DE102014113878B4 - Laser processing system and method for operating the same - Google Patents

Abstract

Laser processing system (3) for processing a workpiece (29), in particular a non-plate-shaped workpiece, with a laser beam (44) with: a workpiece storage device (39) for storing the workpiece (29), a laser system for providing the laser beam (44) for machining the workpiece (29) in a free movement mode covering the workpiece (29) and for machining the workpiece (29) in a local mode restricted to a local area (41) of the workpiece (29), and a shielding device (45) with a movable protective element (47), wherein the shielding device (45) for positioning the protective element (47) in a release position (49), which allows the laser beam (44) to be adjusted freely relative to the workpiece (29), and in a shielding position (51), in the material discharge (42) emanating from the local area (41) and/or reflected scattered radiation (43) are shielded.

Description

The present invention relates to a laser processing system for processing a workpiece with a laser beam, in particular for processing the workpiece using different processing modes. Furthermore, the invention relates to a method for operating a laser processing system.

It is known to surround laser processing systems with protective housings that must not be opened while the laser processing systems are in operation. All radiation is contained within the protective housing. In addition to protecting an operator, elements of the laser processing system can also be protected, for example by using materials that may be exposed to laser radiation, or by encasing components to be protected, such as cables, with such materials. However, the use of additional passive protective measures, such as sheet metal cladding, reduces the machine dynamics of a laser processing system, which can result in a longer processing time in large-scale processing.

DE 10 2008 031 323 A1 and JPH 11 314 189 A disclose protecting areas of a workpiece adjoining the laser processing zone from material removed during laser welding by a protective device, such as a protective ring surrounding a laser beam. Due to the spatial assignment of the shielding device to the irradiation side of the processing point, no protection for workpiece or machine components that are located on the workpiece side facing away from a processing head is guaranteed in a laser cutting process. In particular for a relative movement between a non-plate-shaped workpiece and the processing head, such protective devices can represent an interference contour and restrict the positioning of the laser beam in relation to the workpiece.

Since the melt is usually blown away from the laser processing head by the use of a cutting gas during laser cutting, the majority of harmful material ejection occurs on the side of a workpiece facing away from the processing head. Especially when processing non-plate-shaped workpieces, the material can be ejected in the direction of a machine element to be protected, or it can be deflected in its direction by a workpiece contour. If, as a result of the concentration of processing on a locally very limited area, an ejection directed to a machine component to be protected escapes over a longer period of time, e.g. longer than 3 seconds, this can lead to damage to the machine part.

A reflective heat shield is also required for conventional welding U.S. 2013/0306713 A1 known. This is set manually depending on the application and can only be used to shield a selected area. Such a heat shield can represent an impermissible interfering contour for large-scale machining of a workpiece.

One aspect of this disclosure is based on the object of specifying a laser processing system that enables the protection of system components depending on a processing mode of the laser processing system, for example for a change from a laser cutting mode to a laser material treatment mode or from a mode that is based on a large processing area to a Mode based on locally (strongly) limited processing. In particular, the object is to provide protective measures depending on possible damaging influences without negatively influencing the machine dynamics or the processing area of the laser processing system.

At least one of these objects is achieved by a laser processing system according to claim 1 and by a method for operating a laser processing system according to claim 9. Further developments are specified in the dependent claims.

In one aspect, a laser processing system for processing a workpiece with a laser beam has a workpiece storage device for storing the workpiece and a laser system for providing the laser beam for processing the workpiece in a free movement mode that covers the workpiece and for processing the workpiece in a local area of the Workpiece limited local mode. Furthermore, the laser processing system has a shielding device with a movable protective element, the shielding device for positioning the protective element in a release position that allows the laser beam to be adjusted freely relative to the workpiece, and in a shielding position in which reflected scattered radiation or other radiation emanating from the local area, for sensitive machine components are shielded from harmful influences caused by machining, such as material ejection.

In a further aspect, such a laser processing system has a shielding device which is designed so that the protective element is free in the free movement mode position and that the protective element assumes the shielding position in local mode.

In a further aspect, a laser processing system for processing a workpiece with a laser beam has a workpiece storage unit for storing the workpiece and a laser system for providing the laser beam for at least two types of processing of the workpiece, comprising a free movement mode covering the workpiece and one limited to a local area of the workpiece local mode on. Furthermore, the laser processing system has a shielding device with a movable protective element which, in a first release position assigned to the free movement mode, enables adjustment of the laser beam relative to the workpiece and which, in a second shielding position assigned to the local mode, shields a reflection or ejection direction originating from the local area .

In a further aspect, a method for processing a workpiece has the following steps: positioning the protective element in a release position, processing the workpiece with the laser beam in a free movement mode, with the positioning of the protective element in the release position permitting a relative positioning of the processing head and the workpiece by the protective element is essentially unimpaired, positioning the protective element in a shielding position and processing a workpiece with the laser beam in a local mode, with the positioning of the protective element in the shielding position impairing the relative positioning of the processing head and workpiece by the protective element, but possible reflected scattered radiation or a possible material discharge from the workpiece, such as slag spatter, is blocked by the protective element from hitting the section to be protected.

In some embodiments, the laser protection concept adapted to the operating mode allows work processes in the processing of workpieces to be simplified and accelerated. This is based, among other things, on the fact that no fixed protective element is arranged in the work area to protect against (laser) radiation occurring spatially over a longer period of time and/or against harmful material emissions occurring spatially over a longer period of time. Radiation of this type can arise in particular as a result of reflections of the laser beam during processing, for example during laser annealing or laser hardening. Harmful material ejection can occur primarily during laser cutting or laser welding if a local area is processed that is arranged in such a way that the material ejection is directed at sensitive materials/objects, directly or by deflection of a structure behind it.

In some embodiments, high machine dynamics are ensured in the movement mode with a required shielding from stray radiation in the local mode.

The concepts described herein relate in particular to the processing of components in which both cutting and/or welding processing and local heat treatment are to be carried out. The scattered radiation concentration that occurs during the heat treatment can be shielded, for example, by controllable, movable protective elements. Since the protective elements are only required for the heat treatment, for the duration of the heat treatment they are moved into the movement range of the processing head required for another type of laser processing. Exemplary heat treatment processes include laser annealing (such as soft annealing and stress relieving) and laser hardening.

In some embodiments, the risk of the destruction of machine tool components, in particular parts of the laser processing system, is reduced by reflected laser radiation during the partial soft annealing of a workpiece with the laser radiation. Some of the concepts disclosed herein enable radiation-sensitive machine tool components to be protected by retracting a partial shield (e.g. in the form of a protective element).

Likewise, the risk of severe contamination or destruction of sensitive machine components, such as the bellows, through damaging material ejection, such as slag spatter, which is ejected in the direction of the sensitive machine components due to locally limited, ongoing processing, can be reduced by retracting a partial shield.

It is necessary to move the shielding into the working area in this way, since a permanently installed shielding can lead to a mostly impermissible interfering contour, e.g. when cutting a workpiece over a large area.

In some developments, the laser system is designed to irradiate the laser beam in free movement mode in a working area of the laser processing system and in local mode onto a limited local area of the workpiece and/or to set a beam diameter on the workpiece larger in local mode than in movement mode. The laser system may also include a processing head that is relatively can be positioned relative to the workpiece and from which the laser beam emerges. The free movement mode can correspond to laser processing in which the reflected scattered radiation changes continuously in its spatial distribution due to the movement of the laser beam relative to the workpiece, and/or the free movement mode can be used for laser cutting and/or laser welding. The local mode can correspond to laser processing in which the conditions for generating the reflected scattered radiation remain essentially the same spatially and/or over the application time of the local mode due to the limitation of the laser processing to the local area. This can occur, for example, when a flange area intended for welding is annealed. The local mode can be used for heat treatment processes such as laser heating and/or laser annealing.

The free movement mode can also correspond to laser processing in which a material ejection, e.g. in the form of slag spatter, changes continuously in its spatial distribution due to the movement of the laser beam relative to the workpiece, and/or the free movement mode can be used for laser cutting. The local mode may correspond to laser processing in which the ejection direction of the material ejection remains substantially the same spatially and/or over the application time of the local mode due to the confinement of the laser processing to the local area. This can occur, for example, when cutting in a limited space over a longer period of time, such as when cutting fine structures, machining pipe ends or when the machining head is at a standstill while the workpiece is moving at the same time.

In some developments, the protective element can be located in the shielding position in a movement range of the processing head that is necessary for laser processing in the movement mode and/or the shielding position can be provided in such a way that due to the spatial expansion of the shielding device, and in particular of the protective element, the laser beam can be adjusted relatively to the workpiece, particularly when moving the machining head toward or away from the local area. Furthermore, the shielding position can be provided in such a way that damage to a section to be protected, which is otherwise exposed to the reflected scattered radiation or the material ejection, is avoided due to the shielding by the protective element.

In some developments, the laser processing system can also have a controller which is designed to position the protective element in the release position when the laser system is operated in the free movement mode and in the shielding position when the laser system is operated in the local mode. Furthermore, the laser processing system can have a component that is to be protected against irradiation of reflected radiation and/or material ejection, in particular a plastic component, a bellows, a cable or a hose. Furthermore, the laser processing system can include the workpiece, which has a section that is to be protected against irradiation of reflected scattered radiation and/or against material ejection, in particular a surface section.

In some developments, the shielding device can be attached to the workpiece storage device or to the laser system. The shielding device can serve to shield a flange region of the workpiece for which a soft annealing operation in the local mode is intended. Furthermore, the protective element can be brought from the release position into the shielding position by retracting, pivoting and/or turning in, and/or the protective element can be designed as an exchangeable spare part and/or as a shield.

In some developments, the workpiece storage device can have a workpiece support, a number of control interfaces connected to the controller and a number of holding devices, such as workpiece clamps. The holding devices can be attached modularly to the workpiece storage device for holding the workpiece and can be controlled via correspondingly assigned control interfaces to assume a removal position or a holding position. Furthermore, the shielding device can be controlled via a control interface connected to the controller and provided on the workpiece storage device to assume the release position or the shielding position.

• 1 eine schematische räumliche Darstellung einer in mehreren Betriebsmodi betreibbaren Werkzeugmaschine,
• 2 eine schematische räumliche Darstellung einer beispielsweise in der Werkzeugmaschine aus 1 vorgesehenen Laserbearbeitungsanlage mit einer Abschirmvorrichtung,
• 3 eine schematische Seitenansicht einer Laserbearbeitungsanlage ohne Abschirmvorrichtung zur Verdeutlichung der Situation bei Anlagen gemäß dem Stand der Technik,
• 4 eine schematische Seitenansicht der Laserbearbeitungsanlage mit der Abschirmvorrichtung gemäß 2 in einer Freigabestellung,
• 5 eine schematische Seitenansicht der Laserbearbeitungsanlage mit der Abschirmvorrichtung gemäß 2 in einer Abschirmstellung und
• 6 eine schematische Seitenansicht der Laserbearbeitungsanlage mit der Abschirmvorrichtung gemäß 2 in einer Abschirmstellung für ein Bauteil mit einer lokalen, den Schmelzaustrieb ablenkenden Kontur.

Concepts are disclosed herein that allow improving at least in part aspects of the prior art. In particular, further features and their usefulness result from the following description of embodiments with reference to the figures. From the figures show:

• 1 a schematic spatial representation of a machine tool that can be operated in several operating modes,
• 2 a schematic spatial representation of, for example, in the machine tool 1 provided laser processing system with a shielding device,
• 3 a schematic side view of a laser processing system without a shielding device to illustrate the situation in systems according to the prior art,
• 4 a schematic side view of the laser processing system with the shielding device according to FIG 2 in a release position,
• 5 a schematic side view of the laser processing system with the shielding device according to FIG 2 in a shielding position and
• 6 a schematic side view of the laser processing system with the shielding device according to FIG 2 in a shielding position for a component with a local contour that deflects the melt flash.

In 1 a machine tool 1 with a laser processing system 3 is shown as the basic machine for processing a workpiece. The machine tool 1 is operated via a control panel 5, for example via the creation and setting of NC programs that define work processes specific to workpieces and their processing. A control cabinet 7 arranged on the rear of the machine tool 1 has, as part of a machine tool control, the associated CNC control, an electrical supply for drives and logic and power parts.

A not explicitly in 1 The laser device shown in the laser processing system 3 is used to generate laser radiation and can be based, for example, on a solid-state laser such as a disk laser or fiber laser or a gas laser such as a CO2 laser. The beam can be guided from the laser device to the workpiece via laser light cables and/or mirrors. A cooling unit 9 for the laser device cools optical components such as deflection or collimation mirrors and the control cabinet 7. A protective cabin 11 serves to shield laser radiation from the outside. In 1 the cover wall of the protective cabin 11 is not shown for inspection.

Other components of the machine tool 1 include, for example, a rotary changer 13 for holding workpieces to be machined and for easy removal of machined workpieces, a compact deduster 15 for extracting smoke gases and suspended particles from the interior, a scrap conveyor 17 and integrated elements for the pneumatics that are not explicitly shown , for the cutting and welding gas supply as well as for the central lubrication. Furthermore, a light grid 19 can delimit an external access area to the rotation changer 13 .

A work sequence controlled by the CNC control allows the workpiece to be processed in a predetermined manner with the interaction of the various components of the laser processing machine. In this way, a work process can be repeatedly carried out one after the other and a large number of workpieces can be processed efficiently and equally. The workpiece is usually processed further in a subsequent production step.

Aspects described herein are based in part on the recognition that different modes of operation have different spatial requirements in terms of relative positioning of the processing head and the workpiece. Correspondingly, protective measures can be provided which can be activated selectively for one operating mode (or also selectively for a number of operating modes). In particular, it was recognized that in a local mode, in which the laser processing is restricted to a sub-area of the workspace, reflected light and/or material ejection can occur under similar conditions over a longer period of time. If, for example, the reflected light hits an absorbent material over a longer period of time, it can be damaged or even destroyed. For a flexibly adjustable shielding, it is proposed to shield the associated reflected light and/or the material ejection in this special operating mode by a shielding device, with the shielding device being designed in such a way that they are not restricted by such a shielding in a movement mode in which the processing is not restricted should, the processing releases spatially. Accordingly, a shielding device can be provided which is selectively adapted to the local mode.

According to the shielding concepts disclosed here, for example, a laser cutting system can also be used for heat treatment processes, e.g. In particular, it is proposed here to design a machine tool in such a way that a workpiece can be subjected to a local heat treatment in preparation for further processing. For example, following a laser cutting process that results in a predetermined shape of a workpiece, (laser) soft annealing is performed to prepare a flange area for a (e.g. laser) welding process.

According to the shielding concepts disclosed herein, different operating modes can be used within a workflow. the For example, processing can take place sequentially or alternately in a motion mode and a local mode. The movement mode and the local mode are used in connection with the 2 until 5 explained further.

2 shows schematically the structure of the laser processing system 3 in the interior of the protective cabin 11. The protective cabin 11 surrounds a movement unit 21 with functionally relevant components such as X, Y and Z slides 23, 25, 27 for moving beam guidance and media supply components relative to a workpiece 29 Bellows 31, 33, 35 cover corresponding lines and mechanical components and run, for example, along the X and Y slides 23, 25.

In general, the beam delivery components include laser light cables, a Z-quill, collimation optics, and processing optics for directing and focusing the laser beam onto a workpiece 29. The processing optics are usually provided in a processing head 37, which can be positioned and aligned essentially freely, and from the the laser beam emerges. In particular, the machining head 37 can assume any adjustable position and orientation in an area determined by the X, Y and Z slides 23, 25, 27 and the mobility of the Z sleeve. The X, Y and Z slides 23 , 25 , 27 are assigned drive units which allow the machining head 37 to move relative to the workpiece 29 . This results in a working space that includes all points that can be processed by the correspondingly focused exiting laser beam.

This working space is available for machining the workpiece 29, in particular in the movement mode, with the workpiece 29 in the embodiment according to FIG 2 is stored in a fixed position due to a clamping technique, so that processing can only be carried out from above. In alternative embodiments, the workpiece 29 is also movable in space or only the workpiece 29 is movable. The concepts made here can also be implemented in such configurations if appropriately adapted.

2 also schematically shows a workpiece storage device 39 with a workpiece support for storing the workpiece 29 to be machined. The workpiece storage device 39 usually includes further elements, such as clamps for clamping the workpiece 29, and sensors for component recognition. Other elements are, for example, an external button for loading confirmation or a status light that signals component recognition to the user. The electrical and pneumatic interfaces for connecting the elements can be located, for example, in the control cabinet 7, on the control panel 5 or on the rotation changer 13.

In general, formed sheet metal parts are an example of a three-dimensional, variably shaped workpiece 29. The workpiece 29 is, for example, a hot-formed structural part for a motor vehicle, e.g., a B-pillar.

For example, in the case of laser cutting, the laser beam first pierces the workpiece 29, i. H. the workpiece 29 is melted at one point (fusion cut) or melted and oxidized (flame cut) and the resulting melt is blown out and can lead to material ejection. The laser beam and the workpiece 29 are then moved relative to one another, so that a two-dimensional processing path produces a continuous cutting gap along which the laser beam cuts through the workpiece 29 . For example, recesses are made in the workpiece 29 and its external dimensions are adapted to the desired values. Accordingly, the workpiece 29 must be freely accessible all around and in the area of the recesses.

The inner walls of the protective booth 11 are usually formed from sheet metal (as an example of a solid, non-laser transmissive material) and may have special absorbing windows for viewing and monitoring of the processing.

However, the interior of the machine tool 1 can also contain components that can be damaged by laser radiation and reflected laser radiation (and/or material ejection). These are, for example, bellows (like those in 2 shown bellows 31, 33, 35), electrical cables, hoses and other heat-sensitive components such as plastic. Metal surfaces can also be damaged at high and/or long-lasting intensities.

The schematic side view of the 3 shows that, for example, bellows 33 and 35 are exposed to reflected scattered radiation 43 of a laser beam 44 when processing a flange area (as an example of a local processing area also referred to herein as local area 41) and can be damaged by this if the scattered radiation 43 is incident for a sufficiently long time. This can occur, for example, when the flange area is soft-annealed.

In order to protect such components of the machine tool 1 or also surface sections of the workpiece 29 , the laser processing system 3 also has a shielding device 45 . In the embodiment according to 2 is the Shielding device 45 attached to workpiece storage device 39 by way of example. In alternative embodiments, it can also be attached to the processing head 37 or one of the X, Y and Z carriages 23, 25, 27.

The shielding device 45 has a protective element 47 . The protective element 47 is movably mounted so that it can assume two positions. In one position, the protective element 47 points away from the work support, so that the working area above the workpiece 29 is not restricted. This position is referred to herein as the release position 49 and is shown in the schematic side view of FIG 4 clarified. The release position 49 is used in laser cutting, for example when cutting the edge of the workpiece 29 (as in 4 shown).

In the other position, the protective element 47 points upwards. As a result, the protective element 47 can protrude into the working area and restrict it. For example, the freedom of movement of the machining head 37 in the area of the protective element 47 is restricted. For example, the processing head 37 can no longer occupy the entire range of displacement in the direction of the protective element 47 .

This second position is referred to herein as shielding position 51 and is shown in the schematic side view of FIG 5 clarified. The shielding position 51 is activated, for example, during heat treatment, for example during annealing of the flange area of the workpiece 29 (as in 5 shown). Furthermore shows 5 that the reflected scattered radiation 43 hits the protective element 47 in the shielding position 51 and thus can no longer damage the bellows 33 and 35 .

Correspondingly, the shielding device 45 can consist of, for example, a cylinder which causes the position change, a joint and the protective element 47 . To control the shielding device 45, it, in particular the cylinder, can be connected to one of the freely configurable control interfaces of a machine control system that is usually provided for holding the workpiece 29 by means of clamping elements and/or suction cups. Such control interfaces are provided, for example, in the laser processing machines of the TruLaser Cell series from Trumpf GmbH + Co, such as the TruLaserCell 8030 or TruLaser Cell Series 7000 machine tools. With such control interfaces, the user can control complete automatic sequences, for example via inputs and outputs for a wide variety of elements, such as pneumatic cylinders, solenoid valves, end position sensors, foot switches, status lights or other automation components.

The shielding device 45 can thus form the configured elements of a sequence for machining a workpiece, for example together with clamping cylinders, clamping elements, sensors, buttons and/or status lights. Furthermore, the shielding device 45 can be activated automatically as soon as laser processing takes place in a local mode. For this purpose, the machine control receives a corresponding signal, which indicates the laser processing in the local mode, and activates a shielding position 51 of the shielding device 45 assigned to the corresponding local mode, as long as the signal is present. The same or another shielding device can correspondingly be activated for a further heat treatment of another section of the workpiece 29 .

An exemplary course of a laser processing with a laser cutting processing and a laser annealing treatment is presented below. In the tool control designed, for example, as a programmable logic controller, several processes can be stored, loaded and/or activated at the same time.

At the start of processing, the rotary changer is loaded with a workpiece either manually or automatically. One or more proximity switches check whether the workpiece is present and correctly positioned before the corresponding clamping device can close. They can be controlled electrically or pneumatically, with the clamping devices communicating their status change to the machine control and the rotation changer turning from the loading and unloading position to the processing position. Then the laser cutting can start in one movement mode, i.e. in the entire area of the workpiece.

Once the cutting work has been completed, the processing head positions itself for the heat treatment. For example, the distance to the surface is increased in order to supply heat over a large area, for example to a flange area. At the same time or afterwards, the shielding device changes to the shielding position. The shielding device can, for example, be connected and controlled electrically and/or pneumatically via a control interface on the rotary changer. The shielding device can, for example, be program-controlled and pneumatically activated in automatic mode. In set-up mode, the shielding device can be operated via switching elements. Reaching the shielded position can, but does not have to, be monitored. If the heat treatment was completed, the shielding device switch back to the release position. Alternatively, another flange area can be heat treated.

After completing the laser processing, the rotary changer turns back to the loading and unloading position. A workpiece that has been prepared in the meantime in another storage area is thus brought into the work area and the corresponding sequence is repeated.

If a partial step of the process cannot be executed correctly, the process can be aborted and possibly restarted automatically. Alternatively, an error signal can be output, which is displayed on the operator console, for example, in order to trigger an active cancellation by the user.

In general, the moving mode processing and the local mode heating may be performed in any order, or their performance may be repeated at will.

The above exemplary applications relate to shielding of the scattered radiation that occurs during laser processing. It is also possible that during laser processing the already mentioned material ejection occurs, e.g. in the form of slag spatter, such as during laser cutting processing. During the cutting process, the laser beam and the workpiece 29 are moved relative to one another, so that a two-dimensional processing path causes a continuous cutting gap along which the laser beam cuts through the workpiece 29 . The material is melted and the melt produced during the cutting process is blown out.

If the trajectory of the laser beam is very locally limited, such as in the case of a workpiece zone with fine structures, the emerging material accumulation can be directed in an ejection direction. Furthermore, it is possible that the structure of the workpiece itself forms a local contour, which deflects or even concentrates the melt ejection in one direction during local processing, as can be the case with pipe ends, for example. Sensitive machine parts such as bellows (e.g. the 2 Bellows 31, 33, 35 shown), electrical cables, hoses and other heat-sensitive components, for example made of plastic, can be damaged or unacceptably heavily soiled by prolonged exposure to such material discharge.

6 shows them off 2 known laser processing system 3 with the shielding device 45 in the shielding position 51. The workpiece 29 has a tube area, at the end of which there is another example of a local processing area, which is also known as the local area 41 in 6 is implied. Due to the geometric shape of the workpiece in the vicinity of the local area 41 (in the example the 6 the rounding on the opposite side of the tube), the material ejected 42 resulting from the cutting process is deflected in the direction of the bellows 35 during local laser cutting. In the shielding position 51 shown, the protective element 47 points upwards. As a result, the protective element 47 can protrude into the working area and restrict it. For example, the freedom of movement of the machining head 37 in the area of the protective element 47 is restricted. The shielding position 51 is activated before the local area 41 on the workpiece is machined. The molten flash 42 directed onto the bellows 35 thus hits the protective element 47 and can no longer damage the bellows 35 .

At one, for the workpiece off 6 , not shown laser cutting processing in the movement mode, the shielding device 45 is moved to a release position (e.g. the release position 49 in 4 ) transferred so that the working area above the workpiece 29 is not restricted.

The concepts disclosed herein can supplement permanently installed shielding or the passive protection of the affected components with protective foils or protective plates. Furthermore, they can be used together with a specially adjusted irradiation direction of the laser radiation, which leads to a reduced scattered radiation or a scattered radiation specifically directed to the protective element and/or a reduced material ejection or a material ejection specifically directed to the protective element.

The preceding exemplary embodiments of laser processing systems refer, by way of example, to sheet metal processing with so-called flying optics, in which the workpiece stands still and the processing optics are moved over the workpiece. However, the protection concept described here is not limited to such processing of workpieces. Rather, the protection concept can also be used in the processing of moving workpieces and in the case of laser processing heads or workpieces attached to robots. In particular, the laser protection concept can also be used on machines with a fixed processing head or one that can only be moved in one direction. Furthermore, it goes without saying that the processing concept described here can not only be used with a laser cutting machine, such as the one shown in 1 was shown, but also with other laser processing machines, eg for laser hardening, laser welding and laser application welding of materials or can be used on punch-laser combination machines.

It is explicitly emphasized that all features disclosed in the description and/or the claims are to be regarded as separate and independent from each other for the purpose of original disclosure as well as for the purpose of limiting the claimed invention independently of the combinations of features in the embodiments and/or the claims should. It is explicitly stated that all indications of ranges or indications of groups of units disclose every possible intermediate value or subgroup of units for the purpose of original disclosure as well as for the purpose of limiting the claimed invention, in particular also as a limit of a range indication.

Claims (10)

Laser processing system (3) for processing a workpiece (29), in particular a non-plate-shaped workpiece, with a laser beam (44) with: a workpiece storage device (39) for storing the workpiece (29), a laser system for providing the laser beam (44) for processing the workpiece (29) in a free movement mode covering the workpiece (29) and for processing the workpiece (29) in a limited to a local area (41) of the workpiece (29). local mode and a shielding device (45) with a movable protective element (47), the shielding device (45) for positioning the protective element (47) in a release position (49) which allows the laser beam (44) to be adjusted freely relative to the workpiece (29), and in a shielding position (51) in which material discharge (42) and/or reflected scattered radiation (43) emanating from the local area (41) are shielded. Laser processing system (3) according to claim 1 , wherein the laser system is designed to radiate the laser beam (44) onto the workpiece (29) in the free movement mode in a working area of the laser processing system (3) and in the local mode onto the local area (41) and/or a beam diameter on the workpiece (29 ) larger in local mode than in movement mode, and/or wherein the laser system has a processing head (37) which can be positioned relative to the workpiece (29) and from which the laser beam (44) emerges. Laser processing system (3) according to claim 1 or 2 , wherein the free movement mode corresponds to laser processing, in which the material output (42) and/or the reflected scattered radiation (43) changes continuously in its spatial distribution due to the movement of the laser beam (44) relative to the workpiece (29), and/or wherein the free movement mode can be used for laser cutting and/or laser welding. Laser processing system (3) according to one of the preceding claims, wherein the local mode corresponds to a laser processing in which the conditions for the generation of the material output (42) and/or the reflected scattered radiation (43) due to the restriction of the laser processing to the local area (41) remain substantially the same spatially and/or over the application time of the local mode, and/or wherein the local mode can be used for heat treatment methods, such as for laser heating and/or laser annealing, for example of a flange area (41) provided for welding. Laser processing system (3) according to one of the preceding claims, wherein the protective element (47) is in the shielding position (51) in a movement range of the processing head (37) that is necessary for laser processing in the moving mode and/or wherein the shielding position (51) is provided in such a way that due to the spatial expansion of the shielding device (45), and in particular of the protective element (47), the setting of the laser beam (44) relative to the workpiece (29), in particular when moving the processing head (37 ) towards or away from the local area (41), and/or the shielding position (51) being provided in such a way that damage to a section to be protected which would otherwise be exposed to a material ejection (42) and/or reflected scattered radiation (43) is avoided due to the shielding by the protective element (47). Laser processing system (3) according to any one of the preceding claims, further with a controller (7) designed to position the protective element (47) in the release position (49) when the laser system is operated in free movement mode and in the shielding position (51) when the laser system is operated in local mode, and/or a component that is to be protected against material ejection (42) and/or reflected scattered radiation (43), in particular a plastic component, a bellows (31, 33, 35), a cable or a hose, and/or a workpiece (29) which has a section which is to be protected against material ejection (42) and/or irradiation of reflected scattered radiation (43), in particular a surface section. Laser processing system (3) according to one of the preceding claims, wherein the shielding device (45) is attached to the workpiece storage device (39) or to the laser system, in particular for shielding a flange region (41) of the workpiece (29) for which a soft annealing work step in local mode is provided and/or wherein the protective element (47) can be brought from the release position (49) into the shielding position (51) by retracting, swiveling in and/or turning in and/or wherein the protective element (47) is an exchangeable spare part and/or as a shield is trained. Laser processing system (3) according to one of the preceding claims, wherein the workpiece storage device (39) has a workpiece support, a plurality of control interfaces connected to the controller (7) and a plurality of holding devices, such as workpiece clamps, and the holding devices are modular on the workpiece storage device (39) for holding the workpiece (29) and can be controlled via correspondingly assigned control interfaces to assume a removal position or a holding position, and/or the shielding device (45) via a control interface connected to the controller (7) and provided on the workpiece storage device (39) to assume the Release position (49) or the shielding position (51) can be controlled. Method for processing a workpiece (29) with a laser processing system (3) which has a processing head (37) and a shielding device (45) with a protective element (47), the protective element (47) being in a release position (49 ) a setting of a processing head (37) relative to the workpiece (29) in a working area of the laser processing system (3) and in a shielding position (51) assigned to a local mode releases a material ejection (42) emanating from the local area (41) and/or a material ejection from the local area (41) shields outgoing reflected scattered radiation (43), and the laser processing system (3) or the workpiece (29) has a section to be protected, with the steps: Positioning of the protective element (47) in the release position (49), Machining of the workpiece (29) with the laser beam (44) in the free movement mode, with due to the positioning of the protective element (47) in the release position (49) a relative positioning of the machining head (37) and workpiece (29) by the protective element (47) in is essentially unaffected, positioning of the protective element (47) in the shielding position (51) and Machining a workpiece (29) with the laser beam (44) in local mode, the relative positioning of the machining head (37) and workpiece (29) being impaired by the protective element (47) due to the positioning of the protective element (47) in the shielding position (51). , but a possible material ejection (42) and/or a possible reflected scattered radiation (43) from hitting the section to be protected is blocked by the protective element (47). procedure after claim 9 , wherein laser cutting, laser welding and/or laser drilling is performed in the movement mode and/or wherein a heat treatment such as laser annealing or laser hardening is performed in the local mode.

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