JPS59189240U - ダイボンデイング装置 - Google Patents

ダイボンデイング装置

Info

Publication number
JPS59189240U
JPS59189240U JP8393883U JP8393883U JPS59189240U JP S59189240 U JPS59189240 U JP S59189240U JP 8393883 U JP8393883 U JP 8393883U JP 8393883 U JP8393883 U JP 8393883U JP S59189240 U JPS59189240 U JP S59189240U
Authority
JP
Japan
Prior art keywords
detection plate
attached
detection
die bonding
needle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8393883U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0526740Y2 (https=
Inventor
玉田　孝彦
Original Assignee
東芝精機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東芝精機株式会社 filed Critical 東芝精機株式会社
Priority to JP8393883U priority Critical patent/JPS59189240U/ja
Publication of JPS59189240U publication Critical patent/JPS59189240U/ja
Application granted granted Critical
Publication of JPH0526740Y2 publication Critical patent/JPH0526740Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
JP8393883U 1983-06-03 1983-06-03 ダイボンデイング装置 Granted JPS59189240U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8393883U JPS59189240U (ja) 1983-06-03 1983-06-03 ダイボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8393883U JPS59189240U (ja) 1983-06-03 1983-06-03 ダイボンデイング装置

Publications (2)

Publication Number Publication Date
JPS59189240U true JPS59189240U (ja) 1984-12-15
JPH0526740Y2 JPH0526740Y2 (https=) 1993-07-07

Family

ID=30213891

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8393883U Granted JPS59189240U (ja) 1983-06-03 1983-06-03 ダイボンデイング装置

Country Status (1)

Country Link
JP (1) JPS59189240U (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014068763A1 (ja) * 2012-11-02 2014-05-08 富士機械製造株式会社 ダイ供給装置のエキスパンドリング内径計測システム及び突き上げ動作干渉回避システム

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52149069A (en) * 1976-06-07 1977-12-10 Toshiba Corp Method and device for detecting zone in which members constituting semiconductor are distributed
JPS57110912A (en) * 1980-12-27 1982-07-10 Shinkawa Ltd Detection of limit of wafer

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52149069A (en) * 1976-06-07 1977-12-10 Toshiba Corp Method and device for detecting zone in which members constituting semiconductor are distributed
JPS57110912A (en) * 1980-12-27 1982-07-10 Shinkawa Ltd Detection of limit of wafer

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014068763A1 (ja) * 2012-11-02 2014-05-08 富士機械製造株式会社 ダイ供給装置のエキスパンドリング内径計測システム及び突き上げ動作干渉回避システム
JPWO2014068763A1 (ja) * 2012-11-02 2016-09-08 富士機械製造株式会社 ダイ供給装置のエキスパンドリング内径計測システム及び突き上げ動作干渉回避システム

Also Published As

Publication number Publication date
JPH0526740Y2 (https=) 1993-07-07

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