JPS59206873A - 発光表示装置 - Google Patents

発光表示装置

Info

Publication number
JPS59206873A
JPS59206873A JP58081967A JP8196783A JPS59206873A JP S59206873 A JPS59206873 A JP S59206873A JP 58081967 A JP58081967 A JP 58081967A JP 8196783 A JP8196783 A JP 8196783A JP S59206873 A JPS59206873 A JP S59206873A
Authority
JP
Japan
Prior art keywords
light
lamps
emitting display
group
lamp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58081967A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0347560B2 (enrdf_load_stackoverflow
Inventor
南　節朗
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP58081967A priority Critical patent/JPS59206873A/ja
Publication of JPS59206873A publication Critical patent/JPS59206873A/ja
Publication of JPH0347560B2 publication Critical patent/JPH0347560B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Devices (AREA)
  • Traffic Control Systems (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
  • Led Device Packages (AREA)
JP58081967A 1983-05-11 1983-05-11 発光表示装置 Granted JPS59206873A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58081967A JPS59206873A (ja) 1983-05-11 1983-05-11 発光表示装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58081967A JPS59206873A (ja) 1983-05-11 1983-05-11 発光表示装置

Publications (2)

Publication Number Publication Date
JPS59206873A true JPS59206873A (ja) 1984-11-22
JPH0347560B2 JPH0347560B2 (enrdf_load_stackoverflow) 1991-07-19

Family

ID=13761267

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58081967A Granted JPS59206873A (ja) 1983-05-11 1983-05-11 発光表示装置

Country Status (1)

Country Link
JP (1) JPS59206873A (enrdf_load_stackoverflow)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61183803A (ja) * 1985-02-08 1986-08-16 株式会社小糸製作所 照明装置
JPS63180956U (enrdf_load_stackoverflow) * 1987-05-13 1988-11-22
JPH01110456U (enrdf_load_stackoverflow) * 1988-01-21 1989-07-26
JP2004006582A (ja) * 2002-04-12 2004-01-08 Shiro Sakai 発光装置
WO2004023568A1 (ja) * 2002-08-29 2004-03-18 Nitride Semiconductors Co.,Ltd. 複数の発光素子を有する発光装置
JP2008072141A (ja) * 2002-04-12 2008-03-27 Seoul Semiconductor Co Ltd 発光装置
JP2008211255A (ja) * 2002-04-12 2008-09-11 Seoul Semiconductor Co Ltd 発光装置

Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61183803A (ja) * 1985-02-08 1986-08-16 株式会社小糸製作所 照明装置
JPS63180956U (enrdf_load_stackoverflow) * 1987-05-13 1988-11-22
JPH01110456U (enrdf_load_stackoverflow) * 1988-01-21 1989-07-26
JP2009182357A (ja) * 2002-04-12 2009-08-13 Seoul Semiconductor Co Ltd 発光装置
JP2004006582A (ja) * 2002-04-12 2004-01-08 Shiro Sakai 発光装置
JP2009296012A (ja) * 2002-04-12 2009-12-17 Seoul Semiconductor Co Ltd 発光装置
JP2008072141A (ja) * 2002-04-12 2008-03-27 Seoul Semiconductor Co Ltd 発光装置
JP2009267423A (ja) * 2002-04-12 2009-11-12 Seoul Semiconductor Co Ltd 発光装置
JP2008211255A (ja) * 2002-04-12 2008-09-11 Seoul Semiconductor Co Ltd 発光装置
JP2009182355A (ja) * 2002-04-12 2009-08-13 Seoul Semiconductor Co Ltd 発光装置
JP2009182356A (ja) * 2002-04-12 2009-08-13 Seoul Semiconductor Co Ltd 発光装置
US7615793B2 (en) 2002-08-29 2009-11-10 Seoul Semiconductor Co., Ltd. AC driven light—emitting device
US7956367B2 (en) 2002-08-29 2011-06-07 Seoul Semiconductor Co., Ltd. Light-emitting device having light-emitting elements connected in series
US7417259B2 (en) 2002-08-29 2008-08-26 Seoul Semiconductor Co., Ltd. Light-emitting device having light-emitting elements
WO2004023568A1 (ja) * 2002-08-29 2004-03-18 Nitride Semiconductors Co.,Ltd. 複数の発光素子を有する発光装置
US7646031B2 (en) 2002-08-29 2010-01-12 Seoul Semiconductor Co., Ltd. Light emitting device having light emitting elements
US7667237B2 (en) 2002-08-29 2010-02-23 Seoul Semiconductor Co., Ltd. Light emitting device having light emitting elements
US7897982B2 (en) 2002-08-29 2011-03-01 Seoul Semiconductor Co., Ltd. Light emitting device having common N-electrode
US7569861B2 (en) 2002-08-29 2009-08-04 Seoul Semiconductor Co., Ltd. Light emitting device having light emitting elements
US8084774B2 (en) 2002-08-29 2011-12-27 Seoul Semiconductor Co., Ltd. Light emitting device having light emitting elements
US8097889B2 (en) 2002-08-29 2012-01-17 Seoul Semiconductor Co., Ltd. Light emitting device having light emitting elements with a shared electrode
US8129729B2 (en) 2002-08-29 2012-03-06 Seoul Semiconductor Co., Ltd. Light emitting device having light emitting elements and an air bridge line
US8680533B2 (en) 2002-08-29 2014-03-25 Seoul Semiconductor Co., Ltd. Light-emitting device having light-emitting elements with a shared electrode
US8735918B2 (en) 2002-08-29 2014-05-27 Seoul Semiconductor Co., Ltd. Light-emitting device having light-emitting elements with polygonal shape
US8735911B2 (en) 2002-08-29 2014-05-27 Seoul Semiconductor Co., Ltd. Light emitting device having shared electrodes
US9947717B2 (en) 2002-08-29 2018-04-17 Seoul Semiconductor Co., Ltd. Light-emitting device having light-emitting elements and electrode spaced apart from the light emitting element

Also Published As

Publication number Publication date
JPH0347560B2 (enrdf_load_stackoverflow) 1991-07-19

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