JPS59208888A - Compound semiconductor light emitting element - Google Patents

Compound semiconductor light emitting element

Info

Publication number
JPS59208888A
JPS59208888A JP58083544A JP8354483A JPS59208888A JP S59208888 A JPS59208888 A JP S59208888A JP 58083544 A JP58083544 A JP 58083544A JP 8354483 A JP8354483 A JP 8354483A JP S59208888 A JPS59208888 A JP S59208888A
Authority
JP
Japan
Prior art keywords
layer
type
active layer
forbidden band
band width
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP58083544A
Other languages
Japanese (ja)
Inventor
Tomoo Yanase
柳瀬 知夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP58083544A priority Critical patent/JPS59208888A/en
Publication of JPS59208888A publication Critical patent/JPS59208888A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/30Structure or shape of the active region; Materials used for the active region
    • H01S5/32Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/30Structure or shape of the active region; Materials used for the active region
    • H01S5/305Structure or shape of the active region; Materials used for the active region characterised by the doping materials used in the laser structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/30Structure or shape of the active region; Materials used for the active region
    • H01S5/32Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
    • H01S5/3211Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures characterised by special cladding layers, e.g. details on band-discontinuities

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
  • Led Devices (AREA)

Abstract

PURPOSE:To enable to improve the luminous efficiency by a method wherein a layer whose P type impurity concentration is lower than that of a P type clad layer and forbidden band width is more than that of an active layer and less than that of said clad layer is provided between said clad layer and said active layer. CONSTITUTION:An N<-> layer should have an impurity concentration smaller than those of the N and P layers at approx. one-tenth. Besides, for example, a thin barrier layer 15 of the thickness of 200Angstrom having a large forbidden band width and an N type small impurity concentration is sandwiched between the N type active layer 14 and the P type clad layer 16. Carriers are enclosed in the N type active layer 14, and the P type impurity causing a non light emitting recombination center is distant from the active layer 14. Therefore, the luminous efficiency of the active layer 14 is improved.

Description

【発明の詳細な説明】 本発明は、半導体レーザもしくは発光ダイオード(LE
D )などの化合物半導体発光素子の構造に関するもの
である。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a semiconductor laser or a light emitting diode (LE).
This relates to the structure of a compound semiconductor light emitting device such as D).

半導体レーザもしくはLEDは通常G a A sを基
板としたP−G aAJ7A s/G aA s/N−
G aAj?A s/n −G aA s 。
Semiconductor lasers or LEDs are usually made using GaAs as a substrate.
G aAj? A s/n −G aA s .

もしくはInPを基板としたP −InP/I nGa
AsPバーInP等のダブルへテロ接合構造を有してい
る。ここで大文字のP、Nは広い禁制帯幅を有する層の
不純物型を表わし、小文字のp、nは狭い禁制帯幅を有
する層の不純物型を示す。このとき、注入されたキャリ
ヤーは活性層と呼ばれる禁制帯幅の狭いG a A s
層もしくはInGaAsP層に閉じ込められ発光再結合
し、光を放射する。このさい、P型のドーピング不純物
としては亜鉛(Zn) 、カドミウム(ed)等が通常
用いられる。しかしこれらのP型不純物がGaA/As
やInPの中に混入すると、P−GaA/As層やP−
InP層の発光効率を者しく劣化させる。著者等の実験
によると、ZnをInPの中にIxio (’+1  
ドーピングすると、ドーピングしない場合に比べてフォ
トルミネッセンスの効率が約10分の1に落ちた。この
現象は、アクセプターにもちいたZnが結晶内を移動し
、■族原子が存在すべき格子に欠陥が発生し、この欠陥
が非発光再結合中心となったシ、格子点の中間に入シ込
みアクセプターとして働かなくなったシするためと考え
られている。このような非発光再結合中心が多く含壕れ
るP型クラッド層が活性層に接していると、活性層に閉
じ込められた注入キャリヤはP型クラッド層と活性層の
界面近傍で多く非発光再結合し、発光効率の低下の原因
となる。
Or P-InP/InGa using InP as a substrate
It has a double heterojunction structure such as AsP/InP. Here, the capital letters P and N represent the impurity type of the layer having a wide forbidden band width, and the lower case letters p and n represent the impurity type of the layer having a narrow forbidden band width. At this time, the injected carriers are formed in a narrow forbidden band called the active layer.
or InGaAsP layer, and emit light by recombining and emitting light. At this time, zinc (Zn), cadmium (ED), etc. are usually used as the P-type doping impurity. However, these P-type impurities are GaA/As
or InP, the P-GaA/As layer or P-
This significantly deteriorates the luminous efficiency of the InP layer. According to the authors' experiments, Zn was added to InP by Ixio ('+1
Doping reduced the photoluminescence efficiency to about one-tenth of that without doping. This phenomenon occurs because the Zn used as an acceptor moves within the crystal, creating defects in the lattice where group II atoms should exist, and these defects become non-radiative recombination centers. This is thought to be due to the fact that it no longer works as an inclusive acceptor. When a P-type cladding layer containing many such non-radiative recombination centers is in contact with an active layer, many of the injected carriers confined in the active layer undergo non-radiative recombination near the interface between the P-type cladding layer and the active layer. This causes a decrease in luminous efficiency.

そこで、本発明の目的は、半導体レーザやLEDなどの
化合物半導体発光素子において、発光効率を改善するこ
とにある。
SUMMARY OF THE INVENTION Therefore, an object of the present invention is to improve the luminous efficiency of compound semiconductor light emitting devices such as semiconductor lasers and LEDs.

本発明によれば、半導体結晶基板上に、N型で広い禁制
帯幅を有する層(N型クラッド層)とP型で広い禁制帯
幅を有する層(P型クラッド層)の間に狭い禁制帯幅を
有する発光層(活性層)を有するダブルへテロ接合構造
の半導体発光素子において、前記P型クラッドと活性層
の間に、P型不純物濃度がP型クラッド層よシ低く、か
つ禁制帯幅が活性層の禁制帯幅以上であシかつP型クラ
ッド層の泉制帯幅以下である層(バリヤ層)を有発明の
第1の実施例を説明する図であり、眉の負記号(N−、
P−等)は不純物濃度がN、Pに比べ10分の1程度と
小さいことを示す。この実施例では、n型の活性層14
とP型のクラッド層16の間に広い禁制帯幅を有しN型
の小さい不純物a度をもつ厚さ200Xの薄い・リヤ層
15が挾まれている。13はN型クラッド層である。キ
ャリヤはn型の活性層14に閉じ込められておシ、又非
発光再結合中心の原因となるP型不縄物は活性層14か
ら離れているため、活性層の発光効率が改p1この実施
例では、n型のバリヤ層41がn型の活性層14とP型
のクラッド層16の間に挾まシ、上記実施例と同様に発
光効率が改善される。
According to the present invention, a narrow band gap is formed on a semiconductor crystal substrate between a layer that is N-type and has a wide bandgap (N-type cladding layer) and a layer that is P-type and has a wide bandgap (P-type cladding layer). In a semiconductor light emitting device having a double heterojunction structure having a light emitting layer (active layer) having a band width, there is a gap between the P type cladding and the active layer, where the P type impurity concentration is lower than that of the P type cladding layer, and a forbidden band is formed between the P type cladding and the active layer. FIG. 2 is a diagram illustrating the first embodiment of the invention, which includes a layer (barrier layer) whose width is greater than or equal to the forbidden band width of the active layer and less than or equal to the forbidden band width of the P-type cladding layer; (N-,
P-, etc.) indicates that the impurity concentration is about 1/10 as small as that of N and P. In this embodiment, an n-type active layer 14
A thin rear layer 15 having a thickness of 200× and having a wide forbidden band width and a small impurity degree of N type is sandwiched between the P type cladding layer 16 and the P type cladding layer 16. 13 is an N-type cladding layer. The carriers are confined in the n-type active layer 14, and the p-type impurities, which cause non-radiative recombination centers, are far from the active layer 14, so the luminous efficiency of the active layer decreases. In this example, the n-type barrier layer 41 is interposed between the n-type active layer 14 and the P-type cladding layer 16, and the luminous efficiency is improved as in the above embodiment.

上記実施例において、P型クラッドはZn  ドープI
nPであシ、N型クラッドはSドープInPであった。
In the above example, the P-type cladding is Zn doped I
The N-type cladding was S-doped InP.

又n型活性層はSドープInGaAsPであった。Further, the n-type active layer was S-doped InGaAsP.

P又はpのドーパントとしてZnに限らずcdでも良く
、N又はnのドーパントとしてSnでも良い。
The P or p dopant is not limited to Zn, but CD may be used, and the N or n dopant may be Sn.

又InPやInGaAsPに限らず、G aA s +
GaAlAsでも良い。バリヤ層の膜厚は200Xに限
定されないことは明らかである。
In addition to InP and InGaAsP, GaAs +
GaAlAs may also be used. It is clear that the thickness of the barrier layer is not limited to 200X.

る図であシ、図中13はN型クラッド層、14はn型活
性層、工6はP型クラッド層、15.41はバリヤ層を
表わす。
In the figure, 13 represents an N-type cladding layer, 14 represents an n-type active layer, 6 represents a P-type cladding layer, and 15.41 represents a barrier layer.

躬1図 82図Figure 1 Figure 82

Claims (1)

【特許請求の範囲】[Claims] 半導体結晶基板上に、N型で広い禁制帯幅を有する層(
N型クラッド層と呼ぶ)とP型で広い禁制帯幅を有する
層(P型クラッド層と呼ぶ)の間に狭い禁制帯幅を有す
る発光層(活性層と呼ぶ)を有するダブルへテロ接合構
造の半導体発光素子において、前記P型クラッド層と活
性層の間に、P型不純物濃度がP型クラッド層よシ低く
、かつ禁制帯幅が活性層の禁制帯幅以上であシかつPg
クラッド層の禁制帯幅以下であるN(又はn)型半導体
層(バリヤ層と呼ぶ)を有することを特徴とする化合物
半導体発光素子。
On a semiconductor crystal substrate, an N-type layer with a wide forbidden band width (
A double heterojunction structure with a light-emitting layer (called an active layer) having a narrow bandgap between a P-type layer (called an N-type cladding layer) and a P-type layer with a wide bandgap (called a P-type cladding layer). In the semiconductor light emitting device, a P-type impurity concentration is lower than that of the P-type cladding layer, and a forbidden band width is greater than or equal to the forbidden band width of the active layer, and Pg is provided between the P-type cladding layer and the active layer.
A compound semiconductor light emitting device characterized by having an N (or n) type semiconductor layer (referred to as a barrier layer) whose width is equal to or less than the forbidden band width of a cladding layer.
JP58083544A 1983-05-13 1983-05-13 Compound semiconductor light emitting element Pending JPS59208888A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58083544A JPS59208888A (en) 1983-05-13 1983-05-13 Compound semiconductor light emitting element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58083544A JPS59208888A (en) 1983-05-13 1983-05-13 Compound semiconductor light emitting element

Publications (1)

Publication Number Publication Date
JPS59208888A true JPS59208888A (en) 1984-11-27

Family

ID=13805447

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58083544A Pending JPS59208888A (en) 1983-05-13 1983-05-13 Compound semiconductor light emitting element

Country Status (1)

Country Link
JP (1) JPS59208888A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6377182A (en) * 1986-09-20 1988-04-07 Fujitsu Ltd Semiconductor light emitting device
JPS63155683A (en) * 1986-12-19 1988-06-28 Fujitsu Ltd Semiconductor light emitting device
EP0886326A2 (en) * 1997-06-06 1998-12-23 Hewlett-Packard Company Separate hole injection structure for improved reliability light emitting semiconductor devices
US6265732B1 (en) 1998-11-30 2001-07-24 Sharp Kabushiki Kaisha Light emitting diode
WO2019216308A1 (en) * 2018-05-11 2019-11-14 Dowaエレクトロニクス株式会社 Semiconductor light-emitting element and method for manufacturing semiconductor light-emitting element

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5586182A (en) * 1978-12-23 1980-06-28 Fujitsu Ltd Manufacture of semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5586182A (en) * 1978-12-23 1980-06-28 Fujitsu Ltd Manufacture of semiconductor device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6377182A (en) * 1986-09-20 1988-04-07 Fujitsu Ltd Semiconductor light emitting device
JPS63155683A (en) * 1986-12-19 1988-06-28 Fujitsu Ltd Semiconductor light emitting device
EP0886326A2 (en) * 1997-06-06 1998-12-23 Hewlett-Packard Company Separate hole injection structure for improved reliability light emitting semiconductor devices
EP0886326A3 (en) * 1997-06-06 1999-11-24 Hewlett-Packard Company Separate hole injection structure for improved reliability light emitting semiconductor devices
US6265732B1 (en) 1998-11-30 2001-07-24 Sharp Kabushiki Kaisha Light emitting diode
US6384430B1 (en) 1998-11-30 2002-05-07 Sharp Kabushiki Kaisha Light emitting diode
WO2019216308A1 (en) * 2018-05-11 2019-11-14 Dowaエレクトロニクス株式会社 Semiconductor light-emitting element and method for manufacturing semiconductor light-emitting element
JP2019197868A (en) * 2018-05-11 2019-11-14 Dowaエレクトロニクス株式会社 Semiconductor light emitting device and manufacturing method for semiconductor light emitting device

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