JPS59205740A - Method for protecting electronic device - Google Patents

Abstract

PURPOSE:To protect the internal circuits of the electronic device electrically by a method wherein a conductive self-adhesive thin film provided with ramifications adhering to terminals of the device at a delivery time and the trunk of thin film part is grounded is stripped off after an installation wiring and just before an operation test. CONSTITUTION:A well-known conductive self-adhesive tape 5 is provided with branches 5B ramified from a trunk part 5A with the intervals corresponding to those of external terminals 7 of an electronic device 6. These branches adhere to the terminals 7 on the side of the wiring within a board of the device 6 at a delivery time and the trunk part 5A is grounded 8. After completing an installation wiring and just before an operation test, the tape 5 is removed. In this constitution, even if a serge voltage caused by static electricity or induction is generated, it is removed through the cnductive tape and the minute internal circuit can be protected.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for protecting electronic equipment, and in particular, a method for protecting internal circuits of electronic equipment from damage caused by surge voltages caused by static electricity and induction during the period from shipping and transportation of electronic equipment to completion of installation. Regarding.

In recent years, with the development of integrated circuits such as ICs and LSIs, electronic devices have come to be frequently used for controlling plants and the like. This type of electronic equipment generally has a complex and precise circuit configuration, so once a failure occurs, it is difficult to find the failure location, and requires specialized knowledge and special instruments, and it takes a long time. It will take a while.

By the way, in electronic devices such as those mentioned above, if a surge voltage due to static electricity or induction is applied during the time between shipment from the factory, transportation to the designated installation location, and installation completion, the internal circuits of the ICs, LSIs, etc. will malfunction. . For example, in dry regions, the human body can become electrically charged to several thousand volts due to severe friction between the human body and clothing or rugs.

If wiring work is performed in such a charged state, high voltage will be applied from the tool to the electronic equipment through the terminal, damaging the IC.
This will cause internal damage to circuits such as L8I and L8I. Additionally, during construction, cables for welding equipment and other temporary power sources are installed in convenient locations independent of the installation of plant cables, which can create unexpected induced voltages in plant cables. be. When induced voltage occurs in this way, a high voltage is applied to the internal circuitry through the terminals of the electronics equipment, causing damage to it. Although the power is small, the IC
In the case of devices having minute conductor parts, such as LSIs, they may be destroyed by burning out or short-circuiting.

To prevent damage to the circuit due to high voltage as mentioned above,
Conventionally, Zener diodes 2a and 2b have been connected to the electronic circuit 1 as shown in FIG. 1(5).

Although a method of connecting the filter 3 as shown in FIG. 1(B) has been taken, there are problems such as an increase in the number of expensive parts and an increase in cost. Also, as shown in Fig. 2, a method of short-circuiting each external terminal 6 to which the internal wiring 9 is connected to the ground wire 8 using a copper wire 4, etc., to ground it, and then removing it immediately before power is applied to the electronics equipment is also considered.
However, in this case, it is not easy to remove the copper wires, and the amount of work required during installation increases significantly, which is not preferable.

The present invention has been made with the aim of improving the above-mentioned problems of the prior art.The present invention is made by forming a conductive adhesive thin film into branch-like branches to match the terminal arrangement of the device. Then, each branch of this adhesive thin film is glued to each terminal of the device at the time of shipment from the factory, each terminal is short-circuited and grounded through the main body of the adhesive thin film, and a power test is performed after wiring work is completed during installation. The present invention provides a method for protecting electronic equipment in which the adhesive thin film is peeled off and removed immediately beforehand.

The present invention will be explained below with reference to embodiments shown in the accompanying drawings.

FIG. 3 is an explanatory diagram of one embodiment of the method of the present invention;
The figure shows the development plane of the conductive adhesive thin film in FIG.

The conductive adhesive thin film 5 may be, for example, metal foil such as copper or aluminum, metal powder or carzene powder kneaded with plastic, or chemically synthesized l-. A known conductive adhesive tape formed by forming a special organic substance into a thin film, or a thin film prepared by kneading a conductive substance with an adhesive substance and applying the mixture to the thin film is used.

In the present invention, the conductive adhesive thin film 5 described above is branched from the main portion 5A in order to fit the spacing between the terminals 7, 7, etc. exposed to the outside of the electronics device 6. The branch portions 5B, 5B... are connected to each terminal 7, 7...K of the internal wiring of the electronics machine 36 when shipped from the factory.
Glue and ground by main part 5A 3i1111K
Keep it connected. In this way, the electronics device 6 is transported to the installation site, installed at the installation site, and after the installation and wiring work are completed, the adhesive thin film 5 that makes the conductivity M is removed immediately before conducting the energization test. For this removal, if the main part 5A is removed from the ground 8 side and pulled out, the adhesive thin film 5 including all the branch parts 5B, 5B, . . . can be easily removed.

Among them, branch portions 5B, 5 of the adhesive/thin film 5 having conductivity.
The tip shape of B... is designed to facilitate adhesion to the terminals 7, 7... and ensure adhesion, as shown in Fig. 5(A),
IB), (0) may be selected. Furthermore, it may be dangerous to apply electricity while the adhesive thin film 5 is adhered and the terminals 7, 7, etc. are short-circuited.

It is desirable to put a sign to that effect on the adhesive thin film 5 itself or on the equipment to which this thin film is attached, and in order not to forget to remove the adhesive thin film 5, the thin film 5 should be marked with red or other markings. It is also a good idea to post signs that are easy to follow.

As described above, according to the method of the present invention, each branch portion of a conductive adhesive thin film is adhered to the terminal of the electronic device and grounded through the main portion from the time the electronic device is shipped from the factory until the completion of installation. Therefore, even if a surge voltage occurs due to static air or induction, it is all removed through the adhesive thin film.Therefore, high voltage is not applied to circuits such as IO and LSI of electronic equipment, and these minute voltages are removed. circuits from static electricity and surge voltages. Furthermore, since the method of the present invention uses an adhesive thin film with electrical conductivity, it is possible to easily bond the terminal in a connected state even if the screw head of the terminal is immersed in the mold. , When removing the KVi, by simply removing the KVi ground side and pulling the main body, a series of core parts can be removed all at once, and the removal work is completely free from the hassles of conventional methods. It has a moderate effect.

[Brief explanation of the drawing]

Figures 1 and 2 are explanatory diagrams of conventional protection means, Figure 3 is an explanatory diagram showing an embodiment of the method of the present invention, and Figure 4 is the development of the adhesive thin film that improves conductivity in Figure 3. Floor plan, 5th
Figures (5) to (0) are plan views showing examples of the tip shape of the core portion of the thin film at the end 4121. - Core part, 6...electronics equipment.

Claims (1)

[Claims] A conductive adhesive thin film is formed into branch-like core portions to match the terminal arrangement of the device, and each core portion of this adhesive thin film is adhered to each terminal of the device at the time of shipment from the factory, and the connections between each terminal are A method for protecting electronic equipment, characterized by short-circuiting and grounding through the main body of an adhesive thin film, and peeling off and removing the adhesive thin film immediately before an energization test after completion of wiring work during installation.