JPS5918646A - Wire bonding apparatus - Google Patents

Wire bonding apparatus

Info

Publication number
JPS5918646A
JPS5918646A JP57127102A JP12710282A JPS5918646A JP S5918646 A JPS5918646 A JP S5918646A JP 57127102 A JP57127102 A JP 57127102A JP 12710282 A JP12710282 A JP 12710282A JP S5918646 A JPS5918646 A JP S5918646A
Authority
JP
Japan
Prior art keywords
plate
solenoid
wire
ball
torch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57127102A
Other languages
Japanese (ja)
Inventor
Masayoshi Yamaguchi
政義 山口
Toshiro Tsuruta
鶴田　寿郎
Nobushi Suzuki
鈴木　悦四
Sumio Nagashima
永島　純雄
Koichi Chiba
宏一 千葉
Koichiro Atsumi
幸一郎 渥美
Noriyasu Kashima
規安 加島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP57127102A priority Critical patent/JPS5918646A/en
Publication of JPS5918646A publication Critical patent/JPS5918646A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/78268—Discharge electrode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To obtain high speed and stable line junction apparatus by converting the linear reciprocal movement of solenoid into rotating operation of torch bar through a ball joint and a rotating plate and by restricting the rotating range with an eccentric stopper. CONSTITUTION:When a solenoid 40 turns ON, a plunger 41 proceeds and thereby linear movement of a connecting plate 37 in the same direction is convented to rotating movement of a plate 30 through a ball joint 38. The plate 30 rotates around the center of a support tube 24 and the torch bar 26 also rotates in the same direction. Thereby, an electrode 29 is opposed to the lower end of a wire 28. After forming a ball 28a through discharge by applying a high voltage to the torch bar 26, a plunger 41 restores from a spring 46, the plate 30 moves backward through a connecting plate 37, the torch bar 26 rotates in the direction b and the electrodes 29 isolates from the ball 28a. Rotating range of bar 26 is restricted by an eccentric stopper 47 which abuts against the rotating plate 30 and is determined by rotation of an eccentric ring 49 caused by a screw 48. Otherwise, it is also possible to move backward the plunger screwed to a threaded hole 39 by loosening a nut 42.

Description

【発明の詳細な説明】 〔発明の技術分野〕 この発明はたとえば半導体装置の組立工程において、ベ
レットとリードフレームとをワイヤによって接続するワ
イヤボンディング装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a wire bonding device that connects a pellet and a lead frame with a wire in, for example, a semiconductor device assembly process.

〔発明の技術的背景とその問題点〕[Technical background of the invention and its problems]

半導体ペレットとリードフレームとを電気的に接続する
手段としてワイヤボンディングが採用されている。この
ワイヤボンディングは、キャピラリに挿通されたワイヤ
の下端にトーチ棒を接近させ、スノクークを飛ばしてボ
ールを形成し、このボールを上記半導体ペレット上に圧
着するようになっている。したがって、ワイヤの下端に
形成するボールは、その大きさが常に一定でしかも高速
ボンディングに対応できるように瞬時に形成する必要が
ある。Wire bonding is employed as a means for electrically connecting semiconductor pellets and lead frames. In this wire bonding, a torch rod is brought close to the lower end of a wire that has been inserted into a capillary, and a ball is formed by blowing the wire, and this ball is pressed onto the semiconductor pellet. Therefore, the ball formed at the lower end of the wire must always have a constant size and must be formed instantaneously so as to be compatible with high-speed bonding.

そこで、従来においては、第１図および第２図で示すよ
うなボール形成機構を採用している。Therefore, in the past, a ball forming mechanism as shown in FIGS. 1 and 2 has been adopted.

すなわち、１は支持部拐で、この支持部材１には板ばね
２ｆｃ介して支持管３が揺動自在に数句けられ、この支
持管３にトーチ棒４が挿入固定されている。このトーチ
棒４はその下端部がほぼＬ字状に折曲され、その先端に
キャピラリ５に挿通されたワイヤ６の下端と対向する電
極７が設けられ、スパークを飛ばしてワイヤ６の下端に
ボール８を形成するようになっている。また、上記支持
管３の下端部にはトーチ棒４を支持管３に固定するだめ
の固定部材９が嵌着され、この固定部材９の受圧面ＩＱ
には取付板１１に取付けられたソレノイド１２のシラン
ジャ１３が当接している。さらに、取付板１ノと固定部
材９との間にはコイルスプリング１４が張設され、上記
板ばね２とともに復帰機構を形成している。なお、１５
．１６はストッノヤで、トーチ棒４の揺動範囲を規制し
ている。That is, 1 is a support member 1. A support tube 3 is swingably mounted on the support member 1 via a plate spring 2fc, and a torch rod 4 is inserted and fixed into the support tube 3. The lower end of the torch rod 4 is bent into a substantially L-shape, and an electrode 7 is provided at the tip of the torch bar 4, which faces the lower end of the wire 6 inserted into the capillary 5. 8. Further, a fixing member 9 for fixing the torch rod 4 to the support tube 3 is fitted to the lower end of the support tube 3, and the pressure receiving surface IQ of this fixing member 9 is
A syringe 13 of a solenoid 12 attached to the mounting plate 11 is in contact with the syringe 13 of the solenoid 12 . Further, a coil spring 14 is stretched between the mounting plate 1 and the fixing member 9, and together with the leaf spring 2, forms a return mechanism. In addition, 15
．． Reference numeral 16 denotes a stopper which regulates the swing range of the torch rod 4.

しかして、ソレノイド１２をＱＮすると、グランジャ１
３は突出して固定部材９の受圧面１０を押圧する。した
がって、トーチ棒４は板はね２およびコイルスプリング
１４の復元力に抗して矢印ａ方向に揺動し、電極７はキ
ャピラリ５に挿通されたワイヤ６の下端に近接する。Therefore, when solenoid 12 is QN, Granger 1
3 protrudes and presses the pressure receiving surface 10 of the fixing member 9. Therefore, the torch rod 4 swings in the direction of arrow a against the restoring force of the plate spring 2 and the coil spring 14, and the electrode 7 approaches the lower end of the wire 6 inserted into the capillary 5.

ここで、トーチ棒４に高電圧を印加してスパークを飛ば
すとワイヤ６の下端にゾール８が形成される。スパーク
を飛ばしたのちソレノイドＪ２をＯＦＦするとプランジ
ャ１３は没入し、トーチ棒４は板はね２とコイルスプリ
ング１４の復元力によって矢印す方向に揺動し、電極７
がボール８から離間する。このとき、トーチ棒４の揺動
範囲はス）　ｙ　ｉ４７６＋　１６によって規制される
が、トーチ棒４をソレノイド１２のプランジャ１３によ
って直接押圧しているために揺動範囲を大きくするため
にはソレノイド１２自体のストローク（４を大きくする
必要がある。しかし、ソレノイド１２のストローク（４
を大きくすると、ソレノイド１２の駆動力が低下し、高
速度に作動させることが不可能となる。また、トーチ棒
４にストッパ１５．１６を当接して揺動範囲を規制して
いるために、当接時にトーチ棒４の先端の電極７が振動
し、ワイヤ６との間隔を一定に保てないためボール８の
大きさにバラツキができ、また、揺動範囲の調節も面倒
であるＯ 〔発明の目的〕 この発明は上記事情に着目してなされたもので、その目
的とするところは、高速にで、しかも安定したゾールが
形成できるとともに、トーチ棒の回動範囲の調節も容易
に行なうことができるワイヤデンディング装置を提供し
ようとするものである。Here, when a high voltage is applied to the torch rod 4 and a spark is blown, a sol 8 is formed at the lower end of the wire 6. When the solenoid J2 is turned off after the spark is blown, the plunger 13 is retracted, and the torch rod 4 is swung in the direction indicated by the arrow by the restoring force of the plate spring 2 and the coil spring 14, and the electrode 7
is separated from ball 8. At this time, the swinging range of the torch bar 4 is regulated by S) y i476+ 16, but since the torch bar 4 is directly pressed by the plunger 13 of the solenoid 12, in order to increase the swinging range, the solenoid 12 It is necessary to increase the stroke of solenoid 12 (4). However, the stroke of solenoid 12 (4
If it becomes large, the driving force of the solenoid 12 decreases, making it impossible to operate it at high speed. In addition, since the stoppers 15 and 16 are brought into contact with the torch rod 4 to restrict the swing range, the electrode 7 at the tip of the torch rod 4 vibrates when the torch rod 4 comes into contact with the stopper 15, 16, so that the distance between the torch rod 4 and the wire 6 can be kept constant. This causes variations in the size of the ball 8, and it is also troublesome to adjust the swing range. [Object of the Invention] This invention was made in view of the above circumstances, and its purpose is to: It is an object of the present invention to provide a wire bending device which can form a stable sol at high speed and which can also easily adjust the rotation range of a torch rod.

〔発明の概要〕[Summary of the invention]

直線往復運動するソレノイドのグランジャをボールジヨ
イントを介して回動板に伝動し、との回動板の回動運動
によってトーチ棒を回動させてキャピラリから導出され
たワイヤの下端に電極を接離するとともに、上記回動板
に偏心スト、パ機構を設け、トーチ棒の回動範囲を容易
に調節できるようにしたことにある。The solenoid's Granger, which moves linearly reciprocating, is transmitted to the rotary plate via the ball joint, and the rotation of the rotary plate rotates the torch rod to connect the electrode to the lower end of the wire led out from the capillary. In addition, the rotary plate is provided with an eccentric stopper mechanism so that the range of rotation of the torch rod can be easily adjusted.

〔発明の実施例〕[Embodiments of the invention]

以下、この発明を図面に示す一実施例にもとづいて説明
する。第３図ないし第５図中２１はフレームで、このフ
レーム２１には上下に離間して一対■支持体２２．２２
が設けられている。The present invention will be described below based on an embodiment shown in the drawings. Reference numeral 21 in FIGS. 3 to 5 is a frame, and this frame 21 has a pair of supports 22 and 22 spaced apart vertically.
is provided.

これら支持体２２．２２には軸受２３．２３が設けられ
、これら軸受２３．２３には支持管２４の両端部が回転
自在に軸支されている。そして、この支持管２４には絶
縁筒２５を介してトーチ棒２６の上端部が挿入固定され
、このトーチ棒２６の下端部はくの字状に折曲されてい
るとともに、先端にキャピラリ２７を挿通する金線など
のワイヤ２８の下端に対向する電極　　　　”２９を有
している。さらに、上記支持筒２２と２２との間には支
持管２４に固着された回動板３０が設けられている。し
たがって、この回動板３０は支持管２４を中心として回
動自在になっておシ、この回動板３ｏの回動に伴って上
記トーチ棒２６が回動するようになっている。さらに、
この回動板３ｏの一端部には切＠３１が設けられ、この
切溝３ノ内の下面には凹ル［３２が形成されているとと
もにこれと対向する上面にはねじ孔３３が穿設されてい
る。そして、切溝３）内における凹所３２には鋼球３４
が係合され、この鋼球３４はねじ孔３３に螺挿された締
付ねじ３５によって保持されている。さらに、上記切溝
３１内には上記鋼球３４と嵌合する嵌合孔３６を有した
連結板３７が挿入され、回動板３０と連結板３７とを回
動自在に連結するが−ルジ、インド３８を形成している
。また、連結板３７の上記切溝３１から突出する部分に
はねじ孔３９が穿設され、このねじ孔３９にはソレノイ
ド４０のプランジャ４１が螺挿されているとともにす、
ト４２によって締付固定されている。上記ソレノイド４
０にはグランジャ４１と直交するシャフト４３が設けら
れ、このシャフト４３の両端部はベアリング４４．４４
を介して上記フレーム２１に固定されたホルダ４５に回
動自在に取付けられている。そして、このホルダ４５と
プランジャ４１の末端との間には復帰はね４６が張設さ
れている。したがって、ソレノイド４０はシャフト４３
を中心として回動自在で、上記ゴールジヨイント３８を
中心として回動する連結板３７に追従するようになって
いる。一方、上記支持体２２には回動板３０の回動範囲
を規制する一対の偏心ストッ／ＩＰ機構４７．４７が設
けられている。この偏心ストッパ機構４７は調節ねじ４
８とこれと一体に回転する偏心リング４９からなシ、調
節ねじ４８の回動量によって回動板３ｏの回動許容量を
調節するようになっている。Bearings 23.23 are provided on these supports 22.22, and both ends of the support tube 24 are rotatably supported on these bearings 23.23. The upper end of a torch rod 26 is inserted and fixed into this support tube 24 via an insulating tube 25, and the lower end of this torch rod 26 is bent into a dogleg shape, and a capillary 27 is attached to the tip. It has an electrode "29" facing the lower end of a wire 28 such as a gold wire to be inserted therein. Furthermore, a rotating plate 30 fixed to the support tube 24 is provided between the support tubes 22. Therefore, the rotary plate 30 is rotatable about the support tube 24, and the torch rod 26 rotates as the rotary plate 3o rotates. moreover,
A cut @31 is provided at one end of the rotary plate 3o, and a concave hole [32] is formed on the lower surface of the cut groove 3, and a screw hole 33 is bored on the upper surface opposite to this. has been done. A steel ball 34 is placed in the recess 32 in the kerf 3).
The steel ball 34 is held by a tightening screw 35 screwed into the screw hole 33. Furthermore, a connecting plate 37 having a fitting hole 36 for fitting the steel ball 34 is inserted into the cut groove 31, and rotatably connects the rotating plate 30 and the connecting plate 37. , forming India 38. Further, a screw hole 39 is formed in a portion of the connecting plate 37 that protrudes from the cut groove 31, and a plunger 41 of a solenoid 40 is screwed into the screw hole 39.
It is tightened and fixed by a bolt 42. Above solenoid 4
0 is provided with a shaft 43 that is perpendicular to the granger 41, and both ends of this shaft 43 are fitted with bearings 44, 44.
It is rotatably attached to a holder 45 fixed to the frame 21 via. A return spring 46 is stretched between the holder 45 and the end of the plunger 41. Therefore, the solenoid 40 is connected to the shaft 43
It is rotatable around the gorge joint 38, and follows the connecting plate 37, which rotates around the gorge joint 38. On the other hand, the support body 22 is provided with a pair of eccentric stop/IP mechanisms 47, 47 for regulating the rotation range of the rotation plate 30. This eccentric stopper mechanism 47 is connected to the adjusting screw 4
8 and an eccentric ring 49 that rotates together with the eccentric ring 49, the allowable amount of rotation of the rotating plate 3o is adjusted by the amount of rotation of the adjusting screw 48.

しかして、ソレノイド４０ｆ：ＯＮすると、グランジャ
４１は復帰はね４６の復元力に抗して前進するため、連
結板３７も同方向へ移動するが・連結板３７はボールジ
ヨイント３８を介して回動板３０に連結されているため
、連結板３７の直線運動は回動運動に変換される。した
がって、回動板３ｏは支持管２４を中心として回動し、
トーチ棒２６も矢印ａ方向へ回動して電極２９がキャピ
ラリ２７を挿通するワイヤ２８の下端に対向する。ここ
で、トーチ棒２６に高電圧を印加してスパークを飛ばす
とワイヤ２８の下端にボール２８ａが形成される。スパ
ークを飛ばしたのちソレノイド１２を０ＦＦｆるとシラ
ンジャ４１は復帰ばね４６の復元力にょって後退し、連
結板３７を介して回動板３ｏが引かれる。したがって、
回動板３ｏとともにトーチ棒２６も矢印す方向に回動し
、電極２９は？−ル２８８から離間する。このときのト
ーチ棒２６の回動範囲は回動板３ｏに当接する偏心スト
ッパ機構４７．４７によって規制されるため、その調節
ねじ４８によって偏心リング４９を回動することによシ
任意の回動範囲に設定できる。また、トーチ棒２６の回
動範囲は連結板３７とシランジャ４１との連結部におい
ても調節できる。すなわち、ナツト４２を弛め、ねじ孔
３９に螺挿されたシランジャ４１を進退させればよい。When the solenoid 40f is turned ON, the granger 41 moves forward against the restoring force of the return spring 46, and the connecting plate 37 also moves in the same direction. Since it is connected to the moving plate 30, the linear movement of the connecting plate 37 is converted into a rotational movement. Therefore, the rotating plate 3o rotates around the support tube 24,
The torch bar 26 also rotates in the direction of arrow a so that the electrode 29 faces the lower end of the wire 28 passing through the capillary 27. Here, when a high voltage is applied to the torch rod 26 and a spark is blown, a ball 28a is formed at the lower end of the wire 28. When the solenoid 12 is turned to 0FFf after the spark is blown, the sylanger 41 moves backward by the restoring force of the return spring 46, and the rotating plate 3o is pulled via the connecting plate 37. therefore,
The torch bar 26 also rotates in the direction indicated by the arrow along with the rotating plate 3o, and the electrode 29 moves upward. - move away from the wheel 288; At this time, the range of rotation of the torch bar 26 is regulated by the eccentric stopper mechanism 47, 47 that comes into contact with the rotation plate 3o. Can be set to a range. Further, the rotation range of the torch rod 26 can also be adjusted at the connection portion between the connection plate 37 and the silanger 41. That is, the nut 42 may be loosened and the sylanger 41 screwed into the screw hole 39 may be moved forward or backward.

〔発明の効果〕〔Effect of the invention〕

この発明は以上説明したように、直線往復運動するソレ
ノイドをゴールジヨイントを介して回動板に伝動し、と
の回動板の回動運動によってトーチ棒を回動させてキャ
ピラリから導出されたワイヤの下端に電極を接離するよ
うにしたから、ソレノイドのストロークをわずかに可変
するだけでトーチ棒の回動範囲を大きく可変できるとい
う効果がある。さらに、偏心ストツノ々機構を用いると
とによってトーチ棒の調節も容易に行なうことができる
という効果を奏する。As explained above, this invention transmits a linearly reciprocating solenoid to a rotary plate via a gold joint, and the rotary plate rotates the torch rod to lead out the torch from the capillary. Since the electrode is connected to and separated from the lower end of the wire, it has the effect that the rotation range of the torch bar can be greatly varied by only slightly varying the stroke of the solenoid. Furthermore, by using the eccentric strut mechanism, the torch rod can be easily adjusted.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図および第２図は従来のボール形成機構を示すもの
で、第１図は正面図、第２図は縦断側面図、第３図ない
し第５図はこの発明の一実施例を示すもので、第３図は
正面図、第４図は平面図、第５図は縦断側面図である。 ２６・・・トーチ棒、２７・・・キャピラリ、２８・・
・ワイヤ、２９・・・電極、３ｏ・・・電極、３８・・
・ボールジヨイント、４０・・・ソレノイド、４７・・
・偏心ストッパ機構。 出願人代理人　　弁理士　鈴　江　武　彦第１頁の続き ０発　明　者　渥美幸一部 横浜市磯子区新杉田町８番地東 京芝浦電気株式会社生産技術研 究所内 ０発　明　者　加島規安 横浜市磯子区新杉田町８番地東 京芝浦電気株式会社生産技術研 究所内 ２３９−1 and 2 show a conventional ball forming mechanism, FIG. 1 is a front view, FIG. 2 is a vertical side view, and FIGS. 3 to 5 show an embodiment of the present invention. 3 is a front view, FIG. 4 is a plan view, and FIG. 5 is a longitudinal side view. 26...torch rod, 27...capillary, 28...
・Wire, 29...electrode, 3o...electrode, 38...
・Ball joint, 40... Solenoid, 47...
・Eccentric stopper mechanism. Applicant's representative Patent attorney Takehiko Suzue Continued from page 10 Author: Yuki Atsumi, Tokyo Shibaura Electric Co., Ltd. Production Technology Laboratory, 8 Shinsugita-cho, Isogo-ku, Yokohama, Japan Author: Kiyan Kashima, Isogo-ku, Yokohama Shinsugita-cho 8 Tokyo Shibaura Electric Co., Ltd. Production Technology Laboratory 239-

Claims (1)

【特許請求の範囲】[Claims] キャピラリから導出されたワイヤの先端にトーチ棒を対
向させ、スパークによって上記ワイヤの先端にゴールを
形成するボール形成機構を備えたワイヤデンディング装
置において、上記が一ル形成機構は、直線往復運動する
ソレノイドと１このソレノイドとボールジヨイントを介
して連動する回動自在な回動板と、との回動板の回動中
心部に固定され回動に伴って上記キャピラリから導出さ
れたワイヤの下端に接離する電極を有したトーチ棒と、
このトーチ棒の回動範囲を規制する偏心ストッ・や機構
とから構成したことを特徴とするワイヤボンディング装
置。In a wire-dending device, the ball-forming mechanism is equipped with a torch rod facing the tip of a wire led out from a capillary, and a spark forms a goal at the tip of the wire, wherein the ball-forming mechanism reciprocates in a straight line. A solenoid, a rotatable rotary plate interlocked with the solenoid through a ball joint, and a lower end of a wire fixed at the center of rotation of the rotary plate and led out from the capillary as the solenoid rotates. a torch rod having an electrode that connects and separates from the
A wire bonding device characterized by comprising an eccentric stop and a mechanism for regulating the rotation range of the torch rod.
JP57127102A 1982-07-21 1982-07-21 Wire bonding apparatus Pending JPS5918646A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57127102A JPS5918646A (en) 1982-07-21 1982-07-21 Wire bonding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57127102A JPS5918646A (en) 1982-07-21 1982-07-21 Wire bonding apparatus

Publications (1)

Publication Number Publication Date
JPS5918646A true JPS5918646A (en) 1984-01-31

Family

ID=14951640

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57127102A Pending JPS5918646A (en) 1982-07-21 1982-07-21 Wire bonding apparatus

Country Status (1)

Country Link
JP (1) JPS5918646A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62147642U (en) * 1986-03-10 1987-09-18
CN102913946A (en) * 2012-10-23 2013-02-06 上海莱克气割机有限公司 Numerical control infinitely rotating three-cutting torch ignition device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62147642U (en) * 1986-03-10 1987-09-18
JPH0430203Y2 (en) * 1986-03-10 1992-07-21
CN102913946A (en) * 2012-10-23 2013-02-06 上海莱克气割机有限公司 Numerical control infinitely rotating three-cutting torch ignition device
CN102913946B (en) * 2012-10-23 2014-10-22 上海莱克气割机有限公司 Numerical control infinitely rotating three-cutting torch ignition device

Similar Documents

Publication Publication Date Title
US3941486A (en) Wire bonder
JPS5918646A (en) Wire bonding apparatus
JPH04323844A (en) Contact bonding head
JPS59147968U (en) adjustable control valve
RU2002122131A (en) METHOD FOR PRODUCING A HIGH VOLTAGE PASS-INSULATOR
JP2617976B2 (en) Feed roll device
CN206662302U (en) Tail spindle
JPH0136703B2 (en)
US2330955A (en) Roll feed auxiliary adjustment
JPH1050736A (en) Die bonding head of die bonder
JP2734739B2 (en) Sewing machine top feeder
JPS601892Y2 (en) Wire guide angle adjustment device
JPS61198640A (en) Wire bonder
CN215034791U (en) Dotting device for thermocouple wire
JPH04117442U (en) wire bonder
CN214350419U (en) Welding head moving device and wire welding machine
JPS58158932A (en) Wire bonding device
SU68506A1 (en) Device for measuring pressure between the electrodes of a spot welding machine
JPS6217139Y2 (en)
JP2532854Y2 (en) Roller support device for printing machines
JPH06295941A (en) Wire bonding device
JPS5939078U (en) gouging device
JPH0289334A (en) Semiconductor device marking machine
JPS6229896B2 (en)
JPH02154436A (en) Ball formation unit of wire bonding device