JPS5921668U - Shaking prevention mechanism for holding material to be processed in electroplating processing equipment - Google Patents

Shaking prevention mechanism for holding material to be processed in electroplating processing equipment

Info

Publication number
JPS5921668U
JPS5921668U JP11556982U JP11556982U JPS5921668U JP S5921668 U JPS5921668 U JP S5921668U JP 11556982 U JP11556982 U JP 11556982U JP 11556982 U JP11556982 U JP 11556982U JP S5921668 U JPS5921668 U JP S5921668U
Authority
JP
Japan
Prior art keywords
processed
electroplating processing
holding material
processing equipment
prevention mechanism
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11556982U
Other languages
Japanese (ja)
Other versions
JPS6145168Y2 (en
Inventor
正次 長倉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP11556982U priority Critical patent/JPS5921668U/en
Publication of JPS5921668U publication Critical patent/JPS5921668U/en
Application granted granted Critical
Publication of JPS6145168Y2 publication Critical patent/JPS6145168Y2/ja
Granted legal-status Critical Current

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  • Electroplating Methods And Accessories (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本装置の概略全体平面図、第２図は本装置の概
略縦断側面図、第３図は同じく概略縦断正面図を示した
ものである。 １・・・・・・メッキ処理槽、２・・・・・・前処理槽
、３・・・・・・後処理槽、４・・・・・・被処理物、
５・・・・・・被処理物保持材、６・・・・・・摺動レ
ール、７・・・・・・陽極、８・・・・・・摺動ガイド
部材、９・・・・・・基部、１０・・・・・・掛合部、
１１・・・・・・摺動移動部材。FIG. 1 is a schematic overall plan view of the device, FIG. 2 is a schematic vertical side view of the device, and FIG. 3 is a schematic vertical front view of the device. 1...Plating treatment tank, 2...Pre-treatment tank, 3...Post-treatment tank, 4...Product to be treated,
5... Workpiece holding material, 6... Sliding rail, 7... Anode, 8... Sliding guide member, 9... ... Base, 10... Engagement part,
11...Sliding movement member.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 一連に配置されたメッキ処理槽と、該メッキ処理槽に浸
漬されながら順次次工程に移送される被処理物保持材と
を備えた電気メツキ処理装置において、前記メッキ処理
槽の内壁に移送方向に沿った係合部を有する摺動ガイド
部材を設けると共は、該摺動ガイド部材の係合部に係合
されながら摺動される保合部を有する摺動移動部材を前
記被処理物保持材に取り付けたことを特徴とする電気メ
ツキ処理装置における被処理物保持材の揺れ防止機構。In an electroplating processing apparatus equipped with a series of plating tanks and a workpiece holding material that is immersed in the plating tank and transferred to the process sequentially, a plate is attached to the inner wall of the plating tank in the transfer direction. Providing a sliding guide member having an engaging portion along the same direction means that a sliding member having a retaining portion that is slid while being engaged with the engaging portion of the sliding guide member is used to hold the object to be processed. A mechanism for preventing shaking of a material holding a processed object in an electroplating processing apparatus, characterized in that it is attached to a material.
JP11556982U 1982-07-29 1982-07-29 Shaking prevention mechanism for holding material to be processed in electroplating processing equipment Granted JPS5921668U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11556982U JPS5921668U (en) 1982-07-29 1982-07-29 Shaking prevention mechanism for holding material to be processed in electroplating processing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11556982U JPS5921668U (en) 1982-07-29 1982-07-29 Shaking prevention mechanism for holding material to be processed in electroplating processing equipment

Publications (2)

Publication Number Publication Date
JPS5921668U true JPS5921668U (en) 1984-02-09
JPS6145168Y2 JPS6145168Y2 (en) 1986-12-19

Family

ID=30266730

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11556982U Granted JPS5921668U (en) 1982-07-29 1982-07-29 Shaking prevention mechanism for holding material to be processed in electroplating processing equipment

Country Status (1)

Country Link
JP (1) JPS5921668U (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998032901A1 (en) * 1997-01-22 1998-07-30 Hideyuki Kobayashi Product conveyance mechanism of electroplating apparatus
JP2009191303A (en) * 2008-02-13 2009-08-27 Hitachi Aic Inc Fixing jig for plating printed circuit board
KR101140936B1 (en) 2009-09-14 2012-05-03 삼성전기주식회사 Plating apparatus and method for substrate
JP2013011004A (en) * 2011-06-30 2013-01-17 C Uyemura & Co Ltd Surface treatment apparatus and plating tank

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS586998A (en) * 1981-06-25 1983-01-14 ナプコ・インコ−ポレ−テツド High speed plating apparatus of flat processed article

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS586998A (en) * 1981-06-25 1983-01-14 ナプコ・インコ−ポレ−テツド High speed plating apparatus of flat processed article

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998032901A1 (en) * 1997-01-22 1998-07-30 Hideyuki Kobayashi Product conveyance mechanism of electroplating apparatus
JP2009191303A (en) * 2008-02-13 2009-08-27 Hitachi Aic Inc Fixing jig for plating printed circuit board
KR101140936B1 (en) 2009-09-14 2012-05-03 삼성전기주식회사 Plating apparatus and method for substrate
JP2013011004A (en) * 2011-06-30 2013-01-17 C Uyemura & Co Ltd Surface treatment apparatus and plating tank

Also Published As

Publication number Publication date
JPS6145168Y2 (en) 1986-12-19

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