JPS5921668U - 電気メツキ処理装置における被処理物保持材の揺れ防止機構 - Google Patents
電気メツキ処理装置における被処理物保持材の揺れ防止機構Info
- Publication number
- JPS5921668U JPS5921668U JP11556982U JP11556982U JPS5921668U JP S5921668 U JPS5921668 U JP S5921668U JP 11556982 U JP11556982 U JP 11556982U JP 11556982 U JP11556982 U JP 11556982U JP S5921668 U JPS5921668 U JP S5921668U
- Authority
- JP
- Japan
- Prior art keywords
- processed
- electroplating processing
- holding material
- processing equipment
- prevention mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000009713 electroplating Methods 0.000 title claims 3
- 230000002265 prevention Effects 0.000 title 1
- 238000007747 plating Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 claims 1
- 238000002203 pretreatment Methods 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11556982U JPS5921668U (ja) | 1982-07-29 | 1982-07-29 | 電気メツキ処理装置における被処理物保持材の揺れ防止機構 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11556982U JPS5921668U (ja) | 1982-07-29 | 1982-07-29 | 電気メツキ処理装置における被処理物保持材の揺れ防止機構 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5921668U true JPS5921668U (ja) | 1984-02-09 |
| JPS6145168Y2 JPS6145168Y2 (OSRAM) | 1986-12-19 |
Family
ID=30266730
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11556982U Granted JPS5921668U (ja) | 1982-07-29 | 1982-07-29 | 電気メツキ処理装置における被処理物保持材の揺れ防止機構 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5921668U (OSRAM) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998032901A1 (en) * | 1997-01-22 | 1998-07-30 | Hideyuki Kobayashi | Product conveyance mechanism of electroplating apparatus |
| JP2009191303A (ja) * | 2008-02-13 | 2009-08-27 | Hitachi Aic Inc | プリント配線基板めっき用固定治具 |
| KR101140936B1 (ko) | 2009-09-14 | 2012-05-03 | 삼성전기주식회사 | 기판의 도금장치 및 도금방법 |
| JP2013011004A (ja) * | 2011-06-30 | 2013-01-17 | C Uyemura & Co Ltd | 表面処理装置およびめっき槽 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS586998A (ja) * | 1981-06-25 | 1983-01-14 | ナプコ・インコ−ポレ−テツド | 平担な平面加工物の高速めつき装置 |
-
1982
- 1982-07-29 JP JP11556982U patent/JPS5921668U/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS586998A (ja) * | 1981-06-25 | 1983-01-14 | ナプコ・インコ−ポレ−テツド | 平担な平面加工物の高速めつき装置 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998032901A1 (en) * | 1997-01-22 | 1998-07-30 | Hideyuki Kobayashi | Product conveyance mechanism of electroplating apparatus |
| JP2009191303A (ja) * | 2008-02-13 | 2009-08-27 | Hitachi Aic Inc | プリント配線基板めっき用固定治具 |
| KR101140936B1 (ko) | 2009-09-14 | 2012-05-03 | 삼성전기주식회사 | 기판의 도금장치 및 도금방법 |
| JP2013011004A (ja) * | 2011-06-30 | 2013-01-17 | C Uyemura & Co Ltd | 表面処理装置およびめっき槽 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6145168Y2 (OSRAM) | 1986-12-19 |
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