JPS59208888A - Compound semiconductor light emitting element - Google Patents
Compound semiconductor light emitting elementInfo
- Publication number
- JPS59208888A JPS59208888A JP58083544A JP8354483A JPS59208888A JP S59208888 A JPS59208888 A JP S59208888A JP 58083544 A JP58083544 A JP 58083544A JP 8354483 A JP8354483 A JP 8354483A JP S59208888 A JPS59208888 A JP S59208888A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- type
- active layer
- forbidden band
- band width
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/305—Structure or shape of the active region; Materials used for the active region characterised by the doping materials used in the laser structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/3211—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures characterised by special cladding layers, e.g. details on band-discontinuities
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
- Led Devices (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は、半導体レーザもしくは発光ダイオード(LE
D )などの化合物半導体発光素子の構造に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a semiconductor laser or a light emitting diode (LE).
This relates to the structure of a compound semiconductor light emitting device such as D).
半導体レーザもしくはLEDは通常G a A sを基
板としたP−G aAJ7A s/G aA s/N−
G aAj?A s/n −G aA s 。Semiconductor lasers or LEDs are usually made using GaAs as a substrate.
G aAj? A s/n −G aA s .
もしくはInPを基板としたP −InP/I nGa
AsPバーInP等のダブルへテロ接合構造を有してい
る。ここで大文字のP、Nは広い禁制帯幅を有する層の
不純物型を表わし、小文字のp、nは狭い禁制帯幅を有
する層の不純物型を示す。このとき、注入されたキャリ
ヤーは活性層と呼ばれる禁制帯幅の狭いG a A s
層もしくはInGaAsP層に閉じ込められ発光再結合
し、光を放射する。このさい、P型のドーピング不純物
としては亜鉛(Zn) 、カドミウム(ed)等が通常
用いられる。しかしこれらのP型不純物がGaA/As
やInPの中に混入すると、P−GaA/As層やP−
InP層の発光効率を者しく劣化させる。著者等の実験
によると、ZnをInPの中にIxio (’+1
ドーピングすると、ドーピングしない場合に比べてフォ
トルミネッセンスの効率が約10分の1に落ちた。この
現象は、アクセプターにもちいたZnが結晶内を移動し
、■族原子が存在すべき格子に欠陥が発生し、この欠陥
が非発光再結合中心となったシ、格子点の中間に入シ込
みアクセプターとして働かなくなったシするためと考え
られている。このような非発光再結合中心が多く含壕れ
るP型クラッド層が活性層に接していると、活性層に閉
じ込められた注入キャリヤはP型クラッド層と活性層の
界面近傍で多く非発光再結合し、発光効率の低下の原因
となる。Or P-InP/InGa using InP as a substrate
It has a double heterojunction structure such as AsP/InP. Here, the capital letters P and N represent the impurity type of the layer having a wide forbidden band width, and the lower case letters p and n represent the impurity type of the layer having a narrow forbidden band width. At this time, the injected carriers are formed in a narrow forbidden band called the active layer.
or InGaAsP layer, and emit light by recombining and emitting light. At this time, zinc (Zn), cadmium (ED), etc. are usually used as the P-type doping impurity. However, these P-type impurities are GaA/As
or InP, the P-GaA/As layer or P-
This significantly deteriorates the luminous efficiency of the InP layer. According to the authors' experiments, Zn was added to InP by Ixio ('+1
Doping reduced the photoluminescence efficiency to about one-tenth of that without doping. This phenomenon occurs because the Zn used as an acceptor moves within the crystal, creating defects in the lattice where group II atoms should exist, and these defects become non-radiative recombination centers. This is thought to be due to the fact that it no longer works as an inclusive acceptor. When a P-type cladding layer containing many such non-radiative recombination centers is in contact with an active layer, many of the injected carriers confined in the active layer undergo non-radiative recombination near the interface between the P-type cladding layer and the active layer. This causes a decrease in luminous efficiency.
そこで、本発明の目的は、半導体レーザやLEDなどの
化合物半導体発光素子において、発光効率を改善するこ
とにある。SUMMARY OF THE INVENTION Therefore, an object of the present invention is to improve the luminous efficiency of compound semiconductor light emitting devices such as semiconductor lasers and LEDs.
本発明によれば、半導体結晶基板上に、N型で広い禁制
帯幅を有する層(N型クラッド層)とP型で広い禁制帯
幅を有する層(P型クラッド層)の間に狭い禁制帯幅を
有する発光層(活性層)を有するダブルへテロ接合構造
の半導体発光素子において、前記P型クラッドと活性層
の間に、P型不純物濃度がP型クラッド層よシ低く、か
つ禁制帯幅が活性層の禁制帯幅以上であシかつP型クラ
ッド層の泉制帯幅以下である層(バリヤ層)を有発明の
第1の実施例を説明する図であり、眉の負記号(N−、
P−等)は不純物濃度がN、Pに比べ10分の1程度と
小さいことを示す。この実施例では、n型の活性層14
とP型のクラッド層16の間に広い禁制帯幅を有しN型
の小さい不純物a度をもつ厚さ200Xの薄い・リヤ層
15が挾まれている。13はN型クラッド層である。キ
ャリヤはn型の活性層14に閉じ込められておシ、又非
発光再結合中心の原因となるP型不縄物は活性層14か
ら離れているため、活性層の発光効率が改p1この実施
例では、n型のバリヤ層41がn型の活性層14とP型
のクラッド層16の間に挾まシ、上記実施例と同様に発
光効率が改善される。According to the present invention, a narrow band gap is formed on a semiconductor crystal substrate between a layer that is N-type and has a wide bandgap (N-type cladding layer) and a layer that is P-type and has a wide bandgap (P-type cladding layer). In a semiconductor light emitting device having a double heterojunction structure having a light emitting layer (active layer) having a band width, there is a gap between the P type cladding and the active layer, where the P type impurity concentration is lower than that of the P type cladding layer, and a forbidden band is formed between the P type cladding and the active layer. FIG. 2 is a diagram illustrating the first embodiment of the invention, which includes a layer (barrier layer) whose width is greater than or equal to the forbidden band width of the active layer and less than or equal to the forbidden band width of the P-type cladding layer; (N-,
P-, etc.) indicates that the impurity concentration is about 1/10 as small as that of N and P. In this embodiment, an n-type active layer 14
A thin rear layer 15 having a thickness of 200× and having a wide forbidden band width and a small impurity degree of N type is sandwiched between the P type cladding layer 16 and the P type cladding layer 16. 13 is an N-type cladding layer. The carriers are confined in the n-type active layer 14, and the p-type impurities, which cause non-radiative recombination centers, are far from the active layer 14, so the luminous efficiency of the active layer decreases. In this example, the n-type barrier layer 41 is interposed between the n-type active layer 14 and the P-type cladding layer 16, and the luminous efficiency is improved as in the above embodiment.
上記実施例において、P型クラッドはZn ドープI
nPであシ、N型クラッドはSドープInPであった。In the above example, the P-type cladding is Zn doped I
The N-type cladding was S-doped InP.
又n型活性層はSドープInGaAsPであった。Further, the n-type active layer was S-doped InGaAsP.
P又はpのドーパントとしてZnに限らずcdでも良く
、N又はnのドーパントとしてSnでも良い。The P or p dopant is not limited to Zn, but CD may be used, and the N or n dopant may be Sn.
又InPやInGaAsPに限らず、G aA s +
GaAlAsでも良い。バリヤ層の膜厚は200Xに限
定されないことは明らかである。In addition to InP and InGaAsP, GaAs +
GaAlAs may also be used. It is clear that the thickness of the barrier layer is not limited to 200X.
る図であシ、図中13はN型クラッド層、14はn型活
性層、工6はP型クラッド層、15.41はバリヤ層を
表わす。In the figure, 13 represents an N-type cladding layer, 14 represents an n-type active layer, 6 represents a P-type cladding layer, and 15.41 represents a barrier layer.
躬1図 82図Figure 1 Figure 82
Claims (1)
N型クラッド層と呼ぶ)とP型で広い禁制帯幅を有する
層(P型クラッド層と呼ぶ)の間に狭い禁制帯幅を有す
る発光層(活性層と呼ぶ)を有するダブルへテロ接合構
造の半導体発光素子において、前記P型クラッド層と活
性層の間に、P型不純物濃度がP型クラッド層よシ低く
、かつ禁制帯幅が活性層の禁制帯幅以上であシかつPg
クラッド層の禁制帯幅以下であるN(又はn)型半導体
層(バリヤ層と呼ぶ)を有することを特徴とする化合物
半導体発光素子。On a semiconductor crystal substrate, an N-type layer with a wide forbidden band width (
A double heterojunction structure with a light-emitting layer (called an active layer) having a narrow bandgap between a P-type layer (called an N-type cladding layer) and a P-type layer with a wide bandgap (called a P-type cladding layer). In the semiconductor light emitting device, a P-type impurity concentration is lower than that of the P-type cladding layer, and a forbidden band width is greater than or equal to the forbidden band width of the active layer, and Pg is provided between the P-type cladding layer and the active layer.
A compound semiconductor light emitting device characterized by having an N (or n) type semiconductor layer (referred to as a barrier layer) whose width is equal to or less than the forbidden band width of a cladding layer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58083544A JPS59208888A (en) | 1983-05-13 | 1983-05-13 | Compound semiconductor light emitting element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58083544A JPS59208888A (en) | 1983-05-13 | 1983-05-13 | Compound semiconductor light emitting element |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS59208888A true JPS59208888A (en) | 1984-11-27 |
Family
ID=13805447
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58083544A Pending JPS59208888A (en) | 1983-05-13 | 1983-05-13 | Compound semiconductor light emitting element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59208888A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6377182A (en) * | 1986-09-20 | 1988-04-07 | Fujitsu Ltd | Semiconductor light emitting device |
JPS63155683A (en) * | 1986-12-19 | 1988-06-28 | Fujitsu Ltd | Semiconductor light emitting device |
EP0886326A2 (en) * | 1997-06-06 | 1998-12-23 | Hewlett-Packard Company | Separate hole injection structure for improved reliability light emitting semiconductor devices |
US6265732B1 (en) | 1998-11-30 | 2001-07-24 | Sharp Kabushiki Kaisha | Light emitting diode |
WO2019216308A1 (en) * | 2018-05-11 | 2019-11-14 | Dowaエレクトロニクス株式会社 | Semiconductor light-emitting element and method for manufacturing semiconductor light-emitting element |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5586182A (en) * | 1978-12-23 | 1980-06-28 | Fujitsu Ltd | Manufacture of semiconductor device |
-
1983
- 1983-05-13 JP JP58083544A patent/JPS59208888A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5586182A (en) * | 1978-12-23 | 1980-06-28 | Fujitsu Ltd | Manufacture of semiconductor device |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6377182A (en) * | 1986-09-20 | 1988-04-07 | Fujitsu Ltd | Semiconductor light emitting device |
JPS63155683A (en) * | 1986-12-19 | 1988-06-28 | Fujitsu Ltd | Semiconductor light emitting device |
EP0886326A2 (en) * | 1997-06-06 | 1998-12-23 | Hewlett-Packard Company | Separate hole injection structure for improved reliability light emitting semiconductor devices |
EP0886326A3 (en) * | 1997-06-06 | 1999-11-24 | Hewlett-Packard Company | Separate hole injection structure for improved reliability light emitting semiconductor devices |
US6265732B1 (en) | 1998-11-30 | 2001-07-24 | Sharp Kabushiki Kaisha | Light emitting diode |
US6384430B1 (en) | 1998-11-30 | 2002-05-07 | Sharp Kabushiki Kaisha | Light emitting diode |
WO2019216308A1 (en) * | 2018-05-11 | 2019-11-14 | Dowaエレクトロニクス株式会社 | Semiconductor light-emitting element and method for manufacturing semiconductor light-emitting element |
JP2019197868A (en) * | 2018-05-11 | 2019-11-14 | Dowaエレクトロニクス株式会社 | Semiconductor light emitting device and manufacturing method for semiconductor light emitting device |
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