JP2608650B2 - Printed wiring board for preventing electrostatic breakdown - Google Patents
Printed wiring board for preventing electrostatic breakdownInfo
- Publication number
- JP2608650B2 JP2608650B2 JP3220799A JP22079991A JP2608650B2 JP 2608650 B2 JP2608650 B2 JP 2608650B2 JP 3220799 A JP3220799 A JP 3220799A JP 22079991 A JP22079991 A JP 22079991A JP 2608650 B2 JP2608650 B2 JP 2608650B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- electrostatic breakdown
- preventing electrostatic
- hole conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
Description
【０００１】[0001]
【産業上の利用分野】本発明は、搭載された電子部品を
静電破壊から保護するための静電破壊防止用プリント配
線板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board for protecting a mounted electronic component from electrostatic breakdown.
【０００２】[0002]
【従来の技術】半導体集積回路（ＩＣ）は高速化や、低
消費電力化が進められており、静電気の放電による破壊
が起きやすい状況にある。この静電破壊に対抗するため
に、ＩＣ毎にバイパスコンデンサを設けたり、電子機器
を金属筐体で囲ったりすることが従来から行われてい
る。しかし、プリント配線板への電子部品実装時や、そ
の後の検査、修理時には金属筐体が取付けられておら
ず、また人体などからの静電気の放電が電子部品の端子
へ直接起きる場合には、バイパスコンデンサは役には立
たない。従って、このような作業時には、アースをとっ
た導電マットの上にプリント配線板を置き、作業者はア
ースバンドを手に巻いて作業をしなければならなかっ
た。2. Description of the Related Art As semiconductor integrated circuits (ICs) are being operated at higher speeds and with lower power consumption, they are in a state of being easily destroyed by electrostatic discharge. Conventionally, in order to combat this electrostatic breakdown, a bypass capacitor is provided for each IC or an electronic device is surrounded by a metal housing. However, when mounting the electronic components on the printed wiring board, or during subsequent inspection and repair, the metal housing is not attached, and if static discharge from the human body etc. occurs directly to the terminals of the electronic components, the bypass Capacitors are useless. Therefore, at the time of such a work, the printed wiring board has to be placed on a grounded conductive mat, and the worker has to work by winding the grounding band in his hand.
【０００３】[0003]
【発明が解決しようとする課題】ところが、電子機器の
製造工程ではこうした配慮がなされるのに対し、例えば
電子機器が市場へ出荷された後のメンテナンス時には、
前述の設備が準備できなかったりして、静電気対策が取
りにくかった。However, while such considerations are made in the manufacturing process of electronic equipment, for example, during maintenance after the electronic equipment is shipped to the market,
The above facilities could not be prepared, and it was difficult to take measures against static electricity.
【０００４】本発明は以上の問題点を解消するためにな
されたものであって、その目的は、電子部品の静電破壊
を容易かつ確実に防止できる静電破壊防止用プリント配
線板を提供することにある。The present invention has been made to solve the above problems, and an object of the present invention is to provide a printed wiring board for preventing electrostatic breakdown, which can easily and reliably prevent electrostatic breakdown of electronic components. It is in.
【０００５】[0005]
【課題を解決するための手段】上記目的を達成するため
に、本発明では電子部品が搭載されたプリント配線板の
前記電子部品を静電気による破壊から保護する静電破壊
防止用プリント配線板であって、前記プリント配線板の
対向する外周端面の少なくともいずれか一方又は角部近
傍の外周端面にスルーホール導体部を露出形成するとと
もに、同スルーホール導体部を前記プリント配線板の広
い面積を有する接地導体に接続した静電破壊防止用プリ
ント配線板をその要旨としている。According to the present invention, there is provided a printed wiring board for preventing electrostatic breakdown, which protects the electronic parts of the printed wiring board on which electronic parts are mounted from being damaged by static electricity. A through-hole conductor is exposed on at least one of the opposing outer peripheral end faces of the printed wiring board or the outer peripheral end face near the corner, and the through-hole conductor is grounded to have a large area of the printed wiring board. The gist is a printed wiring board for preventing electrostatic breakdown connected to a conductor.
【０００６】[0006]
【作用】プリント配線板の対向する外周端面の少なくと
もいずれか一方又は角部近傍の外周端面にはスルーホー
ル導体部が設けられ、この導体部は例えば内層に設けら
れた広い面積を有する接地導体又は表面上の広い面積を
有する接地導体に接続されているので、その分電気的容
量（静電容量）が増加している。そして、このスルーホ
ール導体部に例えば人が指を触れると、人がもつ静電気
はこのスルーホール導体部及び接地導体へと流れる。従
って、人の指と電子部品との間での放電が避けられる。
その結果、電子部品の静電破壊が防止される。A through-hole conductor is provided on at least one of the opposing outer peripheral end faces of the printed wiring board or on the outer peripheral end face near the corner, and this conductor is provided, for example, as a ground conductor having a large area provided in an inner layer. Since it is connected to the ground conductor having a large area on the surface, the electric capacitance (capacitance) is increased accordingly. Then, for example, when a person touches the through-hole conductor with a finger, static electricity of the person flows to the through-hole conductor and the ground conductor. Therefore, electric discharge between a human finger and the electronic component can be avoided.
As a result, electrostatic breakdown of the electronic component is prevented.
【０００７】[0007]
【実施例】以下に本発明を具体化した一実施例につい
て、図１及び図２に従って説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to FIGS.
【０００８】図１に示すように、プリント配線板１上に
は半導体集積回路の電子部品２が複数個搭載され（図１
ではそのうち１個のみを示す）、その外周端面の２個所
には側面スルーホール導体部３が一定の長さに露出形成
されている。図２に示すように、このプリント配線板１
は多層プリント配線板（図では６層）であり、内部には
電源層４、接地導体としての接地層５及び図示しない２
層の信号層が設けられている。As shown in FIG. 1, a plurality of electronic components 2 of a semiconductor integrated circuit are mounted on a printed wiring board 1 (FIG. 1).
Only one of them is shown), and side through-hole conductors 3 are formed to be exposed to a predetermined length at two locations on the outer peripheral end face. As shown in FIG.
Denotes a multilayer printed wiring board (six layers in the figure), in which a power supply layer 4, a ground layer 5 as a ground conductor, and a not-shown 2
A signal layer is provided.
【０００９】これら側面スルーホール導体部３は、プリ
ント配線板１の製造工程において例えばドリルで重なり
合う穴を順次あけることにより所定形状の切欠きを形成
した後、スルーホールメッキを施すことにより形成され
る。そして、この側面スルーホール導体部３は図２に示
すように、前記広い面積を有する接地層５に電気的に接
続され、静電容量が増加するようになっている。In the manufacturing process of the printed wiring board 1, these side-surface through-hole conductors 3 are formed by, for example, sequentially drilling overlapping holes with a drill to form notches of a predetermined shape, and then applying through-hole plating. . Then, as shown in FIG. 2, the side surface through-hole conductor 3 is electrically connected to the ground layer 5 having the large area, so that the capacitance is increased.
【００１０】次に、上記のように構成されたプリント配
線板１について作用及び効果を説明する。前述のよう
に、プリント配線板１の対向する外周端面のいずれか一
方である２個所には側面スルーホール導体部３が設けら
れ、この導体部３はプリント配線板１の内層に設けられ
た接地層５に接続されているので、静電容量が増加して
いる。そして、電子部品実装時やメンテナンス時にこの
プリント配線板１を持とうとする場合、前記導体部３を
指で持つ。このとき、指が導体部３に触れたことによ
り、人に帯電している静電気はこの導体部３から接地層
５へと流れる。Next, the operation and effects of the printed wiring board 1 configured as described above will be described. As described above, the side surface through-hole conductor portion 3 is provided at one of two opposing outer peripheral end surfaces of the printed wiring board 1, and the conductor portion 3 is provided on the inner layer of the printed wiring board 1. Since it is connected to the stratum 5, the capacitance has increased. Then, when the printed wiring board 1 is to be held at the time of mounting electronic components or at the time of maintenance, the conductor portion 3 is held by a finger. At this time, the static electricity charged to the person flows from the conductor 3 to the ground layer 5 due to the finger touching the conductor 3.
【００１１】従って、人の指が電子部品２に近づくこと
によって指と電子部品２との間で発生する放電が避けら
れる。このように、静電破壊防止手段がプリント配線板
１自体に設けられているので、側面スルーホール導体部
３を持って操作すればよく、プリント配線板１の電子部
品実装時やメンテナンス時において電子部品２の静電破
壊が容易かつ確実に防止される。Therefore, a discharge generated between the finger and the electronic component 2 when a human finger approaches the electronic component 2 can be avoided. As described above, since the means for preventing electrostatic breakdown is provided on the printed wiring board 1 itself, it is sufficient to operate the printed wiring board 1 by holding the side-surface through-hole conductor portion 3. The electrostatic breakdown of the component 2 is easily and reliably prevented.
【００１２】しかも、従来のように導電マットやアース
バンドを準備する必要がないので、操作が容易となる。
仮に導電マットを配置してアースバンドを忘れても電子
部品２の静電破壊が確実に防止される。Moreover, since there is no need to prepare a conductive mat or an earth band as in the prior art, the operation becomes easy.
Even if the conductive mat is disposed and the ground band is forgotten, the electrostatic breakdown of the electronic component 2 is reliably prevented.
【００１３】本発明は上記実施例に限定されるものでは
なく、発明の趣旨を逸脱しない範囲で例えば以下のよう
に構成してもよい。 （１）プリント配線基板は、広い面積を有するシールド
層を接地層５として内部に有する３層以上の多層プリン
ト配線板、あるいは広い面積を有する接地層５を有する
両面プリント配線板で、これら接地層５に前記側面スル
ーホール導体部３を接続してもよい。 （２）前記側面スルーホール導体部３は対向する外周端
面に一対設けることにより、又はプリント配線板１の角
部近傍の外周端面に設けることにより、指でプリント配
線板１を把持しやすいので、より確実に静電破壊を防止
できる。この側面スルーホール導体部３は１個所又は３
個所以上に設けてもよく、またその長さを長くしたり、
短くしたりしてもよい。 （３）前記側面スルーホール導体部３はプリント配線板
１の外周端面に設けられているので、プリント配線板１
をケースに収納したとき、この導体部３をケースに対し
て容易に接続できる。従って、側面スルーホール導体部
３の接地が容易となる。The present invention is not limited to the above embodiment, but may be configured as follows, for example, without departing from the spirit of the invention. (1) The printed wiring board is a multilayer printed wiring board having three or more layers having a shield layer having a large area as a ground layer 5 therein, or a double-sided printed wiring board having a ground layer 5 having a large area. 5 may be connected to the side-surface through-hole conductor 3. (2) The printed wiring board 1 can be easily gripped with a finger by providing a pair of the side-surface through-hole conductors 3 on the opposed outer circumferential end face or by providing it on the outer circumferential end face near the corner of the printed wiring board 1. Electrostatic breakdown can be more reliably prevented. This side through-hole conductor portion 3 is provided at one place or 3
May be provided in more than one place, or to increase its length,
It may be shortened. (3) Since the side surface through-hole conductor portion 3 is provided on the outer peripheral end surface of the printed wiring board 1, the printed wiring board 1
Can be easily connected to the case when is accommodated in the case. Therefore, the grounding of the side surface through-hole conductor portion 3 becomes easy.
【００１４】[0014]
【発明の効果】本発明によれば、プリント配線板上の電
子部品の静電破壊を容易にしかも確実に防止できるとい
う優れた効果を奏する。According to the present invention, there is an excellent effect that electrostatic breakdown of an electronic component on a printed wiring board can be easily and reliably prevented.
【図１】本発明の実施例を示すプリント配線板の平面図
である。FIG. 1 is a plan view of a printed wiring board showing an embodiment of the present invention.
【図２】図１のＡ−Ａ線断面図である。FIG. 2 is a sectional view taken along line AA of FIG.
１…プリント配線板、２…電子部品、３…側面スルーホ
ール導体部、５…接地導体としての接地層。DESCRIPTION OF SYMBOLS 1 ... Printed wiring board, 2 ... Electronic component, 3 ... Side through-hole conductor part, 5 ... Ground layer as a ground conductor.
Claims (1)
線板（１）の前記電子部品（２）を静電気による破壊か
ら保護する静電破壊防止用プリント配線板であって、 前記プリント配線板（１）の対向する外周端面の少なく
ともいずれか一方又は角部近傍の外周端面にスルーホー
ル導体部（３）を露出形成するとともに、同スルーホー
ル導体部（３）を前記プリント配線板（１）の広い面積
を有する接地導体（５）に接続したことを特徴とする静
電破壊防止用プリント配線板。1. A printed wiring board for preventing electrostatic breakdown, which protects the electronic component (2) of the printed wiring board (1) on which the electronic component (2) is mounted from being destroyed by static electricity, wherein the printed wiring board is A through-hole conductor portion (3) is formed by exposing at least one of the opposing outer peripheral end surfaces of (1) or the outer peripheral end surface near the corner, and the through-hole conductor portion (3) is connected to the printed wiring board (1). A printed wiring board for preventing electrostatic breakdown, which is connected to a ground conductor (5) having a large area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3220799A JP2608650B2 (en) | 1991-08-31 | 1991-08-31 | Printed wiring board for preventing electrostatic breakdown |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3220799A JP2608650B2 (en) | 1991-08-31 | 1991-08-31 | Printed wiring board for preventing electrostatic breakdown |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0563388A JPH0563388A (en) | 1993-03-12 |
| JP2608650B2 true JP2608650B2 (en) | 1997-05-07 |
Family
ID=16756750
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3220799A Expired - Lifetime JP2608650B2 (en) | 1991-08-31 | 1991-08-31 | Printed wiring board for preventing electrostatic breakdown |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2608650B2 (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2614180B2 (en) * | 1993-06-28 | 1997-05-28 | ニッカ電測株式会社 | Metal detector |
| US5701301A (en) * | 1993-06-28 | 1997-12-23 | Bellsouth Corporation | Mediation of open advanced intelligent network in SS7 protocol open access environment |
| WO2004080136A1 (en) * | 2003-03-06 | 2004-09-16 | Fujitsu Limited | Connection structure of printed wiring board |
| TWI365525B (en) * | 2007-12-24 | 2012-06-01 | Ind Tech Res Inst | An ultra thin package for a sensor chip of a micro electro mechanical system |
| JP5132522B2 (en) * | 2008-10-31 | 2013-01-30 | 三菱電機株式会社 | Electronics |
| JP2013162083A (en) * | 2012-02-08 | 2013-08-19 | Aisin Aw Co Ltd | Circuit board and circuit device |
| CN106793451A (en) * | 2016-11-15 | 2017-05-31 | 智恩电子(大亚湾)有限公司 | A kind of active anti-breakdown circuit board |
| WO2018221273A1 (en) * | 2017-06-02 | 2018-12-06 | 株式会社村田製作所 | High frequency module and communication device |
-
1991
- 1991-08-31 JP JP3220799A patent/JP2608650B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0563388A (en) | 1993-03-12 |
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