JPH0289334A - Semiconductor device marking machine - Google Patents
Semiconductor device marking machineInfo
- Publication number
- JPH0289334A JPH0289334A JP24135888A JP24135888A JPH0289334A JP H0289334 A JPH0289334 A JP H0289334A JP 24135888 A JP24135888 A JP 24135888A JP 24135888 A JP24135888 A JP 24135888A JP H0289334 A JPH0289334 A JP H0289334A
- Authority
- JP
- Japan
- Prior art keywords
- theta
- head
- semiconductor device
- compensation
- bolt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 11
- 238000012937 correction Methods 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 2
- 230000006835 compression Effects 0.000 abstract description 4
- 238000007906 compression Methods 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は品種切替えを容易にした、マークヘッド補正機
構をそなえた半導体装置マーキング機に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a semiconductor device marking machine equipped with a mark head correction mechanism that facilitates product type switching.
従来の技術
近年、半導体装置は多品種少量生産に既対応できる装置
が必要とされている。2. Description of the Related Art In recent years, there has been a need for semiconductor devices that can handle high-mix, low-volume production.
従来のマークヘッド機構には、Ｘ補正手段およびＸ補正
手段をそなえ、各々、ボルトを回転させる事により各ハ
ウジングが自在にピッチ移動する。選定後、それぞれ、
固定ボルトで固定出来る様になっている。そして、機構
の先端に２方向への移動可能なハウジングがあり、圧縮
バネでゴム印装着ヘッドを支えている。The conventional mark head mechanism is equipped with an X correction means and an X correction means, and each housing can be freely moved in pitch by rotating a bolt. After selection, each
It can be fixed with a fixing bolt. At the tip of the mechanism is a housing that is movable in two directions and supports the rubber stamp mounting head with a compression spring.
発明が解決しようとする課題
しかしながら、上記の従来の構成では、オペレータがゴ
ム印の品種切替え時に、傾きな（装着するという、高度
な技術を要求されるという欠点を有していた。Problems to be Solved by the Invention However, the above-mentioned conventional configuration has the disadvantage that the operator is required to use advanced techniques to mount the rubber stamp at an angle when changing the type of rubber stamp.
本発明は上記従来の問題点を解決するもので、品種切替
えの短縮を提供することを目的とする。The present invention solves the above-mentioned conventional problems, and aims to shorten product changeover.
課題を解決するための手段
この目的を達成するために本発明の半導体装置マーキン
グ機は、マークヘッドθ補正機構をそなえ、主軸部に偏
心ピンを設ける構成を有してる。Means for Solving the Problems In order to achieve this object, the semiconductor device marking machine of the present invention is provided with a mark head θ correction mechanism and has a structure in which an eccentric pin is provided on the main shaft portion.
作用
この構成によって、θ固定ボルトをゆるめ偏心ビンを回
転させることにより、マークヘッド部全体をθ方向に偏
心することができる。Function: With this configuration, the entire mark head portion can be eccentrically moved in the θ direction by loosening the θ fixing bolt and rotating the eccentric pin.
実施例
以下、本発明の一実施例について、第１図、第２図の平
面図、正面断面図の各図面を参照しながら説明する。EXAMPLE Hereinafter, an example of the present invention will be described with reference to the plan view and front sectional view of FIGS. 1 and 2.
第１図、第２図において、この装置は、Ｘ補正ボルト１
．Ｘハウジング２．Ｘ固定ボルト３．Ｙ補正ボルト４．
Ｙハウジング５．Ｘ固定ボルト６、Ｚハウジング７、圧
縮バネ８．ゴム印装着ヘッド９をもち、これに加えて、
マークヘッド固定アーム１０にθ補正偏心ビン１１およ
びθ固定ボルト１２を設ける。θ補正偏心ビン１１は、
ねじ込みによりヘッド全体を傾け、これにより、半導体
装置１３の表面に均一に当接するようにゴム印１４の水
平面からの傾き（θ）を調整する。そして、固定ボルト
１２で固定して、ヘッドの設定を完了する。In FIGS. 1 and 2, this device has an X correction bolt 1
．． X housing 2. X fixing bolt 3. Y correction bolt 4.
Y housing 5. X fixing bolt 6, Z housing 7, compression spring 8. It has a rubber stamp mounting head 9, and in addition,
A θ correction eccentric bin 11 and a θ fixing bolt 12 are provided on the mark head fixing arm 10. The θ correction eccentric bin 11 is
The entire head is tilted by screwing, thereby adjusting the inclination (θ) of the rubber stamp 14 from the horizontal plane so that it contacts the surface of the semiconductor device 13 uniformly. Then, fix it with the fixing bolt 12 to complete the head setting.
以上の操作によって、半導体装置１３の所定面に対して
ゴム印をθ補正する事が出来る。Through the above operations, the rubber stamp can be θ-corrected for a predetermined surface of the semiconductor device 13.
発明の効果
以上のように本発明によれば、Ｘ、Ｙ補正かつθ補正を
設ける事により、ゴム印品種切替えが容易に出来る優れ
たマークヘッド機構となった。Effects of the Invention As described above, according to the present invention, by providing X, Y correction and θ correction, an excellent mark head mechanism that can easily change rubber stamp types has been obtained.
第１図、第２図は、本発明の実施例のマークヘッド部の
機構の平面図、正面断面図である。
ｌ・・・・・・Ｘ補正ボルト、２・・・・・・Ｘハウジ
ング、３・・・・・・Ｘ固定ボルト、４・・・・・・Ｙ
補正ボルト、５・・・・・・Ｙハウジング、６・・・・
・・Ｘ固定ボルト、７・・・・・・Ｚハウジング、８・
・・・・・圧縮バネ、９・・・・・・ゴム印装着ヘッド
、１０・・・・・・マークヘッド固定アーム、１１・・
・・・・θ補正偏心ビン、１２・・・・・・θ固定ボル
ト、１３・・・・・・半導体装置、１４・・・・・・ゴ
ム印。1 and 2 are a plan view and a front sectional view of a mechanism of a mark head section according to an embodiment of the present invention. l...X correction bolt, 2...X housing, 3...X fixing bolt, 4...Y
Correction bolt, 5...Y housing, 6...
...X fixing bolt, 7...Z housing, 8.
...Compression spring, 9...Rubber stamp mounting head, 10...Mark head fixing arm, 11...
.....theta correction eccentric bottle, 12 .....theta. fixing bolt, 13 .... semiconductor device, 14 ..... rubber stamp.
Claims (1)
ージ面に対するＸ補正とＹ補正とθ補正が行なえる機構
をもった半導体装置マーキング機。This semiconductor device marking machine has a mechanism that allows X, Y, and θ corrections to be made to the package surface of a semiconductor device using a stamping method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24135888A JPH0289334A (en) | 1988-09-27 | 1988-09-27 | Semiconductor device marking machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24135888A JPH0289334A (en) | 1988-09-27 | 1988-09-27 | Semiconductor device marking machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0289334A true JPH0289334A (en) | 1990-03-29 |
Family
ID=17073108
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24135888A Pending JPH0289334A (en) | 1988-09-27 | 1988-09-27 | Semiconductor device marking machine |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0289334A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06218824A (en) * | 1992-12-21 | 1994-08-09 | Xerox Corp | Pultrusion member having functional characteristics |
-
1988
- 1988-09-27 JP JP24135888A patent/JPH0289334A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06218824A (en) * | 1992-12-21 | 1994-08-09 | Xerox Corp | Pultrusion member having functional characteristics |
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