この挿入体Cは、燐青銅の薄板のような導電性を有する
弾性板で形成されるもので、継目に僅少の隙間2を残し
て全体として円筒形に巻き、継目を含めて4本の軸心方
向の切込み3を形成して、この切込み3の深さまで円錐
形に絞り込んだものである。
This insert C is formed of an elastic plate having conductivity such as a thin plate of phosphor bronze, and is wound in a cylindrical shape as a whole with a slight gap 2 left at the joint, and four shafts including the joint. A notch 3 in the axial direction is formed and is conically narrowed to the depth of the notch 3.

従って、この円錐形部4の先端は開口5となっている。Therefore, the tip of the conical portion 4 is an opening 5.

この挿入体Cの円筒形部6の直径は1.2mm、長さ2mm、
開口5の内径0.2mm、受体Aの貫通孔1の内径は、円筒
径部6の直径よりも僅かに小さいので、挿入体Cは貫通
孔1に挿入されると、これから抜脱しなくなり、且つ受
体Aの外寸法は、チップ用抵抗と同程度とすることがで
きる。
The diameter of the cylindrical portion 6 of the insert C is 1.2 mm, the length is 2 mm,
Since the inner diameter of the opening 5 is 0.2 mm and the inner diameter of the through hole 1 of the receiving body A is slightly smaller than the diameter of the cylindrical diameter portion 6, when the insert C is inserted into the through hole 1, it does not come off from this, and The outer dimension of the receiver A can be made approximately the same as the chip resistor.

プリント基板外の電子部品に接続されたリード線Dの先
端には、挿入ピンEの孔部7が嵌められて、これをカシ
メることによって、挿入ピンEが取り付けられる。
The hole 7 of the insertion pin E is fitted to the tip of the lead wire D connected to the electronic component outside the printed circuit board, and the insertion pin E is attached by crimping.

この挿入ピンEには、前記挿入体C内に挿入される挿入
部8と、該挿入部8から孔部7に寄った場所には環状溝
9が形成されている。
The insertion pin E is formed with an insertion portion 8 to be inserted into the insertion body C, and an annular groove 9 at a position near the hole portion 7 from the insertion portion 8.

Fは、燐青銅、ステンレス等の導電性、弾性を有する薄
膜を、2つの折曲部10,11によってコ字状に折曲し
た係止板で、一方の折曲部10には球状の突面12が、
他方の折曲部11には環状溝9が挿入される窪部13が
形成されている。
F is a locking plate in which a thin film having conductivity and elasticity such as phosphor bronze and stainless steel is bent in a U shape by two bending portions 10 and 11. One of the bending portions 10 has a spherical protrusion. Surface 12
A concave portion 13 into which the annular groove 9 is inserted is formed in the other bent portion 11.

前記挿入ピンEは、受体Aの貫通孔1に挿入することに
よって、挿入体Cの開口5内に挿入部8が貫通し、円錐
形部4が開かんとする弾力、挿入体Cの隙間2が開かん
とする弾力によって、挿入部8は挿入体Cを介して貫通
孔1と接続状態となる。
When the insertion pin E is inserted into the through hole 1 of the receiving body A, the insertion portion 8 penetrates into the opening 5 of the insertion body C and the conical portion 4 does not open. The insertion portion 8 is connected to the through hole 1 via the insertion body C by the elastic force of the opening 2 of the insertion portion 8.

そして、係止板Fの両折曲部10,11が受体Aの端面
側となるように受体Aに第6図のように嵌合する。
Then, as shown in FIG. 6, the receiving plate A is fitted so that both the bent portions 10 and 11 of the locking plate F are on the end face side of the receiving member A.

すると、折曲部10の突面12が貫通孔1に係入すると
共に、折曲部11の窪部13が挿入ピンEの環状溝9に
嵌合し、係止板Fの受体Aから抜脱、挿入ピンEの貫通
孔1からの抜脱が防止されるものである。
Then, the projecting surface 12 of the bent portion 10 is engaged with the through hole 1, and the recess 13 of the bent portion 11 is fitted into the annular groove 9 of the insertion pin E, so that the receiving plate A of the locking plate F is removed. The withdrawal and the withdrawal of the insertion pin E from the through hole 1 are prevented.

このような基板実装コネクタは、第4図のように基板B
上に設けたパターンのランドB上に実装するには、ラ
ンドB上にクリームハンダを塗布しておいて、その上
に1個宛、基板実装コネクタの受体Aを載置し、クリー
ムハンダを加熱してこれを溶融し、セルフアライメント
効果によって受体AとランドBの位置を一致させ、そ
のハンダ付けによって、基板B上に実装していた。
Such a board-mounted connector has a board B as shown in FIG.
To mount on the land B 1 of the pattern provided above, apply the cream solder on the land B 1 and place the receiver A of the board-mounted connector on the land B 1 to apply the cream. The solder is heated to melt it, the positions of the receiver A and the land B 1 are aligned by the self-alignment effect, and the solder is mounted on the substrate B.

〔考案が解決しようとする課題〕[Problems to be solved by the device]

このような取付方法は、受体Aがチップ用抵抗と略同一
の程度の大きさであるため、基板B上の等ピッチのラン
ドB上に、正確に等ピッチで置くことは非常に困難
で、神経を使うため、疲労の激しい作業であった。
In such a mounting method, since the receiving body A is approximately the same size as the chip resistor, it is very difficult to place the receiving body A on the lands B 1 on the substrate B having the same pitch at exactly the same pitch. Since it uses nerves, it was a work that caused a lot of fatigue.

又、正確に置いたとしても、クリームハンダの溶融で受
体Aが浮き上がり、セルフアライメント効果でランドB
内でのハンダ付けは行われるもののそのピッチや方向
が狂うことがある。
Even if placed correctly, the receiver A floats up due to the melting of the cream solder, and the land B becomes self-aligning.
Although the soldering within 1 is performed, the pitch and the direction may be changed.

近年、被覆したリード線を多数、その被覆を帯状に接合
した帯状のリード線が、基板と基板、或いは他の電気部
品回路との接合に使用され、このような場合には、基板
スペースの有効化のために、ランドBのピッチも小さ
いものとなる。
In recent years, a large number of coated lead wires and strip-shaped lead wires obtained by joining the coatings in a strip shape have been used for joining substrates to substrates or other electric component circuits. As a result, the pitch of the land B 1 also becomes small.

このような場合に、受体Aの方向が狂うと、挿入ピンE
が接触を起す危険性が出て来る等の欠点があった。
In such a case, if the direction of the receiver A goes wrong, the insertion pin E
There was a drawback that there was a risk of causing contact.

〔考案の目的〕[Purpose of device]

本考案は、従来の基板実装コネクタの基板への整列取付
の前述の問題を解決するために、予じめ取付治具に基板
実装コネクタを整列して取り付けておき、基板への取付
後、取付治具を除去することによって、基板実装コネク
タを1個宛、基板のランド上に置く神経を使う作業を無
くし、正確に等ピッチで方向も変らずに、基板のランド
に基板実装コネクタをハンダ付けできる整列取付用治具
を提供することを目的とする。
In order to solve the above-mentioned problem of the conventional mounting and mounting of the board mounting connector on the board, the present invention aligns and mounts the board mounting connector on a preliminary mounting jig, and after mounting on the board, mounting is performed. By removing the jig, one board-mounted connector is addressed to one, eliminating the work of using nerves on the land of the board, and soldering the board-mounted connector to the land of the board without changing the direction at exactly the same pitch. An object is to provide a jig for aligning and mounting which can be performed.

〔課題を解決するための手段〕[Means for Solving the Problems]

本考案は、前述の目的を達成せんとするものであり、そ
の手段は、リード線の先端が挿入固定される孔が形成さ
れた少なくとも底面が平面状の実装コネクタを、前記底
面を揃えて基板のランド上に半田付けするための治具で
あって、前記実装コネクタの孔内に挿入される治具ピン
が略等ピツチで植設され、かつ前記治具ピン側に向かっ
て前記実装コネクタの回転を阻止するための庇を形成し
た基板実装コネクタの整列取付用治具を使用することに
より、その目的は達成される。
The present invention is intended to achieve the above-mentioned object, and the means is to mount a mounting connector having a flat bottom surface at least in which a hole into which a tip of a lead wire is inserted and fixed is formed on a board with the bottom surface aligned. Is a jig for soldering on the land, the jig pins to be inserted into the holes of the mounting connector are planted in substantially equal pitches, and the jig pins of the mounting connector are arranged toward the jig pin side. The object is achieved by using a jig for aligning and mounting a board-mounted connector having an eave formed to prevent rotation.

〔考案の実施例〕[Example of device]

次に、本考案の基板実装コネクタとして、前述の受体
A、挿入体C、挿入ピンE、係止板Fを使用する場合
を、第1図〜第5図について説明する。
Next, a case where the above-mentioned receiving body A, insert body C, insert pin E, and locking plate F are used as the board mounting connector of the present invention will be described with reference to FIGS.

図面において、Gは取付治具で、受体Aの底面から貫通
孔1の中心までよりも、底面20から低い位置に、基板
BのランドBと等ピッチで、挿入ピンEと同径の治具
ピン21が、ランドBの数だけ前方に向けて、植立さ
れている。
In the drawing, G is a mounting jig, which is located at a position lower than the bottom surface 20 of the receiving body A to the center of the through hole 1 and at the same pitch as the land B 1 of the board B and the same diameter as the insertion pin E. The jig pins 21 are erected forward by the number of the lands B 1 .

この取付治具Gの治具ピン21が突出している面には、
受体Aの端面に概略一致する窪部22を形成した庇23
が形成されている。
The surface of the mounting jig G on which the jig pins 21 project is
An eaves 23 having a recessed portion 22 which substantially coincides with the end face of the receiver A.
Are formed.

従って、第1図、第2図に示すように、受体Aを窪部2
2に挿入するようにして、治具ピン21に受体Aの挿入
体Cを嵌めれば、受体Aの底面は一平面となって、一列
に整列して取付治具GにランドBを同数の受体Aが取
り付けられる。
Therefore, as shown in FIG. 1 and FIG.
When the insert C of the receiver A is fitted into the jig pin 21 as if it were inserted into the jig 2, the bottom surface of the receiver A becomes a flat surface, aligned in a line, and the land B 1 is attached to the mounting jig G 1. The same number of receivers A are attached.

基板BのランドB上には、従来通りクリームハンダを
塗布し、ランドB上に受体Aが並ぶように、取付治具
Gを基板B上に置くが、この時、取付治具Gの底面は、
基板Bから浮いている。
Cream solder is applied onto the land B 1 of the board B as usual, and the mounting jig G is placed on the board B so that the receivers A are lined up on the land B 1. At this time, the mounting jig G is placed. The bottom of
It floats from the board B.

そして、クリームハンダの加熱、溶融によって受体Aと
ランドBとのハンダ付けを行うが、受体全体としての
セルフアライメント効果がランドBに対して行われ
る。
Then, the receiver A and the land B 1 are soldered by heating and melting the cream solder, and the self-alignment effect of the entire receiver is applied to the land B 1 .

このハンダ付けの終了後、取付ピン21を挿入体Cから
抜き出すことにより、受体Aから取付治具Gが取り外さ
れるものであるが、受体Aは取付ピン21の方向、ピッ
チに整列されて、ハンダ付けされる。
After the soldering is completed, the mounting jig 21 is removed from the receiving body A by removing the mounting pin 21 from the insert body C. The receiving body A is aligned in the direction and pitch of the mounting pins 21. , Soldered.

従って、帯状のリード線を用いる等で、ランドBの間
隔が狭い場合でも、挿入ピンEが接触をする等の不良品
となることはない。
Therefore, by using a strip-shaped lead wire or the like, even if the interval between the lands B 1 is narrow, the insertion pin E does not become a defective product such as contact.

なお、前記した実施例において使用される挿入体にはリ
ード線Dの先端に固定された挿入ピンEを取付けるもの
について説明したが、リード線Dを直接挿入するように
しても良い。
Although the insertion body used in the above-described embodiment is provided with the insertion pin E fixed to the tip of the lead wire D, the lead wire D may be directly inserted.

〔考案の効果〕[Effect of device]

本考案は叙上のように、多数の基板実装コネクタを、一
度に基板に整列して設けられているランド上にハンダ付
けして、取り付けることができるので、これを1個宛基
板のランド上に整列して載置する手数が不要となるばか
りでなく、載置された基板実装コネクタが、基板の振
動、衝撃等でずれたり、落下することがなく、従って、
その取付作業が極めて容易なものとなる。
As described above, according to the present invention, a large number of board-mounted connectors can be mounted by soldering them on the lands that are aligned with the board at a time. Not only is it unnecessary to align and place the board-mounted connector on the board, but the mounted board-mounted connector will not be displaced or dropped due to vibration or shock of the board.
The mounting work becomes extremely easy.

又、取り付けられた基板実装コネクタのずれが大きく、
ランドに対するセルフアライメント効果が充分に行われ
ず、回路や、これに挿入するリード線が短絡を生ずる等
の不良品を発生する危険性もなくなり、正しく整列して
見ばえのよい基板を得ることができるものである。
In addition, the displacement of the mounted board mounted connector is large,
The self-alignment effect on the land is not sufficient, and there is no risk of defective products such as short circuits in the circuit or the lead wires inserted into it, and it is possible to obtain a well-aligned substrate with good alignment. It is possible.

【図面の簡単な説明】[Brief description of drawings]

第1図は本考案の一実施例の取付治具に受体を装着した
その正面図、 第2図はその断面図、 第3図は取付治具の斜面図、 第4図は基板の斜面図、 第5図は取付状態の斜面図、 第6図は基板実装コネクタの接続状態の断面図、 第7図はその分解斜面図である。 A……受体、B……基板、B……ランド、C……挿入
体、D……リード線、E……挿入ピン、F……係止板、
G……取付治具、1……貫通孔、21……治具ピン。
FIG. 1 is a front view of a mounting jig according to an embodiment of the present invention with a receiver attached, FIG. 2 is a sectional view of the same, FIG. 3 is a perspective view of the mounting jig, and FIG. 5 and 5 are oblique views of the mounted state, FIG. 6 is a cross-sectional view of the connected state of the board-mounted connector, and FIG. 7 is an exploded oblique view thereof. A ...... receptacle, B ...... substrate, B 1 ...... lands, C ...... insert, D ...... lead, E ...... inserting pin, F ...... locking plates,
G ... Mounting jig, 1 ... Through hole, 21 ... Jig pin.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】リード線の先端が挿入固定される孔が形成
された少なくとも底面が平面状の実装コネクタを、前記
底面を揃えて基板のランド上に半田付けするための治具
であって、前記実装コネクタの孔内に挿入される治具ピ
ンが略等ピッチで植設され、かつ前記治具ピン側に向か
って前記実装コネクタの回転を阻止するための庇を形成
したことを特徴とする基板実装コネクタの整列取付用治
具。
1. A jig for soldering a mounting connector, in which at least a bottom surface is flat, in which a hole into which a tip of a lead wire is inserted and fixed is formed, to solder on a land of a board with the bottom surface aligned. Jig pins to be inserted into the holes of the mounting connector are planted at substantially equal pitches, and eaves are formed toward the jig pin side to prevent rotation of the mounting connector. Jig for aligning and mounting board mounted connectors.
JP4404390U 1990-04-26 1990-04-26 Jig for aligning and mounting board mounted connectors Expired - Lifetime JPH0625910Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4404390U JPH0625910Y2 (en) 1990-04-26 1990-04-26 Jig for aligning and mounting board mounted connectors

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4404390U JPH0625910Y2 (en) 1990-04-26 1990-04-26 Jig for aligning and mounting board mounted connectors

Publications (2)

Publication Number Publication Date
JPH045091U JPH045091U (en) 1992-01-17
JPH0625910Y2 true JPH0625910Y2 (en) 1994-07-06

Family

ID=31556990

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4404390U Expired - Lifetime JPH0625910Y2 (en) 1990-04-26 1990-04-26 Jig for aligning and mounting board mounted connectors

Country Status (1)

Country Link
JP (1) JPH0625910Y2 (en)

Also Published As

Publication number Publication date
JPH045091U (en) 1992-01-17

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