JPS59211297A - Method of forming wiring circuit - Google Patents
Method of forming wiring circuitInfo
- Publication number
- JPS59211297A JPS59211297A JP8617283A JP8617283A JPS59211297A JP S59211297 A JPS59211297 A JP S59211297A JP 8617283 A JP8617283 A JP 8617283A JP 8617283 A JP8617283 A JP 8617283A JP S59211297 A JPS59211297 A JP S59211297A
- Authority
- JP
- Japan
- Prior art keywords
- wiring circuit
- circuit
- conductive paste
- circuit pattern
- mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は電気・電子回路（広く用いられる配線回路の形
成方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for forming electrical/electronic circuits (widely used wiring circuits).
従来、この種の配線回路は、例えば絶縁基板上ＩＣ所望
形状の回路パターンを有するスクリーン若しくはマスク
を配し、導電性ペーストを印刷、焼成することで配線回
路を形成する方法や、あるいは、導電性ペーストを細孔
から吐出しながら所望形状の回路パターンを作画し、こ
れを焼成して配線回路を形成する方法などが実施されて
いた。Conventionally, this type of wiring circuit has been formed by, for example, disposing a screen or mask having a circuit pattern of a desired IC shape on an insulating substrate, printing and baking a conductive paste, or forming a wiring circuit by printing and baking a conductive paste. A method has been practiced in which a circuit pattern of a desired shape is drawn while discharging a paste from pores, and the circuit pattern is fired to form a wiring circuit.
然しなから前記例のうち、導電性ペーストを印刷する方
式においては、所望形状の回路パターンを有するスクリ
ーン若しくはマスクを予め作成し１おかねばヶらヵ￥や
、目的よする配線回路を短期間で得る事に制約があ）、
シかも本来多量生産に適した方法であるために、短期間
で多品種を少量生産するには適さず、また導電性ペース
トを細孔から吐出する方法においては、細孔形状や導電
性ペーストの流体的特性による影響を大きく受け、所望
形状及び所望特性の配線回路を得る事が極めて困難であ
るなどの欠点を有していた。However, among the above examples, in the method of printing conductive paste, it is necessary to prepare a screen or mask with a circuit pattern of the desired shape in advance, and it is not necessary to prepare a screen or mask in advance, and it is possible to create a wiring circuit according to the purpose in a short period of time. There are restrictions on what you can get)
However, since this method is originally suitable for mass production, it is not suitable for producing a wide variety of products in small quantities in a short period of time. It has the disadvantage that it is greatly affected by fluid characteristics and it is extremely difficult to obtain a wiring circuit with a desired shape and desired characteristics.
本発明の目的は、導電性ペーストを用いたこの種の配線
回路を、直接描画方式の手法と印刷方式の手法における
各々の長所を兼ね合わせ、短期間で多品種少量生産用に
適合させ、しかも任意の所望形状の回路パターンを容易
に得る事のできる配線回路の形成方法を提供する仁とに
ある。It is an object of the present invention to combine the advantages of direct writing and printing methods to create a wiring circuit of this type using conductive paste, and to make it suitable for high-mix, low-volume production in a short period of time. It is an object of the present invention to provide a method for forming a wiring circuit that can easily obtain a circuit pattern of any desired shape.
本発明によると、絶縁基材表面にマスク材を配置し、所
望の回路部分の前記マスク材を除去し、該マスク材を除
去した部分に導電性ペーストを脚剣七噌埋め込み焼成す
ることを特徴とする配線回路の形成方法が得られる。According to the present invention, a mask material is placed on the surface of an insulating base material, the mask material is removed from a desired circuit portion, and a conductive paste is buried and fired in the portion from which the mask material is removed. A method for forming a wiring circuit is obtained.
順の説明図で、第１図（ａ）は絶縁基材２の表面にマス
ク材としてポジ型のフォトレジストｌを接着し、フォト
レジストｌを所望の回路パターン３になる如く例えばレ
ーザービームで露光し、更に現像を終了したものを示し
ている。これによりフォトレジスト
２の表面にまで達して除去されている事になる。FIG. 1(a) shows a positive photoresist 1 bonded to the surface of an insulating base material 2 as a mask material, and the photoresist 1 is exposed to, for example, a laser beam so as to form a desired circuit pattern 3. However, the image is shown after development has been completed. This means that the surface of the photoresist 2 has been reached and removed.
第１図（ｂ）は、前記回路パターン３の内部に、導電性
ペースト４を印刷手法により埋め込んだ後の状態を示す
第１図（ａ）に於けるＡ−Ａ’部分の断面図である。回
路パターン３の内部に埋め込まれた導電性ペースト４を
焼成する事によシ、各回路パターン領域において各々導
通を得、配線回路としての機能を有する事となる。フォ
トレジスト１が不要である場合には、溶解等によシ除去
する事も可能である。FIG. 1(b) is a cross-sectional view taken along the line AA' in FIG. 1(a), showing the state after the conductive paste 4 is embedded inside the circuit pattern 3 by a printing method. . By firing the conductive paste 4 embedded inside the circuit pattern 3, conduction is obtained in each circuit pattern area, and the circuit pattern has a function as a wiring circuit. If the photoresist 1 is not needed, it can be removed by dissolving it or the like.
更に、配線回路に対応して配線回路表面部、若しくは絶
縁基材２の表面にフォトレジスト五を接着する以前に於
いて、該絶縁基材２の表面部に電極を設けることにより
、外部からの導通を与えることもできる。Furthermore, before bonding the photoresist 5 to the surface of the wiring circuit or the surface of the insulating base material 2 corresponding to the wiring circuit, by providing an electrode on the surface of the insulating base material 2, it is possible to prevent external interference. It can also provide continuity.
本実施例におけるマスク材としてフォトレジストの代わ
シとして、電子線レジストを用い、露光手段として電子
ビームを用いることも可能であり、また、一般に広く使
用される印刷配線板の製法に用いられる露光手段、並び
にこれに適したフォトレジストを用いることも可能であ
ることは言うまでもない。In place of the photoresist as the mask material in this example, it is also possible to use an electron beam resist and use an electron beam as the exposure means. It goes without saying that it is also possible to use a photoresist suitable for this purpose.
本発明によると、以上説明したように、従来技術におけ
るこの種の配線回路の手法によるスクリーン若しくはマ
スク作成を不要とし、しかも印刷時のスクリーン若しく
はマスクと絶縁基板との位置合わせも勿論不要となる。According to the present invention, as explained above, there is no need to create a screen or mask using this type of wiring circuit technique in the prior art, and of course there is no need to align the screen or mask with the insulating substrate during printing.
また細孔から導電性ペーストを吐出して回路パターンを
作画する手法に比し、所望形状及び所望特性の配線回路
を形成することができる等、短期間で、多品種φ量生産
に適する効果がある。In addition, compared to the method of drawing a circuit pattern by discharging conductive paste from pores, it is possible to form a wiring circuit with a desired shape and desired characteristics in a short period of time, making it suitable for high-mix φ mass production. be.
第１図（弓）（ｂ）は本発明の一実施例の工程順の説明
図である。
ｌ・・・・・・フォトレジスト、２・旧・・絶縁基材、
３・・・・・・回路パターン、４・・・・・・導電性ペ
ースト。
（ａン
第 １ 図FIG. 1 (bow) (b) is an explanatory diagram of the process order of an embodiment of the present invention. l...Photoresist, 2.Old...Insulating base material,
3... Circuit pattern, 4... Conductive paste. (Figure 1)
Claims (1)
記マスク材を除去し、該マスク材を除去した部分に導電
性ペーストを埋め込み、焼成することを特徴とする配線
回路の形成方法。A method for forming a wiring circuit, which comprises: arranging a mask material on the surface of an insulating base material, removing the mask material from a desired circuit portion, embedding a conductive paste in the portion from which the mask material was removed, and firing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8617283A JPS59211297A (en) | 1983-05-17 | 1983-05-17 | Method of forming wiring circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8617283A JPS59211297A (en) | 1983-05-17 | 1983-05-17 | Method of forming wiring circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59211297A true JPS59211297A (en) | 1984-11-30 |
Family
ID=13879332
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8617283A Pending JPS59211297A (en) | 1983-05-17 | 1983-05-17 | Method of forming wiring circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59211297A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52137666A (en) * | 1976-05-13 | 1977-11-17 | Tokyo Shibaura Electric Co | Method of producing thick film circuit substrate |
| JPS5479473A (en) * | 1977-12-08 | 1979-06-25 | Fujitsu Ltd | Method of producing ceramic circuit board |
-
1983
- 1983-05-17 JP JP8617283A patent/JPS59211297A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52137666A (en) * | 1976-05-13 | 1977-11-17 | Tokyo Shibaura Electric Co | Method of producing thick film circuit substrate |
| JPS5479473A (en) * | 1977-12-08 | 1979-06-25 | Fujitsu Ltd | Method of producing ceramic circuit board |
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