JPS59208797A - Josephson element integrated circuit device - Google Patents

Abstract

PURPOSE:To enable to attain a higher integration degree by a method wherein one Josephson element is respectively constituted separately on the both sides of a gland plane. CONSTITUTION:A first Josephson element has been formed on the upper side of a gland plane 2, while a second Josephson element has been formed on the lower side thereof. That is, a lower conductor 4 has been directly formed on a substrate 1, and, at the same time, a control line 18 also has been formed thereon. A second insulating layer 17 has been formed in such a way as to cover this control line 18 and an upper conductor 16 has been formed extending from the surface of an insulating thin film 15 formed on one part of the surface of the conductor 14 to the surface of the layer 17. Moreover, a first insulating layer 13 has been formed extending from the surface of the conductor 16 to one part of the surface of the conductor 14, where the film 15 has not been formed on the conductor 14, and a gland plane 2 has been formed thereon. On this gland plane 2 has been formed one more Josephson element. By constituting a Josephson element integrated circuit device using the Josephson junctions formed in such a way, the integrated degree can be upgraded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a Josephson element integrated circuit device, and particularly to a configuration of a Josephson element for improving the degree of integration thereof.

[Prior art]

Figure 1 is a cross-sectional view showing the structure of a conventional Josephson element, where +1+ is the substrate, (2) is the ground plane formed on the substrate (l), and (3) is the ground plane formed on the substrate (l). (4) is a lower conductor formed on a part of the first insulating layer (3); (5) is an insulating thin film formed on a part of the lower conductor (4); (6) is an upper conductor formed over the upper part of the insulating thin film (6) and the part where the lower conductor (4) is not formed on the first insulating layer (3); (7)
is a second insulation film formed from above the portion of the lower conductor (4) where the insulating thin film (5) is not formed to above the upper conductor (6). In the seventh layer, (8) is a control line area or wiring formed thereon.

An integrated circuit device using this Josephson baby usually has an insulating thin film (as shown in the figure) on top of the ground plane.
5) is composed of various inductances, resistors, etc., including a Josephson junction composed of a lower conductor (4) and an upper conductor (5), and a ground plane is essential.

By the way, since the conventional Josephson element is configured only on one side of the ground plane as mentioned above,
When circuitized, it was disadvantageous in improving the degree of integration.

[Summary of the invention]

The present invention has been made in view of the above points, and provides a Josephson element integrated circuit arrangement '1 with a high degree of integration by configuring separate Josephson elements on both sides of a ground plane. 0 [Embodiment of the Invention] FIG. 2 is a sectional view showing the configuration of a Josephson element in an embodiment of the present invention, and the same reference numerals as in the conventional example of FIG. 1 indicate equivalent parts. In this example, the ground plane (2
), a first Josephson element similar to that shown in Figure 1 is placed above the
A second Josephson element is formed under the ground plane (2i). That is, the lower conductor (14) is formed directly on the substrate [1], and the control line (18) is formed next to it. has been done. And this control line Q8
The second orgasm covers J! (171 is formed, and an insulating thin film QFi formed on a part of the surface of the lower conductor (14)
) The upper conductor (16j is formed over the second insulating layer (17). The insulating thin film (15) is formed over the lower conductor (14) from above the upper conductor (1G). A first insulating layer (131) is formed over the portion that is not covered, and a ground plane (2) is formed on it.
Another Josephson element exactly similar to the figure is formed, with first and second Josephson elements formed above and below the ground plane (2), respectively. By constructing a Josephson element integrated circuit device using the Josephson junction thus formed, the degree of integration can be improved.

〔Effect of the invention〕

As explained above, in this invention, Josephson junctions are formed on both the front and back sides of the ground plane, and these are used to construct a Josephson element integrated circuit device. You can do it.

[Brief explanation of the drawing]

1 is a cross-sectional view showing the structure of a Josephson device used in a conventional Josephson device integrated circuit device. FIG. 2 is a cross-sectional view showing the structure of a Josephson device used in an embodiment of the present invention. In the figure, (1) is the substrate, (2) is the ground plane, (3) is the insulating layer, (・1) is the second lower conductor, (5)
(7) is the second insulating thin film, (6) is the second upper conductor, (I3
) is an insulating layer, (14) is a first lower conductor, (15) is a fourth insulating thin film, (1 (<1 is the upper conductor on the outer side. The corresponding part is shown. Agent Masuo Oiwa Figure 1 Figure 2

Claims (1)

[Claims] +1+ A Josephson element integrated circuit device characterized in that it is constructed using Josephson junctions formed on both the front and back surfaces of a ground plane. (2) A first lower conductor formed directly on the substrate and a first upper conductor facing each other via a first insulating thin film formed on a part of the surface of the first lower conductor. a first Josephson junction, and a second lower conductor formed on and insulated from a ground plane formed on the first lower conductor and the first upper conductor via an insulating layer;
A second Josephson junction is used in which the second lower conductor is opposed to the second upper conductor through a second insulating thin film formed on a part of the surface of the second lower conductor. A Josephson element integrated circuit device as described in Scope 1.