JPS5919353A - Fine adjustment rotary jig for setting cutting point - Google Patents
Fine adjustment rotary jig for setting cutting pointInfo
- Publication number
- JPS5919353A JPS5919353A JP57127551A JP12755182A JPS5919353A JP S5919353 A JPS5919353 A JP S5919353A JP 57127551 A JP57127551 A JP 57127551A JP 12755182 A JP12755182 A JP 12755182A JP S5919353 A JPS5919353 A JP S5919353A
- Authority
- JP
- Japan
- Prior art keywords
- cutter
- fine adjustment
- cutting
- cutting point
- diamond cutter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
Abstract
Description
【発明の詳細な説明】
本発明はダイヤモンドカッターの切削ポイント位置を設
定する切削ポイント設定用微調回転治具に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a cutting point setting fine adjustment rotary jig for setting the cutting point position of a diamond cutter.
半導体装置の製造工程の一つに半導体薄板（つ工−ハ）
を縦横に分断してベレットとする工程がある。ウェーハ
の分断に先立ってウェーハ表面に縦横に切削溝な設ける
必要があるが、このウェーハの切削方法としてスクライ
バ−装置な用いダイヤモンドカッターで切削する方法が
ある。このダイヤモンドカッターには切削に一番適した
点（切削ポイント）があり、ウェーハ切削の際は、切削
ポイン）ｋ合わせて作業な行なう。切削ポイント設定の
手順としては、■ダイヤモンドカッターをスクライバ−
装置に取付ける。■ダイヤモンドカッター取付角度及び
切込み深さを決める。■ウェーハを試し切りし、その切
削状態でカッターポイントを判断する。この様な手順の
後前記■の試し切りでウェーハの切削状態が悪い場合（
切削ポイントが合っていない状態）は、カッターな微調
回転して再び試し切りを行なうとともに切削状態判定を
行なう。このような操作の繰返しによってカッタ円周３
６０のいずれかにある切削ポイントを捜し出して切削ポ
イント設定な行なう。Semiconductor thin plate is one of the manufacturing processes of semiconductor devices.
There is a process of dividing it vertically and horizontally to make pellets. Prior to dividing the wafer, it is necessary to provide vertical and horizontal cutting grooves on the wafer surface, and one method for cutting the wafer is to cut it with a diamond cutter using a scriber device. This diamond cutter has a point (cutting point) that is most suitable for cutting, and when cutting a wafer, work is performed at the same cutting point. To set the cutting point, use the diamond cutter with a scriber.
Attach to the device. ■Determine the diamond cutter mounting angle and cutting depth. ■Trial cut the wafer and judge the cutter point based on the cutting condition. After these steps, if the cutting condition of the wafer is poor in the trial cutting described in ■ above (
If the cutting points are not aligned, the cutter is rotated finely and a trial cut is made again, and the cutting condition is determined. By repeating this operation, the cutter circumference 3
The cutting point is set by searching for a cutting point in any one of 60.
しかし、この方法では、微調回転の際カッター取付ネジ
なゆるめて行なう行なう為、前記手順■で設定した角度
及び切込み深さが狂い、これを更に合わせようとすると
回転方向の位置が、前回合わせた位置からどの程度回転
させたか不明となり、ポイント設定が困難となる。However, with this method, the cutter mounting screw is loosened during fine rotation, so the angle and depth of cut set in step ① above will be incorrect, and if you try to adjust them further, the position in the rotation direction will be changed from the previous adjustment. It becomes unclear how far the object has been rotated from its position, making it difficult to set points.
したがって、本発明の目的はダイヤモンドカッターなス
クライバ−装置に固定する際、カッターの取付高さおよ
び取付角度を一定に維持した状態でカッターの微調回転
の行なえる切削ポイント設定用微調回転治具な提供する
ことにある。SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a fine adjustment rotation jig for setting a cutting point, which allows fine rotation of a cutter while maintaining the installation height and installation angle of the cutter constant when it is fixed to a scriber device such as a diamond cutter. It's about doing.
この様な目的を達成するために本発明はダイヤモンドカ
ッターに切削ポイント設定用微調回転治具な取付けてお
くことにより前記状態でのダイヤモンドカッター微調回
転な可能とした。以下実施例により本発明を説明する。In order to achieve such an object, the present invention makes it possible to finely rotate the diamond cutter in the above state by attaching a fine rotation jig for setting cutting points to the diamond cutter. The present invention will be explained below with reference to Examples.
第１図は本発明の一実施例による切削ポイント設定用微
調回転治具（微調回転治具）を示す断面図、第２図は同
じく側面図、第３図は微調回転治具な取り付けたダイヤ
モンドカッターをスクライバ−装置に取付けた状態を示
す要部の正面図である。微調回転治具ｌは第１図及び第
２図に示すように、ダイヤモンドカッターな挿入するた
めの挿入穴２を中央部に有する筒状の本体３からなると
ともに、外周面から挿入穴２に達するねじ孔に微調回転
治具固定ネジ４な螺装している。また、本体３の一端に
は微調回転治具ｌの微調回転操作な容易にするために１
対の突起部５が設けられている。Fig. 1 is a sectional view showing a fine adjustment rotation jig for setting cutting points according to an embodiment of the present invention, Fig. 2 is a side view of the same, and Fig. 3 is a diamond attached to the fine adjustment rotation jig. FIG. 3 is a front view of main parts showing a state in which the cutter is attached to the scriber device. As shown in Figs. 1 and 2, the fine adjustment rotation jig l consists of a cylindrical main body 3 having an insertion hole 2 in the center for inserting a diamond cutter, and reaches the insertion hole 2 from the outer peripheral surface. A fine adjustment rotation jig fixing screw 4 is screwed into the screw hole. In addition, one end of the main body 3 is equipped with a holder to facilitate the fine-tune rotation operation of the fine-tune rotation jig l.
A pair of protrusions 5 are provided.
つぎに、切削ポイントの設定について説明する。Next, setting of cutting points will be explained.
先ず第３図で示すようにダイヤモンドカッター６なスク
ライバ−装置のアーム７の先端部に取付はダイヤモンド
カッター先端部８とウェーノーステージ９との高さく切
込み深さ）な決め、ダイヤモンドカッター６なダイヤモ
ンドカッター固定ネジｌＯで仮固定（手動で回動できる
程度の締付け）する。First, as shown in Fig. 3, the diamond cutter 6 is attached to the tip of the arm 7 of the scriber device, and the diamond cutter 6 is attached to the tip of the diamond cutter 6 at a height (cutting depth) between the diamond cutter tip 8 and the wafer stage 9. Temporarily fix the cutter with the cutter fixing screw lO (tighten enough to allow manual rotation).
次に微調回転治具ｌをアーム７の上面に接触する迄ダイ
ヤモンドカッター６の上部に挿入し微調回転治具固定ネ
ジ４でダイヤモンドカッター６に固定する。次に、ウェ
ーハステージ９上のウェーハｌ盛をためし切りし、切削
状態な判断し、悪ければ突起部５な相み、ダイヤモンド
カッター６を微調回転させ、更にためし切りと言う動作
なくり返して行ないダイヤモンドカッター６の円周部分
にあるはずの切削ポインドナ探し、切削ポイントが決ま
ったら、ダイヤモンドカッタ固定ネジｌＯをしっかりと
締付てダイヤモンドカッター６が動かないようにする。Next, the fine adjustment rotation jig 1 is inserted into the upper part of the diamond cutter 6 until it contacts the upper surface of the arm 7, and is fixed to the diamond cutter 6 with the fine adjustment rotation jig fixing screw 4. Next, test-cut one stack of wafers on the wafer stage 9, judge the cutting condition, and if the cutting condition is bad, check if the protrusion 5 is damaged, finely rotate the diamond cutter 6, and repeat the test-cutting operation. Find the cutting point that should be on the circumference of the diamond cutter 6, and once the cutting point is determined, firmly tighten the diamond cutter fixing screw lO to prevent the diamond cutter 6 from moving.
なお、前記突起部５は微調回動時の回動量の目安ともな
る。このような実施例によれば、これまでダイヤモンド
カッター６を微調回転するために固定ネジをゆるめて行
こなっていたものが、仮固定の状態で出来るようになり
、ダイヤモンドカッター６の取付角度および取付高さく
切込深さ）が一定に維持できることから切削ポイントの
設定が短時間で適確に出来るため、ペレタイズ工程の歩
留向上が図れる。尚、本発明は前記実施例に限定されな
い。Note that the protrusion 5 also serves as a guide for the amount of rotation during fine adjustment rotation. According to such an embodiment, fine rotation of the diamond cutter 6, which had previously been done by loosening the fixing screw, can now be done while temporarily fixing the diamond cutter 6. Since the cutting height and depth of cut can be maintained constant, cutting points can be set accurately in a short time, which improves the yield of the pelletizing process. Note that the present invention is not limited to the above embodiments.
第１図は本発明の一実施例による切削ポイント設定用微
調回転治具の断面図、
第２図は同じ（切削ポイント設定用微調回転治具の側面
図、
第３図は同じ（切削ポイント設定用微調回転治具なスク
ライバ−装置に取付けた要部を示す正面図である。
■・・・微調回転治具、４・・・微調回転治具固定ネジ
、５・・・突起部、６・・・ダイヤモンドカッター、７
・・・アーム、８・・・ダイヤモンドカッター先端部、
９−ウェーハステージ、１０・・・ダイヤモンドカッタ
ー固定ネジ、１１・・・ウエーノＳ。Fig. 1 is a sectional view of a fine adjustment rotary jig for setting cutting points according to an embodiment of the present invention, Fig. 2 is the same (a side view of the fine adjustment rotation jig for setting cutting points), and Fig. 3 is the same (cutting point setting It is a front view showing the main parts attached to the scriber device, which is a fine adjustment rotation jig.・・Diamond cutter, 7
...Arm, 8...Diamond cutter tip,
9-Wafer stage, 10...Diamond cutter fixing screw, 11...Ueno S.
Claims (1)
付けられるダイヤモンドカッターにおける切削ポイント
設定用微調回転治具であって、この治具は前記アームの
上面に突出するダイヤモンドカッタ一部分に挿入固定さ
れるとともに、アームの上面に当接する筒状本体からな
っていて、ダイヤモンドカッターの取付角度および切込
深さを一定に維持するように構成されていることを特徴
とする切削ポイント設定用微調回転治具。1. A fine adjustment rotating jig for setting cutting points in a diamond cutter that is attached to the arm of a scriber device via a fixing screw, and this jig is inserted and fixed into a portion of the diamond cutter that protrudes from the upper surface of the arm. A fine adjustment rotary jig for setting a cutting point, comprising a cylindrical body that comes into contact with the upper surface of an arm, and is configured to maintain a constant mounting angle and cutting depth of a diamond cutter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57127551A JPS5919353A (en) | 1982-07-23 | 1982-07-23 | Fine adjustment rotary jig for setting cutting point |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57127551A JPS5919353A (en) | 1982-07-23 | 1982-07-23 | Fine adjustment rotary jig for setting cutting point |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5919353A true JPS5919353A (en) | 1984-01-31 |
Family
ID=14962799
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57127551A Pending JPS5919353A (en) | 1982-07-23 | 1982-07-23 | Fine adjustment rotary jig for setting cutting point |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5919353A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62109093A (en) * | 1985-11-07 | 1987-05-20 | 松下電器産業株式会社 | Waveform synthesizer |
| JPH01289994A (en) * | 1988-05-17 | 1989-11-21 | Casio Comput Co Ltd | Electronic musical instrument |
| US5212334A (en) * | 1986-05-02 | 1993-05-18 | Yamaha Corporation | Digital signal processing using closed waveguide networks |
| US5256830A (en) * | 1989-09-11 | 1993-10-26 | Yamaha Corporation | Musical tone synthesizing apparatus |
-
1982
- 1982-07-23 JP JP57127551A patent/JPS5919353A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62109093A (en) * | 1985-11-07 | 1987-05-20 | 松下電器産業株式会社 | Waveform synthesizer |
| JPH0679224B2 (en) * | 1985-11-07 | 1994-10-05 | 松下電器産業株式会社 | Waveform synthesizer |
| US5212334A (en) * | 1986-05-02 | 1993-05-18 | Yamaha Corporation | Digital signal processing using closed waveguide networks |
| US5448010A (en) * | 1986-05-02 | 1995-09-05 | The Board Of Trustees Of The Leland Stanford Junior University | Digital signal processing using closed waveguide networks |
| JPH01289994A (en) * | 1988-05-17 | 1989-11-21 | Casio Comput Co Ltd | Electronic musical instrument |
| US5256830A (en) * | 1989-09-11 | 1993-10-26 | Yamaha Corporation | Musical tone synthesizing apparatus |
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