JPS5919093A - Laser machining device - Google Patents

Laser machining device

Info

Publication number
JPS5919093A
JPS5919093A JP57128911A JP12891182A JPS5919093A JP S5919093 A JPS5919093 A JP S5919093A JP 57128911 A JP57128911 A JP 57128911A JP 12891182 A JP12891182 A JP 12891182A JP S5919093 A JPS5919093 A JP S5919093A
Authority
JP
Japan
Prior art keywords
light
shielding
pieces
light shielding
shielding piece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57128911A
Other languages
Japanese (ja)
Inventor
Takeoki Miyauchi
宮内 建興
Hiroshi Yamaguchi
博司 山口
Mikio Hongo
幹雄 本郷
Katsuro Mizukoshi
克郎 水越
Akira Shimase
嶋瀬 明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP57128911A priority Critical patent/JPS5919093A/en
Publication of JPS5919093A publication Critical patent/JPS5919093A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462Nozzles; Features related to nozzles
    • B23K26/1464Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
    • B23K26/1476Features inside the nozzle for feeding the fluid stream through the nozzle
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor

Abstract

PURPOSE:To eliminate the need for a light shielding cover for enclosing the entire part of a device and to provide a reduction in cost and an improvement in productivity by providing specifically a shielding plate for laser light on the outside circumferential side of a laser lens holder through which an assist gas is passed. CONSTITUTION:Many groove parts 14 are provided in the axial direction on the inside circumference on the bottom end side of a lens holder 13, and a lens 7 is inserted and held therein. A pressurized assist gas passes through the parts 14 and is fed to a work piece 9 side. Laser light 2 passes the lens 7, and spreads in four ways after irradiating the work piece 9. The 1st light shielding pieces 15a of a rectangular strip shape are juxtaposed at specified intervals along the axial line on the outside circumferential side of the holder 13, and the 2nd light shielding pieces 15b of a rectangular strip shape are similarly provided on the outside circumference of the pieces 15a so as to enclose said pieces. Clearance 17 is formed in the spacings between the pieces 15a, and the light shielding plate 15 consists of the group of the pieces 15a, 15b. The retainers 16 for the plates 15 enclosing the outside of the pieces 15b support freely slidably the pieces 15a, 15b of which the bottom ends contact with the work piece 9. Then the gaps between the holder 13 and the work piece 9 are hermetically closed by the plate 15, and the reflected light of the light 2 reflects repeatedly on the plate 15 without leaking to the outside. Gas vents are provided to the pieces 15b.

Description

【発明の詳細な説明】 本発明はレーザ加工装置に係り、特に、レーザ加工装置
全体ta包するレーザ光の漏洩防止用の遮光カバを不要
とし、レーザヘッドのレンズホルダまわりに遮光板を設
けてレーザ光の漏洩を防止するように構成されたレーザ
加工装置に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a laser processing device, and in particular, it eliminates the need for a light-shielding cover for preventing leakage of laser light that covers the entire laser processing device, and provides a light-shielding plate around the lens holder of the laser head. The present invention relates to a laser processing device configured to prevent leakage of laser light.

レーザ)”0によって加工物を切断するレーザ加工装置
は従来より広く使用されているが、作業者等の安全を守
るには、レーザ光の漏洩を防止しする遮光板が必要とさ
れる。従来、一般に採用されている遮光手段は、レーザ
加工装置全体を被包する遮光カバを用いたものが殆んで
あり作業者は直接加工9物を目視出来ず、遠隔操作によ
ってレーザ加工を実施し、加工後これを搬出することが
行われていた。従って、作業効率の面で欠点を有するの
みならず、装置が高価となる欠点を有していた。
Laser processing equipment that cuts workpieces with a laser beam has been widely used, but to protect the safety of workers, a light shielding plate is required to prevent laser light from leaking. Most commonly used light-shielding means use a light-shielding cover that encloses the entire laser processing equipment, and the worker cannot directly see the workpiece.The laser processing is performed by remote control, and the processing is carried out by remote control. This was then carried out.Therefore, not only was there a drawback in terms of work efficiency, but the equipment was also expensive.

すなわち、第1図に示す如く、CCJ2レーザ発振器1
から出たレーザ光2は遮光カバろで被包された装置内部
に導かれ、XY可動台4内に設けられたペンデングミラ
5,6を経て、加工用対物レーザレンズ7に入り、集光
されて基台8に載置された加工物9上に照射され、切断
作業が行なわれる。作業者10は遮光カバろの外側に設
けられた制御盤11により、レーザ加工作業の遠隔制御
を行う。以上の構成により、レーザ光2の漏洩は防止さ
れるが、上記の如く、遮光カバ3は装置全体を被包する
ため極めて高価のものとなる。又、レーザ加工は目視で
きない遠隔作業となり、作業性の面でも問題が生ずる。
That is, as shown in FIG. 1, the CCJ2 laser oscillator 1
The laser beam 2 emitted from the is guided into the inside of the device covered by a light-shielding cover, passes through pendent mirrors 5 and 6 provided in the XY movable table 4, enters the processing objective laser lens 7, and is condensed. A workpiece 9 placed on a base 8 is irradiated with the light, and a cutting operation is performed. An operator 10 remotely controls the laser processing operation using a control panel 11 provided outside the light-shielding cover. The above configuration prevents the laser beam 2 from leaking, but as described above, the light shielding cover 3 covers the entire device and is therefore extremely expensive. Furthermore, laser processing is a remote operation that cannot be visually observed, which also poses problems in terms of workability.

第2図はYAGレーザ加工装置で、装置の加工物まわり
は遮光カバ3aで被包されている。
FIG. 2 shows a YAG laser processing device, in which the workpiece of the device is covered with a light-shielding cover 3a.

YAGレーザ発振器1aから出たレーザ光は、遮光カバ
3aで穆われだ加工部に導かれ、レーザ加工が行われる
6、作業者10はモニタテレビ11で加工状況を確認し
、加工終了後、蓋12をあけて加工物を取出し交換する
。この装置でも上記のものと同様に遮光カバ3aが高価
とAるのみならず加工物の交換作業がやり難く、生産性
を向上し得ない欠点を有しでいた。
The laser beam emitted from the YAG laser oscillator 1a is guided to the grain processing section by a light-shielding cover 3a, and laser processing is performed. 12, take out the workpiece and replace it. Similar to the above-mentioned device, this device also has the disadvantage that not only is the light-shielding cover 3a expensive, but it is also difficult to replace workpieces, making it impossible to improve productivity.

本発明は以上の欠点を解決すべく創案されたものであり
、その目的は装置コストを低下させかつ、生産性を向上
し得るレーザ加工装置を提供することにある。
The present invention was devised to solve the above-mentioned drawbacks, and its purpose is to provide a laser processing device that can reduce device costs and improve productivity.

本発明は上記の目的を達成するために、レーザレンズを
榎うレンズホルダの外周側に沿い、これを囲続して遮光
片を設け、隣接する遮光片間から17−ザ光が漏洩しな
いように遮光片を係合せ1〜め、該遮光片を遮光板抑え
によって摺動自在に保持すると共に、該遮光板にガス抜
き部を係合せしめ、アシストガスを外部に引抜くように
し、かつ、上記遮光片の自重を軽くする圧力制御部を係
合せしめて遮光片が加工物に円滑に追従すべくしたレー
ザ加工装置を特徴としたものである。
In order to achieve the above object, the present invention provides a light shielding piece along and surrounding the outer periphery of a lens holder that encloses a laser lens, and prevents light from leaking between adjacent light shielding pieces. engaging a light-shielding piece with the light-shielding plate 1~, slidably holding the light-shielding piece by a light-shielding plate retainer, and engaging a gas venting part with the light-shielding plate so as to draw out the assist gas to the outside; The present invention is characterized by a laser processing device in which a pressure control unit that reduces the weight of the light shielding piece is engaged so that the light shielding piece smoothly follows the workpiece.

以下、本発明の実施例を図に基づき説明する。Embodiments of the present invention will be described below with reference to the drawings.

寸ず実施例の概要を説明する。The outline of the embodiment will be briefly explained.

第6図および第4図に示す如く、加工物9に近接する上
方側にはレーザ光2を集光して照射するレーザレンズ7
が設けられ、レーザレンズ7は中空円筒状のレンズホル
ダ1ろの下端側に保持されている。レンズホルダ13内
にはレーザ加工によって生じた溶融金属がレーザレンズ
7に有情するのを予防するためのアシストガスが導入さ
れている。このレンズホルダ15の外周にはその軸方向
に沿って多数個の遮光片15a、15bがこれを囲続し
て設けられ、遮光板15を形成している。本実施例では
後に詳しく説明するが、遮光板15は2重構造となり、
第1の遮光片15aの隣接間の間隙は第2の遮光片15
bによって閉止されている。その閉止されだυIJ隙部
17は上記アシストガスを外部側に排出するガス抜き部
を形成する。第1および第2の遮光片15a、15bは
共にこの外方側に設けられた遮光板抑え16に摺動自在
に保持されている。又、第16図に示す如く、遮光板抑
え16には圧力制御部22の真空装置19が接続し7、
遮光片15a、15bを上方側に吸引し、自重を軽くし
て第1および第2の遮光片15a、15bが加工物9の
表面にスムースに追従しうるようにしている。
As shown in FIGS. 6 and 4, a laser lens 7 that focuses and irradiates the laser beam 2 is provided on the upper side close to the workpiece 9.
A laser lens 7 is held at the lower end of a hollow cylindrical lens holder 1. Assist gas is introduced into the lens holder 13 to prevent molten metal generated by laser processing from entering the laser lens 7. A large number of light shielding pieces 15a and 15b are provided around the outer periphery of the lens holder 15 along its axial direction so as to surround the lens holder 15, thereby forming a light shielding plate 15. In this embodiment, as will be described in detail later, the light shielding plate 15 has a double structure,
The gap between the adjacent first light shielding pieces 15a is the same as that of the second light shielding piece 15.
It is closed by b. The closed υIJ gap 17 forms a gas venting portion for discharging the assist gas to the outside. Both the first and second light-shielding pieces 15a, 15b are slidably held by a light-shielding plate retainer 16 provided on the outer side. Further, as shown in FIG. 16, a vacuum device 19 of a pressure control section 22 is connected to the light shielding plate holder 16 7,
The light shielding pieces 15a, 15b are sucked upward to reduce their own weight so that the first and second light shielding pieces 15a, 15b can smoothly follow the surface of the workpiece 9.

以上の構成により、レーザ光2は外部に漏洩することな
く、従って、装置全体を被包する遮元カバ6等は必要と
されない1、又、作集者1oも遠隔操作する必要lく、
作業効率を向上することができる。
With the above configuration, the laser beam 2 does not leak to the outside, so there is no need for a shielding cover 6, etc. that covers the entire device, and the collector 1o also does not need to operate remotely.
Work efficiency can be improved.

次に、更に肛し〈実施例(f−説明する。Next, we will further explain the embodiment.

第3図および第4図に示す如く、レンズホルダ13の下
端側内周には、その軸線方向に多数の竹部14が形成さ
れると共に、レーザし/ンズ7が挿入保持されている。
As shown in FIGS. 3 and 4, a large number of bamboo parts 14 are formed in the axial direction on the inner periphery of the lower end of the lens holder 13, and a laser lens 7 is inserted and held therein.

又、レンズホルダ13内には、図示しない手段によりア
シストガスが供給され、アシストガスは溝部14を通過
して下方の加工物9側に送られる。アシストガスは空気
、窒素ガス等からなり、レーザ加工によって金属蒸気と
なった溶融金槙がレーザレンズ7に付着するのを防止す
るもので、普通一定圧カ以上に加圧されている。レーザ
光2はレーザレンズ7を通り加工物9に照射したのち、
四方に拡散する。レンズホルダ13の外周側には、その
軸線方向に沿って、短冊状の第1の遮光片15aが一定
間隔□を距てて並設され、これを囲続している。
Further, assist gas is supplied into the lens holder 13 by means not shown, and the assist gas passes through the groove 14 and is sent downward to the workpiece 9 side. The assist gas is made of air, nitrogen gas, etc., and is used to prevent molten metal vapor turned into metal vapor by laser processing from adhering to the laser lens 7, and is normally pressurized to a certain pressure or higher. After the laser beam 2 passes through the laser lens 7 and irradiates the workpiece 9,
Spread in all directions. On the outer circumferential side of the lens holder 13, strip-shaped first light-shielding pieces 15a are arranged in parallel along the axial direction at a constant distance □, and surround the first light-shielding pieces 15a.

又、第1の遮光片15aの外周には同じく短冊状の第2
の遮光片15bが一定間隔を距でて並設され、第1の遮
光片15aを囲続している。そして第2の遮光片15b
は隣接する第1の遮光片15a間に跨設され、第1の遮
光片15aの上記間隔部に間隙部17を形成する。遮光
板15は第1の遮光片iSa群と第2の遮光片15b群
からなる2重の円筒状体から形成される。なお、第1の
遮光片15aおよび第2の遮光片15bは共にその全体
を艶消し処理した黒色コートで被包きれている。
Also, on the outer periphery of the first light shielding piece 15a, a second strip-like piece is provided.
The light shielding pieces 15b are arranged in parallel at regular intervals and surround the first light shielding piece 15a. And second light shielding piece 15b
is disposed astride between adjacent first light shielding pieces 15a, and forms a gap 17 at the above-mentioned interval between the first light shielding pieces 15a. The light shielding plate 15 is formed from a double cylindrical body consisting of a first light shielding piece iSa group and a second light shielding piece 15b group. Note that both the first light-shielding piece 15a and the second light-shielding piece 15b are completely covered with a black coat treated with a matte finish.

第2の遮光片15bの外側には、これを囲んで遮光板抑
え16が設けられている。遮光板抑え16はその円周に
沿って凹凸部が形成され、この凹凸部により第1および
第2の遮光片15a、15bを摺動自在に支持する。そ
して、゛第1および第2の遮光片15a、15bの下端
部は加工物9に当接する。
A light shielding plate retainer 16 is provided on the outside of the second light shielding piece 15b to surround it. The light-shielding plate retainer 16 has an uneven portion formed along its circumference, and the uneven portion supports the first and second light-shielding pieces 15a and 15b in a slidable manner. Then, the lower ends of the first and second light shielding pieces 15a and 15b abut against the workpiece 9.

以上の構成により、レンズボルダ13と加工物9間の空
隙は第1および第2の遮光片15a、 15bにより密
閉され、レーザ光2の反射光は、遮光板15に繰返し反
射し、外部側には漏洩しない。
With the above configuration, the gap between the lens boulder 13 and the workpiece 9 is sealed by the first and second light-shielding pieces 15a, 15b, and the reflected light of the laser beam 2 is repeatedly reflected on the light-shielding plate 15, and no light is transmitted to the outside. No leakage.

なお、アシストガスは間隙部17がら排出される。Note that the assist gas is discharged through the gap 17.

第5図は上記遮光板15を円筒形状の加工物9aのレー
ザ加工に用いたものである。第1の遮光片15aおよび
第2の遮光片15bとも上記の如く短冊状に形成され、
がっ、遮光板抑え16に摺動自在に保持されているため
、これ等は加工物9aの表面形状に沿って係合する。従
ってレーザ光2は外部に漏洩しない。
FIG. 5 shows the light shielding plate 15 used for laser processing of a cylindrical workpiece 9a. Both the first light shielding piece 15a and the second light shielding piece 15b are formed in the shape of a strip as described above,
Since they are slidably held by the light-shielding plate retainer 16, they engage along the surface shape of the workpiece 9a. Therefore, the laser beam 2 does not leak to the outside.

第6図は別の実施例を示す。FIG. 6 shows another embodiment.

本実施例では、遮光板15の形状が前記のものと異る。In this embodiment, the shape of the light shielding plate 15 is different from that described above.

すなわち、第7図にも示す如く、遮光片15cは、その
先端側に先細りの2段の段付テーパ部15c’、 15
c″を形成する先端側円錐体状の中空円筒を分割切断し
たものを隣接間に間隔を距でないで並設したものから形
成される。
That is, as shown in FIG. 7, the light-shielding piece 15c has two stepped tapered portions 15c', 15 tapering on the tip side thereof.
It is formed by dividing and cutting a hollow cylinder in the shape of a cone on the distal end side and arranging adjacent cylinders side by side with no distance between them.

第6図では、上記の如くして形成した遮光片15cを直
接遮光板抑え16aにより摺動自在に保持しているが、
前記の実施例と同様にこの遮光片15cの外周にこれを
囲続し、隣接する遮光片15c間の間隔を榎う遮光片を
2重に設けるようにしてもよい。
In FIG. 6, the light-shielding piece 15c formed as described above is directly held slidably by the light-shielding plate holder 16a.
As in the embodiment described above, the light shielding pieces 15c may be surrounded by the outer periphery of the light shielding pieces 15c, and two light shielding pieces may be provided to extend the distance between adjacent light shielding pieces 15c.

本実施例の遮光板15は加工物9bの形状が平坦のもの
でなく、不規則又は形状変化の激しいものに対して有効
のものである。すなわち、この遮光板15は、加工物9
bに当接する面積が狭いため、加工物9bの変化に追従
して遮光板15が動きレーザ光の漏洩を防止し得るから
である0第8図にさらに別の実施例を示す0 本実施例は遮光板15の形状を変えたものである。すな
わち、短冊状の遮光片15dの断面形状を係合凸部26
と係合凹部24を両端側に形成するものとし、隣接する
遮光片15d 、 15dの係合凸部23と係合凹部2
4とを係合せしめ、遮光片15dを単円筒体に連結した
ものから形成されている。
The light shielding plate 15 of this embodiment is effective when the shape of the workpiece 9b is not flat, but irregular or whose shape changes drastically. That is, this light shielding plate 15 is
This is because the area in contact with the workpiece 9b is small, so the light shielding plate 15 moves in accordance with changes in the workpiece 9b and can prevent leakage of laser light.Another embodiment is shown in FIG. 8.This embodiment The shape of the light shielding plate 15 is changed. That is, the cross-sectional shape of the strip-shaped light-shielding piece 15d is set to the engaging convex portion 26.
and engagement recesses 24 are formed on both end sides, and the engagement protrusions 23 and engagement recesses 2 of the adjacent light shielding pieces 15d, 15d.
4 are engaged with each other, and the light shielding piece 15d is connected to a single cylindrical body.

係合凸部23と係合凹部24とが係合するため、隣接す
る遮光片15d間には1愉間が生じない。従って、レー
ザ光の漏洩の恐れがなく前記実施例の如く2重の遮光板
15を設ける必要がない。
Since the engagement protrusion 23 and the engagement recess 24 engage with each other, there is no space between adjacent light shielding pieces 15d. Therefore, there is no fear of leakage of laser light, and there is no need to provide double light shielding plates 15 as in the previous embodiment.

第9図は別の実施例を示す。FIG. 9 shows another embodiment.

本実施例も遮光板15の形状を変えたものである。In this embodiment, the shape of the light shielding plate 15 is also changed.

すなわち、短冊状の遮光片15eの断面形状を両端側に
折曲係止部25を形成する。コ字状形のものとし、隣接
する遮光片15eを相対向せしめて折曲係止部25を相
互に係止させ、遮光片15eを単円筒体に連結したもの
から形成せしめている。この場合も、隣接間に間隙が生
じないので遮光板15を2重にする必要がない0 第10図および第11図は遮光板にガス抜き部を設けた
実施例を示す。
That is, the cross-sectional shape of the rectangular light-shielding piece 15e is bent to form locking portions 25 at both ends. The light shielding piece 15e is formed into a U-shape, with adjacent light shielding pieces 15e facing each other so that the bent locking portions 25 are engaged with each other, and the light shielding piece 15e is connected to a single cylindrical body. In this case as well, there is no gap between the adjacent light shielding plates, so there is no need to double the light shielding plates 15. FIGS. 10 and 11 show an embodiment in which the light shielding plates are provided with a gas vent.

第6図および第4図にて説明した第2の遮光片15bに
は曲線状に曲げられた中空部材26が取付けられ、ガス
抜き部27を形成している。中空部材26は第2の遮光
片15bを貫通すると共に、第4図にも示す間隙部17
と連通している。従って、アシストガスは間隙部17を
通って排出されると共に、中空部材26から排出される
。上記の如くアシストガスは加圧されており、かつ、そ
の流量が多い場合には遮光板15をかなり加圧する。こ
のため遮光板15の摺動が円滑に行わなくなる。従って
中空部材26からアシストガスを排出することにより遮
光板15に加わる圧力を減少することができる2、一方
、中空部材26の内面には艶消しの黒色コート処理がさ
れ、かつ、中空部材26は上記の如く曲線状に曲げられ
ているため、レーザ光は中空部材26の内面で繰返し反
射され、外部には漏洩しない。なお、中空部材26は、
遮光片15bの全部又は一部に適宜取付けてアシストガ
スの円滑の排出をはかることができる。
A curved hollow member 26 is attached to the second light shielding piece 15b described in FIGS. 6 and 4, and forms a gas venting portion 27. The hollow member 26 penetrates the second light shielding piece 15b and also forms a gap 17 shown in FIG.
It communicates with Therefore, the assist gas is discharged through the gap 17 and is also discharged from the hollow member 26. As described above, the assist gas is pressurized, and when its flow rate is large, the light shielding plate 15 is considerably pressurized. As a result, the light shielding plate 15 does not slide smoothly. Therefore, by discharging the assist gas from the hollow member 26, the pressure applied to the light shielding plate 15 can be reduced2.On the other hand, the inner surface of the hollow member 26 is coated with a matte black coating, and Since the hollow member 26 is curved as described above, the laser light is repeatedly reflected on the inner surface of the hollow member 26 and does not leak to the outside. Note that the hollow member 26 is
The assist gas can be smoothly discharged by attaching it to all or part of the light shielding piece 15b as appropriate.

第12図は第8図の遮光片15dに中空部材26を設け
た実施例を示し、第16図は第9図の遮光片15eに中
空部月26を設けた実施例を示す。その作用は上記第1
0図および第11図に示すものと同様である。
FIG. 12 shows an embodiment in which a hollow member 26 is provided in the light shielding piece 15d of FIG. 8, and FIG. 16 shows an embodiment in which a hollow member 26 is provided in the light shielding piece 15e in FIG. Its effect is the first one above.
This is similar to that shown in FIGS. 0 and 11.

第14図はガス抜き部27の他の実施例を示す。FIG. 14 shows another embodiment of the gas venting part 27.

第6図に示す遮光片15Cの先端側の円錐体状部には、
これを被包して密閉空間61を形成する外枠部材30が
設けられ、ガス抜き部27を形成している。遮光片15
cの先端側の円錐体状部には密閉空間31に連通ずる入
口部28が形成され、外枠部材30には、外部と密閉空
間ろ1とを連通せしめる出口部29が形成されている。
The conical part on the tip side of the light shielding piece 15C shown in FIG.
An outer frame member 30 is provided that encloses this to form a sealed space 61, thereby forming a gas venting portion 27. Light shielding piece 15
An inlet portion 28 communicating with the closed space 31 is formed in the conical portion on the tip side of c, and an outlet portion 29 is formed in the outer frame member 30 to communicate the closed space filter 1 with the outside.

以上の構成によりアシストガスは入口部28を経て出口
部29から外部へ排出される1、又、ガス抜き部27の
密閉空間31に而する内面には艶消しの黒色コート処理
がされており、かつ、このガス抜き部27の形状はテー
パ状に折り曲っているためレーザ光は繰返し反射して外
部には漏洩しない。
With the above configuration, the assist gas is discharged to the outside from the inlet part 28 and the outlet part 29 1, and the inner surface of the sealed space 31 of the gas vent part 27 is coated with a matte black coating. In addition, since the gas venting portion 27 is bent in a tapered shape, the laser beam is repeatedly reflected and does not leak to the outside.

第16図は圧力制御部22を示す実施例である。FIG. 16 shows an embodiment of the pressure control section 22. As shown in FIG.

遮光板15を摺動自在に保持する遮光板抑え16はその
上端側を閉止されて形成され、その上端側内部には圧力
調節手段である減圧室18が形成されている。この減圧
室18は小孔20を介して遮光板15が保持されている
部分と連通している。
A light-shielding plate holder 16 that slidably holds the light-shielding plate 15 is formed with its upper end closed, and a decompression chamber 18 serving as pressure adjustment means is formed inside the upper end. This decompression chamber 18 communicates with a portion where the light shielding plate 15 is held via a small hole 20.

又、減圧室18には、配管21を介し真空装置19が接
続している。以上の構成で、真空装置19からの真空は
、減圧室18にて調節された後、小孔204を介し遮光
板15の背後に作用する。これにより遮光板15は自重
が軽くなるような作用を受ける。
Further, a vacuum device 19 is connected to the decompression chamber 18 via a pipe 21. With the above configuration, the vacuum from the vacuum device 19 is regulated in the decompression chamber 18 and then acts behind the light shielding plate 15 through the small hole 204. As a result, the light shielding plate 15 receives an effect of reducing its own weight.

従って、加工物9と遮光板15との接触圧は極めて小さ
いものとなり、遮光板15は加工物9の表面に沿って円
滑に移動することになる。なお、前記の実施例において
も同様であるが、遮光板15の加工物9との当接部、6
2は円孤状に形成され遮光板15が加工物9に密接し得
るようにされている。
Therefore, the contact pressure between the workpiece 9 and the light shielding plate 15 becomes extremely small, and the light shielding plate 15 moves smoothly along the surface of the workpiece 9. Note that, although the same applies to the above embodiments, the contact portion of the light shielding plate 15 with the workpiece 9, 6
2 is formed into a circular arc shape so that the light shielding plate 15 can come into close contact with the workpiece 9.

以上の如く、遮光板15をレーザ加工装置のレンズホル
ダ1ろまわりにのみ設けることによりレーザ光の漏洩が
防止できるので、加工装置全体を被包する如き遮光カバ
3は不要となり、かつ作業者も間接的作業を行う必要が
なく、加工物9を目視して作業ができ、作業終了後、直
接加工物を取出しできる。
As described above, by providing the light-shielding plate 15 only around the lens holder 1 of the laser processing device, leakage of laser light can be prevented, so the light-shielding cover 3 that covers the entire processing device is not required, and the operator can also There is no need to perform indirect work, the work can be done while visually observing the workpiece 9, and the workpiece can be taken out directly after the work is completed.

以上の説、明によって明らかの如く、本発明によれば、
装置コストを大幅に低下せしめると共に、生産性を向上
し得る効果が上げられる。
As is clear from the above explanation and description, according to the present invention,
This has the effect of significantly reducing equipment costs and improving productivity.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図および第2図は従来のレーザ加工装置の概要を示
す斜視図、第6図は本発明一実施例の断面図、第4図は
そのIV−TV線矢視の断面図、第5図は第5図の実施
例の使用状態の一例を示す断面図、第6図は他の実施例
を示す断面図、第7図はその遮光片の形状を示す説明図
、第8図は別の実施例の軸直角方向の断面図、第9図は
さらに別の実施例の軸直角方向の断面図、第10図はガ
ス抜き部の実施例を示す断面図、第11図は第10図の
M−XI線矢視の断面図、第12図および第16図はカ
ス抜き部の他の実施例を示す部分断面図、第14図は更
に別のガス抜き部の実施例を示す断面図、第15図はそ
のガス抜き部のみを示した斜視図、第16図は圧力制御
部を示す断面図である。 2・・レーザ光    6,3a・・・遮光カバ7・・
・レーザレンズ  9 、9a、 9b・・・加工物1
0・・・作業者     16・・・レンズホルダ14
・・・溝部      15・・・遮光板15a・・第
1の遮光片 15b・・・第2の遮光片15c 、 1
5d 、  15e ・・・遮光片16.16a・・・
遮光板抑え 17・・・間隙部18・・・減圧室   
  19・・・真空装置20・・・小孔      2
1・・・配管22・・・圧力制御部   23・・・係
合凸部24・・・係合凹部    25・・・折曲係止
部26・・中空部材    27・・・ガス抜き部28
・・・入口部     29・・・出口部30・・・外
枠部−材    61・・・密閉空間=523 M 1 閃 第 2 図 第 3 図 @ 4 図 第 5 図 嶋 8 図 1q 殖9 図 七 繭10図 瀦旧図 菊 14  図 9 第16 図
1 and 2 are perspective views showing an outline of a conventional laser processing device, FIG. 6 is a sectional view of an embodiment of the present invention, FIG. 4 is a sectional view taken along the line IV-TV, and FIG. The figure is a sectional view showing an example of the usage state of the embodiment shown in Fig. 5, Fig. 6 is a sectional view showing another embodiment, Fig. 7 is an explanatory drawing showing the shape of the light shielding piece, and Fig. 8 is a FIG. 9 is a cross-sectional view of another embodiment in the direction perpendicular to the axis, FIG. 10 is a cross-sectional view showing an example of the gas venting part, and FIG. 12 and 16 are partial sectional views showing other embodiments of the waste removal section, and FIG. 14 is a sectional view showing still another embodiment of the gas removal section. , FIG. 15 is a perspective view showing only the gas venting section, and FIG. 16 is a sectional view showing the pressure control section. 2... Laser light 6, 3a... Light shielding cover 7...
・Laser lens 9, 9a, 9b...workpiece 1
0... Operator 16... Lens holder 14
... Groove portion 15... Light shielding plate 15a... First light shielding piece 15b... Second light shielding piece 15c, 1
5d, 15e... Light shielding piece 16.16a...
Light shielding plate suppressor 17... Gap 18... Decompression chamber
19... Vacuum device 20... Small hole 2
1... Piping 22... Pressure control part 23... Engagement protrusion 24... Engagement recess 25... Bending locking part 26... Hollow member 27... Gas venting part 28
...Entrance part 29...Outlet part 30...Outer frame part - material 61...Closed space = 523 M1 Figure 2 Figure 3 Figure @ 4 Figure 5 Figure 8 Figure 1q 9 Figure Seven cocoons and 10 illustrations Old illustration of chrysanthemum 14 Figure 9 Figure 16

Claims (1)

【特許請求の範囲】 1、 レーザ光を加工物に集光して照射するレーザレン
ズを覆い、その内部に加圧されたアシストガスを通過さ
せるレンズホルダを有スるレーザ加工装置において、上
記レンズホルダの外周に、その軸方向に沿って多数個の
遮光片を並設し、該遮光片で上記レンズホルダを囲続し
て遮光板を形成せしめ、かつ隣接する上記遮光片間に間
隙が生じないように相互に係合せしめると共に、上記遮
光片に上記アシストガスを外部側に排出するガス抜き部
を係合せしめ、さらに、上記遮光片を吸引してその自重
を軽くする圧力制御部を係合せしめると共に、上記遮光
片を上記レンズホルダの軸方向に摺動自在に保持する遮
光板抑えを上記遮光片の外方側に設けたことを特徴どす
るレーザ加工装置。 2、 短冊状の第1の遮光片を適宜の間隔を距てて円筒
状に並設すると共に、隣接する上記第1の遮光片に跨設
する短冊状の第2の遮光片を上記第1の遮光片の外側に
並設して上記遮光板を形成せしめると共に、上記第1の
遮光片の間隔と、これに跨設された第2の遮光片との間
に形成される間隙部を上記ガス抜き部として形成したこ
とを特徴とする特許請求の範囲第1項記載のレーザ加工
装置の 3 上記短冊状の第1および第2の遮光片の代りに、そ
の先端側に先細りの段付テープ部を形成する先端側円錐
体状の中空円筒をその軸方向に分割切断したものを上記
第1および第2の遮光片としたことを特徴とする特許請
求の範囲第2項記載のレーザ加工装置。 4 上記遮光板が、断面形状の両端側に係合凸部と係合
凹部を形成した短冊状の遮光片を円筒状に並設せしめそ
の係合凸部および凹部を隣接する遮光片の係合凹部と係
合凸部に係合せしめて単円筒体を形成したものであるこ
とを特徴とする特許請求の範囲第1項記載のし−ザ加工
装置。 5 上記遮光板が、その断面の両端側に折曲げ係止部を
形成する短冊状の遮光片の上記折曲げ係止部を、隣接す
る遮光片の上記折曲げ係止部と係止せしめてなる単円筒
体から形成されたものであることを特徴とする特許請求
の範囲第1項記載のレーザ加工装置 6 上記ガス抜き部が、曲線状に曲げられた中空部材を
上記遮光板の外周側に設け、上記遮光板の内部と上記中
空部材とを連通せしめたものから形成されたものである
ことを特徴とする特許請求の範囲第1項記載のレーザ加
工装置。 Z 上記ガス抜き部が、上記先端側円錐体状の中空円筒
から分割切断形成された遮光片の、上記先端側にこれを
被包して密閉空間を形成する外枠部材を設け、上記遮光
片および外枠部材に上記遮光板の内部に連通ずる入口部
と外部に連通ずる出口部とを設けたものから形成された
ものであることを特徴とする特許請求の範囲第6項記載
のレーザ装置。 8 上記圧力制御部が、上記遮光片を保持する上記遮光
板抑えに圧力調節手段を介1〜で真空装置を係合せし2
め、上記遮光片の上記遮光板抑えに保持される上記遮光
片に真空圧を作用せしめるようにしたものであることを
特徴とする特許請求の範囲第1項記載のレーザ加工装置
[Claims] 1. A laser processing device that includes a lens holder that covers a laser lens that focuses and irradiates a workpiece with laser light and that allows pressurized assist gas to pass through the lens holder. A large number of light-shielding pieces are arranged in parallel along the axial direction around the outer circumference of the holder, and the light-shielding pieces surround the lens holder to form a light-shielding plate, and gaps are created between adjacent light-shielding pieces. At the same time, a gas venting part for discharging the assist gas to the outside is engaged with the light shielding piece, and a pressure control part for sucking the light shielding piece to reduce its own weight is engaged. A laser processing device characterized in that a light-shielding plate retainer is provided on the outer side of the light-shielding piece to hold the light-shielding piece together and to slidably hold the light-shielding piece in the axial direction of the lens holder. 2. Strip-shaped first light-shielding pieces are arranged in a cylindrical shape at appropriate intervals, and a strip-shaped second light-shielding piece is arranged to straddle the adjacent first light-shielding pieces. The above-mentioned light-shielding plate is formed by disposing the light-shielding pieces on the outside of the first light-shielding piece, and the gap formed between the first light-shielding piece and the second light-shielding piece disposed astride the above-mentioned first light-shielding piece. 3 of the laser processing apparatus according to claim 1, characterized in that the laser processing device is formed as a gas venting portion, in place of the strip-shaped first and second light-shielding pieces, a stepped tape tapered on the tip side thereof; The laser processing apparatus according to claim 2, wherein the first and second light-shielding pieces are obtained by cutting a hollow cylinder in the shape of a cone on the tip side in the axial direction. . 4. The light-shielding plate has strip-shaped light-shielding pieces each having an engaging convex portion and an engaging recess formed on both ends of the cross-sectional shape arranged side by side in a cylindrical shape, and the engaging convex portions and concave portions are engaged with adjacent light-shielding pieces. 2. The cutting device according to claim 1, wherein the single cylindrical body is formed by engaging the concave portion and the engaging convex portion. 5. The light-shielding plate has the bending-locking portions of a strip-shaped light-shielding piece that forms bent-locking portions on both ends of its cross section locked with the bending-locking portions of adjacent light-shielding pieces. A laser processing device 6 according to claim 1, characterized in that the laser processing device 6 is formed from a single cylindrical body. 2. The laser processing apparatus according to claim 1, wherein the laser processing apparatus is formed of a material provided in the light shielding plate and communicating with the inside of the light shielding plate and the hollow member. Z The gas venting portion is formed by providing an outer frame member on the distal end side of the light shielding piece which is formed by dividing and cutting the light shielding piece from the conical hollow cylinder on the distal end side and forming a sealed space by enclosing the light shielding piece. The laser device according to claim 6, wherein the outer frame member is provided with an inlet portion communicating with the inside of the light shielding plate and an outlet portion communicating with the outside. . 8 The pressure control unit engages the vacuum device at 1 to 2 through the pressure adjustment means with the light shielding plate retainer holding the light shielding piece.
2. The laser processing apparatus according to claim 1, wherein vacuum pressure is applied to the light shielding piece held by the light shielding plate holder of the light shielding piece.
JP57128911A 1982-07-26 1982-07-26 Laser machining device Pending JPS5919093A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57128911A JPS5919093A (en) 1982-07-26 1982-07-26 Laser machining device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57128911A JPS5919093A (en) 1982-07-26 1982-07-26 Laser machining device

Publications (1)

Publication Number Publication Date
JPS5919093A true JPS5919093A (en) 1984-01-31

Family

ID=14996409

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57128911A Pending JPS5919093A (en) 1982-07-26 1982-07-26 Laser machining device

Country Status (1)

Country Link
JP (1) JPS5919093A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011121107A (en) * 2009-12-14 2011-06-23 Koike Sanso Kogyo Co Ltd Laser cutting device
WO2016121116A1 (en) * 2015-01-30 2016-08-04 株式会社牧野フライス製作所 Laser processing machine and alignment adjustment method

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011121107A (en) * 2009-12-14 2011-06-23 Koike Sanso Kogyo Co Ltd Laser cutting device
WO2016121116A1 (en) * 2015-01-30 2016-08-04 株式会社牧野フライス製作所 Laser processing machine and alignment adjustment method
JPWO2016121116A1 (en) * 2015-01-30 2017-07-06 株式会社牧野フライス製作所 Laser processing machine and alignment adjustment method
CN107107266A (en) * 2015-01-30 2017-08-29 株式会社牧野铣床制作所 Laser machine and alignment method of adjustment
EP3251785A4 (en) * 2015-01-30 2018-10-24 Makino Milling Machine Co., Ltd. Laser processing machine and alignment adjustment method
US11007603B2 (en) 2015-01-30 2021-05-18 Makino Milling Machine Co., Ltd. Laser beam machine and alignment adjusting method

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