JPS59207642A - Sealing device - Google Patents

Sealing device

Info

Publication number
JPS59207642A
JPS59207642A JP58082228A JP8222883A JPS59207642A JP S59207642 A JPS59207642 A JP S59207642A JP 58082228 A JP58082228 A JP 58082228A JP 8222883 A JP8222883 A JP 8222883A JP S59207642 A JPS59207642 A JP S59207642A
Authority
JP
Japan
Prior art keywords
case
cap
block
heater block
sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP58082228A
Other languages
Japanese (ja)
Inventor
Kojiro Shibuya
渋谷　幸二郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP58082228A priority Critical patent/JPS59207642A/en
Publication of JPS59207642A publication Critical patent/JPS59207642A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To perform sealing in a short time, by directly heating a case and a cap, melting the glass of a sealing material, thereby fusing and connecting the cap to the case, and cooling the cap with the cap being compressed in cooling air. CONSTITUTION:A cap 2 is positioned to a case 1, on which an IC 4 is mounted. Then the case 1 is directly heated by a preliminary heating part 22. The case 1, which has passed the heating part 22, is pushed to a heater block 7 by a positioning arm 16 and positioned. The surface of the cap 2 is thermally compressed by the tips of a compressing head 9 and a cap pushing rod 14. This state is continued until a low melting point glass 6 is melted. At the same time the compressing head 9 is lifted, the case 1 is separated from the block 7 by a pushing rod 15. Air is blown from an air nozzle 21 until the glass 6 is fixed. Then, the case 1 is lowered to the block 7. Thereafter the rod 14 is lifed to a specified position, and the case 1 is sent to a conveying block 23.

Description

【発明の詳細な説明】 本発明は半導体装置用ケース（以下ケースと称す）に搭
載された半導体集積回路素子（以下ＩＣと称す）をキャ
ップを用いて封止する封入装置に関するもので、特にケ
ースに搭載されたＩＣをフリットシールする装置に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an encapsulation device for sealing a semiconductor integrated circuit element (hereinafter referred to as an IC) mounted in a case for a semiconductor device (hereinafter referred to as a case) using a cap. The present invention relates to a device for frit-sealing ICs mounted on a computer.

通常フリットシールにはベルト炉が用いられ、ＩＣを搭
載したケースと、該ケースに位置決めして取付けられる
封止材の施されたキャップとに治具で適当な荷重が加え
られ、温度管理されたベルト炉内を通過させ封止材でキ
ャップをケースに溶着しＩＣを封止する。ベルト炉にお
けるケース及びキャップの加熱は雰囲気加熱であるため
、温度上昇、下降に長時間を要し、高温領域でのケース
及びキャップの存在時間が長くなる。ところで、高集積
化が進んだＩＣは高温にさらされる時間に反比例して寿
命が短くなるということが言われている。つまり、ＩＣ
の層間絶縁膜と配線との間にリークが生じやすくなるた
め、信頼性品質上問題になってくる。したがって通常の
ベルト炉での封止は、高温にさらされる時間が長いため
、このようなＩＣの封止には適用不可である。封止温度
の低い樹脂封止が考えられ゛るが、信頼性に欠け、前述
した対象ＩＣには不向きである。高信頼性の要求される
ＩＣには、ガラス封止が適用される。Normally, a belt furnace is used for frit sealing, and an appropriate load is applied with a jig to the case in which the IC is mounted and the cap with the sealant, which is positioned and attached to the case, and the temperature is controlled. The cap is passed through a belt furnace and the cap is welded to the case using a sealing material to seal the IC. Since the case and cap in the belt furnace are heated by atmospheric heating, it takes a long time for the temperature to rise and fall, and the time that the case and cap remain in the high temperature region becomes long. Incidentally, it is said that the lifespan of highly integrated ICs decreases in inverse proportion to the time they are exposed to high temperatures. In other words, I.C.
Since leakage is likely to occur between the interlayer insulating film and the wiring, this poses a problem in terms of reliability and quality. Therefore, sealing in a normal belt furnace is not applicable to sealing such ICs because the time of exposure to high temperatures is long. Resin sealing with a low sealing temperature is considered, but it lacks reliability and is not suitable for the target IC mentioned above. Glass sealing is applied to ICs that require high reliability.

本発明は前記問題点を解消するもので、ケース側及びキ
ャップ側からこれらを直接加熱し、封止材のガラスを溶
融してキャップをケースに溶着し、冷却するときには、
ケースをヒーターブロックから離し、キャップを加圧し
ながらエアーで冷却することにより短時間で封止を行な
うようにしたことを特徴とするものである。The present invention solves the above-mentioned problems, and when heating these directly from the case side and the cap side, melting the glass of the sealing material, welding the cap to the case, and cooling.
This is characterized in that the case is separated from the heater block and the cap is cooled with air while being pressurized, thereby achieving sealing in a short time.

以下本発明の一実施例を図面を用いて詳細に説明する。An embodiment of the present invention will be described in detail below with reference to the drawings.

第１図はケース１にキャップ２が位置決めされた様子を
断面図で示しだものである。第１図において、ＩＣ４を
搭載するケース１はプラグインパッケージであり、一般
的にセラミックでできている。FIG. 1 is a sectional view showing how the cap 2 is positioned in the case 1. In FIG. 1, a case 1 in which an IC 4 is mounted is a plug-in package, and is generally made of ceramic.

５は配線用のワイヤーである。まだキャップ２もセラミ
ックからできており、封止部分の一部である底面周囲に
は低融点ガラス６が施されている。5 is a wiring wire. The cap 2 is also made of ceramic, and a low melting point glass 6 is applied around the bottom surface, which is a part of the sealing part.

低融点ガラス６の軟化点は約３８０°、封止温度は約４
５０°である。The softening point of the low melting point glass 6 is approximately 380°, and the sealing temperature is approximately 4
It is 50°.

第２図は本発明装置を示すもので、第２図において、ケ
ースの搬送路に設置したヒーターブロック７にはヒータ
ー８が組込まれ、キャップ２に施される低融点ガラス６
が軟化する温度より若干高い温度になるようコントロー
ルされる。ヒーターブロック７のケース１が載る部分は
平面でかつケース１の幅より１罷程度太きめで、深さが
１７ｆ１ｍ程度の溝７ａが設けられている。この溝７ａ
は、予備加熱部２２から送り爪で送られたケース１を一
定姿勢に保つ。また、ヒーターブロック７には該ブロッ
ク７に送られたケース１をヒーターブロック７の表面か
ら約２０　ｍｍ突き上げる突き棒１５が設けられる。FIG. 2 shows the apparatus of the present invention. In FIG. 2, a heater 8 is incorporated in a heater block 7 installed on the conveyance path of the case, and a low melting point glass 6 is applied to the cap 2.
The temperature is controlled to be slightly higher than the temperature at which it softens. The part of the heater block 7 on which the case 1 is placed is flat and has a groove 7a about one line thicker than the width of the case 1 and about 17f1m deep. This groove 7a
keeps the case 1 fed from the preheating section 22 by the feeding claw in a constant posture. Further, the heater block 7 is provided with a push rod 15 that pushes up the case 1 sent to the block 7 by about 20 mm from the surface of the heater block 7.

突き棒１５の先端形状は平担で圧着時にはヒーターブロ
ック７の表面と同一面か、それよりわずか低い位置にあ
る。予備加熱部から送られたケース１は位置決めアーム
１６によりヒーターブロック７の溝７ａの一側に押し付
けられ位置決めされる。位置決めアーム１６の一端には
カムフォロア２０があり、モーター軸上に取りはけられ
たカム１９によって押し付けられ支点１７を中心に回転
運動し、他端でケース１を押し付ける。バネ１８はカム
フォロア２０がカム１９に追従させるだめのものである
。前記ヒーターブロック７の上方には圧着ヘッド９が昇
降可能に設置され、該ヘッド９の先端は平面でキャップ
２と同等の大きさであり、その先端周辺にはケース１の
リード３との接触を回避する逃げが設けられている。圧
着ヘッド９にはキャップ２に接触して、封止温度４５０
°Ｃに数十秒で達することのできるヒーター１０が組込
まれ、温度コントロールされる。圧着ヘッド９はスライ
ド軸１３に案内されて上下方向に３０ｍｍ程移動可能で
ある。また絶縁物１１によりスライド軸１３、スライド
軸固定板１２に直接熱が伝わらないようにしである。ま
だ圧着ヘッド９の中央には先端の形状が平面でストロー
クが圧着ヘッド９と同じキャップ押え棒１４が設けられ
、圧着ヘッド９の上下動作とｉ違うタイミングで上下動
作を行う第３図に溶融した低融点ガラス６を冷却し固着
させるために、ケース１とキャップ２を加圧しながら冷
却している様子を示す。加圧力を膨張力より大きくして
、ケース１とキャップ２を加圧しながら冷却し、ケース
内に閉じ込められた空気が膨張してもれないようにする
。キャップ押え棒１４の加圧力は１〜２ｋｇに調整可能
になっている。冷却効果を上げるだめにヒーターブロッ
ク７から突き上げ棒１５によって押し上げられたケース
１及びキャップ２は圧着ヘッド９の付近に数個設けられ
たエアーノズル２１によって冷却される。数個のエアー
ノズル２１の先端は、それぞれキャップ２の周囲上に向
けられている。The tip of the push rod 15 is flat and is at the same level as the surface of the heater block 7 or at a slightly lower position during crimping. The case 1 sent from the preheating section is pressed against one side of the groove 7a of the heater block 7 by the positioning arm 16 and positioned. A cam follower 20 is provided at one end of the positioning arm 16, which is pressed by a cam 19 disposed on the motor shaft, rotates about a fulcrum 17, and presses the case 1 at the other end. The spring 18 is used to cause the cam follower 20 to follow the cam 19. A crimping head 9 is installed above the heater block 7 so as to be movable up and down.The tip of the head 9 is flat and has the same size as the cap 2, and there is a crimping head 9 around the tip that makes contact with the lead 3 of the case 1. There are escape routes to avoid. The crimping head 9 is in contact with the cap 2 and has a sealing temperature of 450°C.
A heater 10 that can reach °C in several tens of seconds is incorporated to control the temperature. The crimping head 9 is guided by a slide shaft 13 and can move approximately 30 mm in the vertical direction. Further, the insulator 11 prevents heat from being directly transmitted to the slide shaft 13 and the slide shaft fixing plate 12. At the center of the crimping head 9, there is provided a cap presser rod 14 with a flat tip and the same stroke as the crimping head 9, which moves up and down at a different timing from the up and down movement of the crimping head 9, as shown in Fig. 3. The case 1 and the cap 2 are shown being cooled while being pressurized in order to cool and fix the low melting point glass 6. The pressing force is made larger than the expansion force, and the case 1 and the cap 2 are cooled while being pressurized to prevent the air trapped in the case from expanding and leaking. The pressing force of the cap presser rod 14 can be adjusted to 1 to 2 kg. In order to increase the cooling effect, the case 1 and the cap 2 pushed up from the heater block 7 by the push-up rod 15 are cooled by several air nozzles 21 provided near the crimping head 9. The tips of the several air nozzles 21 are directed onto the periphery of the cap 2, respectively.

次に本発明の作用を第２図、第３図を用いて説明する。Next, the operation of the present invention will be explained using FIGS. 2 and 3.

キャップ２を位置決めして取付けたケース１は予備加熱
部２２で直接加熱される。予備加熱部２２は、ケース１
やキャップ２の急激な温度上昇によるワレ、カケを防止
するために、コントロール温度の違うブロックに分割さ
れている。該ブロックを通過したケース１は圧着部のヒ
ーターブロック７に送り爪で送られる。送られてきたケ
ース１は位置決めアーム１６によりヒーターブロック７
に押し付けられ位置決めされる。The case 1 with the cap 2 positioned and attached is directly heated in the preheating section 22. The preheating section 22 is the case 1
In order to prevent cracking or chipping due to sudden temperature rise of the cap 2 and cap 2, it is divided into blocks with different control temperatures. The case 1 that has passed through the block is sent to the heater block 7 in the crimping section by a feed claw. The sent case 1 is attached to the heater block 7 by the positioning arm 16.
It is pressed and positioned.

次に、圧着ヘッド９と、キャップ押え棒１４が同時に下
降し、圧着ヘッド９の先端及びキャップ押え棒１４の先
端がキャップ２の表面を熱加圧する。Next, the crimp head 9 and the cap presser bar 14 descend simultaneously, and the tip of the crimp head 9 and the tip of the cap presser bar 14 heat and press the surface of the cap 2 .

その状態で低融点ガラス６が溶融するまで継続される。This state is continued until the low melting point glass 6 is melted.

その後、圧着ヘッド９のみが上昇する。このとき、キャ
ップ２はキャップ押え棒１４によって加圧された状態で
ある。次に突き棒１５によって強制的にヒーターブロッ
ク７からケース１を離すと同時に、圧着ヘッド９の周囲
に設けられたエアーノズル２１からエアーを低融点ガラ
ス６が固着するまで吹きつける。次に突き棒１５が下降
終了後、つまりケース１がヒーターブロック７に降され
たと同時に、キャップ押え棒１４は定位置に上昇する。After that, only the crimping head 9 rises. At this time, the cap 2 is in a state of being pressurized by the cap presser rod 14. Next, the case 1 is forcibly separated from the heater block 7 by the push rod 15, and at the same time, air is blown from the air nozzle 21 provided around the crimping head 9 until the low melting point glass 6 is fixed. Next, after the push rod 15 finishes lowering, that is, at the same time as the case 1 is lowered onto the heater block 7, the cap presser rod 14 rises to the normal position.

さらに次の瞬間、ケース１は送り爪によって搬出ブロッ
ク２３に送られる・ したがって、本発明によれば、ケース１及びキャップ２
を直接加熱するだめ、封止温度に達する時間が従来に比
べ非常に短く、従来、ＩＣが４００’Ｃの高温にさらさ
れる時間が数十分であったのに対し、本発明ではわずか
１分程度になり、封止処理が数分で行なうことができ、
耐熱性の低いＩＣをその特性に影響を与えることなく封
止できる効果を有するものである。Further, at the next moment, the case 1 is sent to the unloading block 23 by the feed claw. Therefore, according to the present invention, the case 1 and the cap 2
The time it takes to reach the sealing temperature is very short compared to conventional methods.In the past, it took several tens of minutes for an IC to be exposed to a high temperature of 400'C, but with the present invention, the time required to reach the sealing temperature is only one minute. The sealing process can be carried out in a few minutes.
This has the effect of sealing an IC with low heat resistance without affecting its characteristics.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はＩＣが搭載されたプラグインパッケージにキャ
ップが位置決めされた様子を示す断面図、第２図は本発
明において、ケースとキャップとを熱圧着している様子
を示す側面図、第３図は本発明において、ケース及びキ
ャップをヒーターブロックから離し、加圧しながら冷却
している様子を示す正面図である。 １・・・ケース、２・・・キャップ、３・・・リード、
４・・・ＩＣ（半導体集積回路素子）、７・・化−ター
ブロック、９・・・圧着ヘッド、１４・・・キャップ押
え棒、１５・・・突き棒、２１・・・エアーノズル、２
２・・・予備加熱部、２３・・・住出ブロック 第１図 第２図FIG. 1 is a sectional view showing how the cap is positioned on a plug-in package in which an IC is mounted, FIG. 2 is a side view showing how the case and the cap are bonded by thermocompression in the present invention, and FIG. The figure is a front view showing how the case and cap are separated from the heater block and cooled while being pressurized in the present invention. 1...Case, 2...Cap, 3...Lead,
4... IC (semiconductor integrated circuit element), 7... Converter block, 9... Crimping head, 14... Cap presser bar, 15... Push rod, 21... Air nozzle, 2
2... Preheating section, 23... Sumide block Figure 1 Figure 2

Claims (1)

【特許請求の範囲】[Claims] （１）半導体装置用ケースにキャップを溶着し、該ケー
ス内に搭載された半導体集積回路素子を封止する封入装
置において、前記半導体集積回路素子を搭載したケース
の搬送路に沿って該ケースを予備加熱する予備加熱部と
、該予備加熱部よりのケースをさらに加熱するヒーター
ブロックと、ケースで封止された半導体集積回路素子を
搬出する搬出ブロックとを配設し、前記ヒーターブロッ
クに対向させて、キャップを加熱しこれを該ヒーターブ
ロックのケースに熱圧着させる圧着ヘッドを移動可能に
設置すると共に、キャップ及びケースを冷却させる冷却
用ノズルを設置し、前記ヒーターブロックに該ブロック
からケース及びキャップを冷却用ノズルに向けて移送す
る突き棒を設けると共に前記圧着ヘッドにキャップを押
付ける押え棒を設けたことを特徴とする封入装置。(1) In an enclosing device that welds a cap to a semiconductor device case and seals a semiconductor integrated circuit element mounted in the case, the case is attached along a transport path of the case in which the semiconductor integrated circuit element is mounted. A preheating section for preheating, a heater block for further heating the case from the preheating section, and an unloading block for unloading the semiconductor integrated circuit element sealed in the case are disposed, and are opposed to the heater block. A crimping head is movably installed to heat the cap and thermally press the cap to the case of the heater block, and a cooling nozzle is installed to cool the cap and the case, and the case and the cap are moved from the block to the heater block. 1. An enclosing device comprising: a push rod for transferring the cap toward a cooling nozzle; and a presser bar for pressing the cap against the crimping head.
JP58082228A 1983-05-11 1983-05-11 Sealing device Pending JPS59207642A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58082228A JPS59207642A (en) 1983-05-11 1983-05-11 Sealing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58082228A JPS59207642A (en) 1983-05-11 1983-05-11 Sealing device

Publications (1)

Publication Number Publication Date
JPS59207642A true JPS59207642A (en) 1984-11-24

Family

ID=13768545

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58082228A Pending JPS59207642A (en) 1983-05-11 1983-05-11 Sealing device

Country Status (1)

Country Link
JP (1) JPS59207642A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5700318B1 (en) * 2014-07-23 2015-04-15 Ｃｒｏｓｓ大阪株式会社 Sealing device and sealing / cooling method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5700318B1 (en) * 2014-07-23 2015-04-15 Ｃｒｏｓｓ大阪株式会社 Sealing device and sealing / cooling method
JP2016025268A (en) * 2014-07-23 2016-02-08 Ｃｒｏｓｓ大阪株式会社 Sealing device and sealing/cooling method

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