JPS59215631A - Manufacture of electrode for display device - Google Patents

Abstract

PURPOSE:To flex an electrode block after burning joint with accuracy better than 30mum by flexing a weight and baseboard in reverse direction and applying initial stress in reverse direction onto the electrode block. CONSTITUTION:The thermal expansion factor and rigidity of electrodes 5, 6 and a coupling spacer 3 will influence substantially onto the flexure of an electrode block after burning. Direction and amount of flexure to be produced in the electrode block when manufactured by conventional method are measured then a weight 15 and a baseboard 16 flexed by same amount in reverse direction are employed to provide an angle to a positioning pin. When flexing the weight 15 and baseboard 16 in reverse direction and applying initial stress in reverse direction onto the electrode block upon setting of the electrode block to balance with the thermal stress to be produced after burning thus to eliminate the residual stress, highly accurate sintering process can be achieved.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a manufacturing method for manufacturing a flat panel display device with improved positioning accuracy between electrodes.

Configuration of Conventional Example and its Problems First, the configuration of a flat display device manufactured by the manufacturing method of the present invention will be briefly described. The structure of the flat display device is schematically shown in FIGS. 1 to 6.

In FIG. 1, 1 is a phosphor surface, 2 is a cathode, 3 is a coupling spacer, and 4 is an electrode. The electron beam emitted from the cathode 2 is horizontally and vertically deflected and intensity-modulated by various electrodes 4, and reaches the phosphor surface 1, causing it to emit light.

The electrode 4 has a hole 1'16°1 as shown in Figures 2 and 3.
6' are provided, and the electron beam is directed through these holes 16°1
Pass through 6'. The stiffness of the electrode 4 depends on the shape and number of holes 16, 16'. Electrode 6 shown in FIGS. 2 and 3. Taking the electrode 6 as an example, the rigidity against tension and compression in the horizontal direction shown in FIG. 1 is greater for the electrode 6 than for the electrode 6. This is because the rigidity of the electrode 6 corresponds to the rigidity of the crosspiece 19 against simple tension and compression, whereas the rigidity of the electrode 6 corresponds to the bending rigidity of the crosspiece 20. A thin and long shape like the crosspiece 20 bends easily, and its bending rigidity is extremely low.

1, the bonding spacer 3 is attached to the base metal 9 as shown in Figure 4.
It has a structure in which an insulating material 3 for thickness adjustment is stuck to the top, and a glass 7 for bonding is applied to the second part. FIG. 6 shows a state in which the electrode 6 with high rigidity, the electrode 6 with low rigidity, and the coupling spacer 3 are combined. The electrodes 6, 6 are sintered and fixed by a frit glass 7 applied to the bonding spacer 3. At this time, each electrode 6, 6 must be correctly positioned relative to each other, and the dimension a in FIG.
It is required that the dimensions be compact and correspond to the printing pattern pitch (not shown) of the phosphor 1.

The electron beam travels through the window W at right angles to the plane of the paper, but the influence of electrode precision on the direction of the electron beam is more sensitive in the X direction. must be high compared to the Y direction.

The positioning of each electrode 6 is performed by inserting a pin into a positioning hole 1o that is precisely machined in the electrodes 6,6.

The coupling spacer 3 is used to insulate the electrodes 5 and 6 and to maintain and fix the electrodes at a predetermined distance. If the bonding spacer 3 having the structure shown in FIG. 4 is sandwiched between each electrode 5 and 6 and heated with a load P applied as shown in FIG. 1, each electrode can be fixed by the laminated glass 7. I can do it. Note that the glass 7 is completely crushed after melting and does not contribute to the electrode spacing, so the thickness hf of the insulator 8 becomes the spacing between the opposing electrodes 6, 6.

The above is the general structure and tanning method of the flat display device.

Next, problems related to the deflection accuracy of the electrode block that occur in the above configuration and manufacturing method will be explained.

When the electrodes 5, 6 and the bonding spacer 3, each of which does not bend at room temperature, are fired at 400 to 60° C. and then cooled to room temperature, the electrode block consisting of the electrodes 6, 6 and the bonding spacer 3 becomes deflected.

This is due to the difference in thermal expansion coefficient between each electrode and the frit glass, the difference in rigidity, and non-uniformity in the internal temperature of the block due to temperature eccentricity applied to the electrode block. This will be explained using an example.

Rather than firing and fixing the electrodes all at once, it is more accurate to manufacture the electrodes by dividing them into blocks and firing and fixing each one separately, and then firing the blocks together. Therefore, here we will consider the deflection that occurs after firing the block. FIG. 6 shows a conventional method for fixing electrodes 6 and 6 by firing with a bonding spacer 3. 11 is a weight, 12 is a base, 13.degree. and 13' is a sheet for preventing molten frit glass from adhering to the weight 11 and the base 12, and 14 is a positioning pin. The electrodes 6, 6 have one type with high rigidity against elongation and one with low rigidity as shown in FIGS. 2 and 3.

In this case, until the frit glass is hardened at 400 to 600'C, the electrodes 6, 6 and the bonding spacer 3 coated with nolinod glass 7 will expand according to their respective coefficients of thermal expansion, but the frit glass will harden and the electrode block After becoming a multilayer composite, if a temperature history of returning from 400 to soo'c to room temperature is applied, thermal stress is generated due to the difference in the coefficient of thermal contraction (equal to the coefficient of thermal expansion) of each. The electrode block then bends in an attempt to relieve this thermal stress. Deflection accuracy of 30 μz is required, but due to the above phenomenon, accuracy of only about 4 to 5 M (radius of curvature = 1600 baits) can often be obtained.

However, when this assembly technology is applied to the assembly of multilayer electrode plates, which are part of the components of image display devices using electron beams, if the assembly accuracy of the multilayer electrode plates is not accurate, the electron beam It was confirmed that deflection in the vertical and horizontal directions causes color unevenness in one image.

Therefore, in order to accurately assemble the multilayer electrode plate, assembly precision on the micron level was required, and it became necessary to devise an assembly method.

Purpose of the Invention The present invention has been made to solve the above-mentioned problems, and is designed to reduce the deflection of the electrode block by 30 μm after firing and bonding.
The accuracy is as follows.

Structure of the Invention The present invention comprises a substrate overlapped with a curved base so as to apply an initial bending stress in the opposite direction to cancel out the thermal stress generated inside an electrode block consisting of a plurality of electrodes and a bonding spacer after firing and bonding. This is about an electrode manufacturing method using a baking bonding jig as an element, and it eliminates residual stress inside the electrode block by balancing the thermal stress generated inside the electrode block with the initial bending stress in the opposite direction. It is possible to eliminate the deflection of the electrode block caused by this residual stress, which is extremely advantageous in terms of electrode assembly accuracy.

DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will now be described in detail with reference to FIG. The factors that affect the deflection of the electrode block after sintering are:
Underlying metal 9 for each electrode 5, 6 and coupling spacer 3. The coefficient of thermal expansion and rigidity of the insulator 8, the frit glass 7° sheet 13, 13', the weight 911, and the base 12, as well as the temperature unevenness of each part, etc. can be considered, but the essential factors are the electrodes 6, 6. and the thermal expansion coefficient and rigidity of the coupling spacer 3. These are the thermal expansion coefficient and rigidity of the bonding spacer 3. The base metal 9 and insulator 8 of the bonding spacer 3 are made into one multilayer composite.

In addition, considering the 7-lit glass 7 as an adhesive layer, the electrode 5. -6
In the case where a so-called 426 alloy is used, the coefficient of thermal expansion of the frit glass 7 is smaller than that of the 426 alloy, so the amount of thermal expansion of the entire spacer is smaller than that of the electrodes 6.

Considering this and looking at the heating process, until the frit glass 7, which is the adhesive layer, is cured at 400 to 600°C, the multilayer composite consisting of the base metal 9 of the bonding spacer 3 and the insulator 8, The frit glass 7 and the electrodes 6,6 each expand according to their own coefficients of thermal expansion. Further, after the frit glass is cured, it enters a temperature holding process. Therefore, during this heating process, no thermal stress is generated inside each of the layers, and the electrode block as a whole does not bend, so the electrode block does not bend.

Regarding the subsequent cooling process, each of the above layers tries to shrink at its own thermal shrinkage rate, but since it has already been bonded by fritted glass during the heating process, it does not shrink by the exact opposite mechanism of the heating process. . In other words, the amount of shrinkage of the electrode 6.6, which has relatively high rigidity and thermal shrinkage rate, and the multilayer composite consisting of the base metal 9 of the bonding spacer and the insulator 8 is suppressed by the frit glass 7;

The glass frit 7 shrinks more than the amount of shrinkage. At this time, thermal stress is generated inside each of the above layers, and the
When the O''C is cooled to room temperature, residual stress remains in the electrode block and leads to bending of the entire electrode block, causing the electrode block to bend.

The above is the mechanism of occurrence of deflection after the electrodes 5 and 6 are sintered.

This will be explained in more detail below. In this method, the direction and amount of deflection that occurs in the electrode block when manufactured by the conventional method is measured, and the same amount of deflection is applied to the weight 11 and the base 12 in the opposite direction of deflection. Perform processing. Also, the 1st positioning pin has an angle. The structure and sheet of the electrode block are the same as in the conventional case, so their explanation will be omitted. Heavy! 1111 and the substrate 12, and when setting the electrode block before sintering, an initial stress in the opposite direction is applied to the electrode block to balance the thermal stress generated after sintering and to create a residual stress. The feature of this manufacturing method is that it is avoided. In the conventional method, the electrode 6, which has the highest rigidity, bends to become concave (b), so the weight 11 and base 12 are processed so that the electrode 5 becomes convex after setting. However, the amount of deflection was measured in a non-contact state using a three-dimensional measuring device, and only a small amount was used.

Effects of the Invention As described above, according to the present invention, the weight and the base are deflected in the opposite direction, and the initial stress in the opposite direction is applied to the electrode block to cancel out the thermal stress generated after sintering, thereby reducing the residual stress. The deflection of the electrode block is ±30 μm (+: electrode 6 is concave, -: electrode 6 is convex).
It is now possible to do one thing within the next 10 days.

Further, according to the present invention, even if the configuration of the electrode block changes, a highly accurate sintering process can be achieved by separately preparing weights and bases that are processed to correspond to the amount of deflection in that case.

[Brief explanation of the drawing]

Figure 1 is a side view of a flat display device, Figures 2 and 3 are cliff views of large and small electrodes with l1iIII characteristics used in the same device, and Figures 4 (a) and (b) are the same. Cross-sectional view of the joint substrate used in the device, FIG. 5(a),
(b) is a cross-sectional view and a side view of the combination 117' of the electric conductor and the coupling spacer in the same device, FIG. 6 is a cross-sectional view of the flat display device, and FIG. 7 is a cross-sectional view of the flat display device. FIG. 2 is a cross-sectional view of a 1F surface type display device in one embodiment. 1... Fluorescent body, 2... Cathode, 3...
Coupling spacer, 4...' electrode, 5... electrode with high rigidity, 6... electrode with low rigidity, T...
Fri, Togarasu, 8...Insulator, 9...Base metal, 1Q...Positioning hole, 11...-Weight, 12
...base, 13, 13'...sheet,
14... Positioning bottle, 15... Flexible weight, 16... Flexible base. Name of agent: Patent attorney Toshio Nakao and 1 other person 2nd
Figure 3 Figure 4 Figure 5 α Figure 6 Figure 7 Figure 4

Claims (1)

[Claims] Between the cathode that generates the electron beam and the phosphor that emits light when the electron beam collides with it, a plurality of electrodes with different rigidities are installed to deflect the electron beam horizontally or vertically on the screen of the display device. A fired joint consisting of a base and a weight that are processed to apply an initial bending stress in the opposite direction to cancel out the thermal stress that occurs inside the multiple fired electrodes and the joint spacer when fired and joined through a joint spacer. 1. A method for manufacturing electrodes for a display device, characterized in that generation of residual stress inside a plurality of electrodes and a bonding spacer that have been fired and joined is prevented by placing the electrodes in a holding jig and joining them by firing.