CN217475100U

CN217475100U - SAW wafer marking machine positioning jig

Info

Publication number: CN217475100U
Application number: CN202220651104.9U
Authority: CN
Inventors: 叶竹之; 刘屿剑; 宋嵩
Original assignee: Chengdu Timemaker Crystal Technology Co ltd
Current assignee: Chengdu Timemaker Crystal Technology Co ltd
Priority date: 2022-03-23
Filing date: 2022-03-23
Publication date: 2022-09-23
Anticipated expiration: 2032-03-23

Abstract

The utility model discloses a SAW wafer marking machine positioning jig, relates to the marking machine technical field, solves the comparatively single technical problem of current positioning jig positioning wafer, including the base, be provided with the work piece platform on the base, the work piece platform passes through the pillar to be connected on the base, is provided with first locating piece and second locating piece on the work piece platform, and first locating piece is connected with the work piece platform, and it has the constant head tank that holds the second locating piece usefulness to open on the work piece platform, and open at least two constant head tanks on the work piece platform, and in the adjacent constant head tank, the shortest interval between last constant head tank and the first locating piece is less than the shortest interval between next constant head tank and the first locating piece; the first positioning block and the second positioning block are used for positioning two positioning points in the circumferential direction of the wafer, and subsequently, for wafers with different sizes, the second positioning block is taken out of the positioning groove and is placed into the positioning groove of the wafer with the size corresponding to the second positioning block, so that the situation that the whole set of positioning jigs is switched for different wafers is avoided.

Description

SAW wafer marking machine positioning jig

Technical Field

The utility model relates to a marking machine technical field, more specifically relate to a SAW wafer marking machine positioning jig technical field.

Background

In the field of semiconductor processing, a crystal bar or a wafer is manually placed under a laser marking head for marking, and in order to keep the marking position consistent, the marking position and processing are calibrated, and then a laser head is aligned with the wafer marking operation.

The positioning jig is only suitable for wafers of one type and the same type in the process of placing the wafers by hands, the wafers of other types need to be processed, the corresponding positioning jig needs to be replaced, the replacement of the positioning jig is complex, and the replacement time is long; secondly, the wafers are not accurately positioned when being placed manually, and the consistency of the positions reaching the standard cannot be ensured; and one type of wafer corresponds to one fixture, which results in increased equipment cost and longer time for replacement and debugging.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a: in order to solve the technical problem, the utility model provides a SAW wafer marking machine positioning jig.

The utility model discloses a realize above-mentioned purpose and specifically adopt following technical scheme:

a positioning jig of an SAW wafer marking machine comprises a base, wherein a workpiece table is arranged on the base and connected to the base through a strut, a first positioning block and a second positioning block are arranged on the workpiece table, the first positioning block is connected with the workpiece table, and a positioning groove for accommodating the second positioning block is formed in the workpiece table;

at least two positioning grooves are formed in the workpiece table, and the shortest distance between one positioning groove and the first positioning block in the adjacent positioning grooves is smaller than the shortest distance between the next positioning groove and the first positioning block.

Furthermore, at least three pressing blocks are arranged along the circumferential direction of the workpiece table, the pressing blocks are fixed on the base through fasteners, and the top ends of the pressing blocks are abutted against the workpiece table.

Furthermore, a strip-shaped groove for sliding the fastener is formed in the horizontal part of the pressing block.

Furthermore, the fastener is a first screw rod, a first threaded hole is formed in the base, and a rod portion of the first screw rod penetrates through the strip-shaped groove and then is in threaded connection with the first threaded hole of the base.

Furthermore, a side surface of the workpiece table is provided with a notch.

Furthermore, a second threaded hole is formed in the side face of each positioning groove, a second screw rod in threaded fit with the second threaded hole is installed in the second threaded hole, the second positioning block is abutted to the positioning groove after one end of the second screw rod and one end of the second screw rod penetrate through the second threaded hole, and the other end of the second screw rod penetrates through the second threaded hole and then penetrates out of the workpiece table.

Furthermore, a matrix of holes is formed on the base.

Furthermore, a notch is formed on the workpiece table.

The beneficial effects of the utility model are as follows:

1. the first positioning block and the second positioning block position two positioning points in the circumferential direction of the wafer, and subsequently, for wafers with different sizes, the second positioning block is only required to be taken out of the positioning groove and put into the positioning groove of the wafer with the size corresponding to the second positioning block, so that the whole set of positioning jig is prevented from being switched for different wafers.

2. The pillar that sets up promotes the certain height with the work piece platform to it has a side to open jaggedly to open at the work piece bench, for adsorption equipment adsorbs the passageway that the removal of wafer provides the activity, gives the position mouth of letting on the tool base, and the sucking disc gives the effect of a direction simultaneously for the predetermined mounted position that the sucking disc removed from this breach.

3. The matrix holes are formed in the base, so that the weight of the base of the bottom plate is reduced, and meanwhile, the matrix holes are beneficial to determining the center of the base, so that components mounted on the base are located at the center of the base.

4. In order to limit the second positioning block from separating from the positioning groove, the second screw is designed to be abutted against the positioning groove, and meanwhile, the depth of the second positioning block inserted into the positioning groove can be controlled.

Drawings

FIG. 1 is a schematic view of the present invention;

fig. 2 is a schematic structural view of the workpiece table of the present invention;

fig. 3 is a perspective view of fig. 2 of the present invention;

fig. 4 is a schematic structural view after the wafer is mounted according to the present invention;

reference numerals are as follows: 1-base, 11-first threaded hole, 12-matrix hole, 2-workpiece table, 21-positioning groove, 211-groove A, 212-groove B, 213-groove C, 22-second threaded hole, 23-notch, 3-pillar, 4-first positioning block, 5-second positioning block, 211-previous positioning groove, 212-next positioning groove, 6-pressing block, 61-strip groove, 7-first screw, 8-second screw, 9-wafer, 91-three inch wafer, 92-four inch wafer and 93-six inch wafer.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Example 1

As shown in fig. 4, the wafer 9 is positioned, and the wafer 9 is classified into three-inch wafer 91, four-inch wafer 92 and six-inch wafer 93 according to the size, and the three-specification wafers are positioned, so as to meet the market demand, the positioning jigs corresponding to the wafers with different sizes are quickly switched, and then a positioning jig of the SAW wafer marking machine is designed;

as shown in fig. 1-3, a positioning jig for a SAW wafer marking machine includes a base 1, a workpiece table 2 is disposed on the base 1, the workpiece table 2 is connected to the base 1 through a support 3, a first positioning block 4 and a second positioning block 5 are disposed on the workpiece table 2, the first positioning block 4 is connected to the workpiece table 2, and a positioning groove 21 for accommodating the second positioning block 5 is formed on the workpiece table 2; at least two positioning grooves 21 are formed in the workpiece table 2, and the distance between the previous positioning groove and the first positioning block 4 in the adjacent positioning grooves 21 is smaller than the shortest distance between the next positioning groove and the first positioning block 4.

In the above structure, the plurality of positioning grooves 21 are gradually increased from the first positioning block 4 with respect to the position of the first positioning block 4, the first positioning block 4 and the second positioning block 5 are used for positioning two circumferential positioning points of the wafer 9, and subsequently, for the wafers 9 with different sizes, the second positioning block 5 is taken out of the positioning groove 21 and is placed into the positioning groove of the wafer with the corresponding size, wherein the first positioning block 4 is fixed on the workpiece table 2 through a screw, the first positioning block 4 serves as the same positioning point for positioning different wafers, and thereafter, the mounting position of the second positioning block 5 is adjusted to position the wafers with different models, and the support column 3 is arranged to lift the workpiece table 2 by a certain height, so that the space between the base 1 and the workpiece table 2 is empty, and the wafer 9 is subsequently placed on the workpiece table 2.

Specifically, as shown in fig. 3, the position adjustment method of the second positioning block 5 is exemplified by opening a groove a211, a groove B212, and a groove C213 on the stage, as shown in fig. 4, the position of a211 corresponds to the position of the three-inch wafer 91, the position of the groove B212 corresponds to the position of the four-inch wafer 92, and the position of the groove C213 corresponds to the position of the six-inch wafer 93, inserting the second positioning block 5 into the groove a211 until the time, positioning the second positioning block 5 and the first positioning block 4 in contact with the side surface of the three-inch wafer 91, and regulating the position of the three-inch wafer 91, and when the four-inch wafer 92 needs to be replaced, pulling out the second positioning block 5 from the groove a211 and inserting the second positioning block 5 and the first positioning block 4 into the groove B212, the position of the four-inch wafer 92 can be positioned.

Example 2

The embodiment is developed based on the previous embodiment, as shown in fig. 1, at least three pressing blocks 6 are arranged along the circumferential direction of the workpiece table 2, the pressing blocks 6 are fixed on the base 1 through fasteners, the top ends of the pressing blocks 6 abut against the workpiece table 2, and four pressing blocks 6 can be selected to fixedly clamp the workpiece table 2 on the base 1; wherein the fastener is first screw rod 7, it has the first screw hole 1 with first screw rod 7 complex to open on the base 1, it has the gliding bar groove 61 of confession fastener to open on the horizontal part of compact heap 6, the pole portion of first screw rod 7 passes behind the bar groove 61 with the first screw hole 11 screw-thread fit of base 1, after the position adjustment of compact heap 6, then rotatable first screw rod 7 with the one end butt of compact heap 6 on work piece platform 2, its compact heap 6 other end butt is on base 1, compact heap 6 makes work piece platform 2 more stable with work piece platform 2 fastening on base 1.

A notch 23 is arranged on one side surface of the workpiece table 2, a movable moving channel is provided for the adsorption equipment to adsorb the wafer, a position-giving opening on the base of the jig is provided, the sucking disc moves from the preset installation position of the notch, and meanwhile, the sucking disc has a guiding function, in addition, a matrix hole 12 is arranged on the base 1, the weight of the base 1 of the bottom plate is reduced, meanwhile, the matrix hole 12 is beneficial to determining the center of the base 1, so that the part on the installation base 1 is kept at the center position of the base 1.

In order to limit the second positioning block 5 to be separated from the positioning groove 21, the second screw rod 8 is designed to be abutted against the positioning groove 21, and meanwhile, the depth of the second positioning block 5 inserted into the positioning groove 21 can be controlled, the specific structure is that a second threaded hole 22 is formed in the side surface of each positioning groove 21, the second threaded hole 22 is internally installed on a second screw rod in threaded fit with the second threaded hole, after the second threaded hole 22 is penetrated through by the second screw rod and one end of the second threaded hole, the second positioning block 5 is abutted against the positioning groove 21, and the other end of the second screw rod penetrates through the second threaded hole 22 and then penetrates out of the workpiece table 2.

Claims

1. A positioning jig of an SAW wafer marking machine is characterized by comprising a base (1), wherein a workpiece table (2) is arranged on the base (1), the workpiece table (2) is connected to the base (1) through a support column (3), a first positioning block (4) and a second positioning block (5) are arranged on the workpiece table (2), the first positioning block (4) is connected with the workpiece table (2), and a positioning groove (21) for accommodating the second positioning block (5) is formed in the workpiece table (2);

at least two positioning grooves (21) are formed in the workpiece table (2), and the shortest distance between the upper positioning groove and the first positioning block (4) in the two adjacent positioning grooves (21) is smaller than the shortest distance between the lower positioning groove and the first positioning block (4).

2. The SAW wafer marking machine positioning jig is characterized in that at least three pressing blocks (6) are arranged along the circumferential direction of the workpiece table (2), the pressing blocks (6) are fixed on the base (1) through fasteners, and the top ends of the pressing blocks (6) abut against the workpiece table (2).

3. The SAW wafer marking machine positioning jig according to claim 2, wherein a horizontal portion of the pressing block (6) is provided with a groove (61) for sliding the fastener.

4. The SAW wafer marking machine positioning jig as claimed in claim 3, wherein the fastener is a first screw (7), the base (1) is provided with a first threaded hole (11), and a rod portion of the first screw (7) penetrates through the strip-shaped groove (61) and then is in threaded connection with the first threaded hole (11) of the base (1).

5. The SAW wafer marking machine positioning jig according to claim 1, wherein a notch (23) is formed on one side surface of the workpiece table (2).

6. The SAW wafer marking machine positioning jig according to claim 1, wherein a second threaded hole (22) is formed in a side surface of each positioning groove (21), a second screw rod in threaded fit with the second threaded hole (22) is installed in the second threaded hole, the second screw rod and one end of the second screw rod penetrate through the second threaded hole (22) and then abut against the second positioning block (5) on the positioning groove (21), and the other end of the second screw rod penetrates through the second threaded hole (22) and then penetrates out of the workpiece table (2).

7. A positioning jig for SAW wafer marking machines according to claim 1, characterized in that said base (1) is provided with a matrix of holes (12).

8. The SAW wafer marking machine positioning jig according to claim 1, wherein a notch (23) is formed on the workpiece table (2).