JPS59183350A - Surface inspecting apparatus - Google Patents
Surface inspecting apparatusInfo
- Publication number
- JPS59183350A JPS59183350A JP5827183A JP5827183A JPS59183350A JP S59183350 A JPS59183350 A JP S59183350A JP 5827183 A JP5827183 A JP 5827183A JP 5827183 A JP5827183 A JP 5827183A JP S59183350 A JPS59183350 A JP S59183350A
- Authority
- JP
- Japan
- Prior art keywords
- light
- inspected
- board
- pinhole
- mirror
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007689 inspection Methods 0.000 claims abstract description 22
- 230000007547 defect Effects 0.000 abstract description 11
- 238000000034 method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 230000003321 amplification Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/89—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
- G01N21/892—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles characterised by the flaw, defect or object feature examined
- G01N21/894—Pinholes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/89—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
- G01N21/8901—Optical details; Scanning details
Landscapes
- Engineering & Computer Science (AREA)
- Textile Engineering (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
Description
【発明の詳細な説明】
この発明は、レーザ光等の光ビームを用いてシート部材
例えば鋼板等の表面検査およびピンホール検査をする表
面検査装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a surface inspection device that inspects the surface and pinholes of a sheet member, such as a steel plate, using a light beam such as a laser beam.
従来この種装置として第1図に示すものがあった。図に
おいて、(りは被検査板、(2)はこの被検査板(υを
照射する白熱ランプ、蛍光灯等により構成された投光器
、(3)は太陽電池、フオしダイオード等による受光器
で、この受光器(3)は被検査板(1)を介して投光器
(2)に対向して設けらオtている。(4)は受光器(
3)から出力される受光信号(−気信号)を処理し、被
検査板(1)のビ・ンホールの検出を行なう信号処理装
置であり、これら符号(2)〜(4月こよりピンホール
検査部(5)ん≦形成されてい。る。(6)は被検査板
(1)を光ビーム(レーザビーム)にて走査照射する投
光器、(7)はこの投光器(6)のビーム定食によって
被検査板(1)から反射される反射光ビームを受光する
受光器、(8)はこの受光器(7)がら出力される受光
器@を処理しτ被検査板(1)表面の欠陥(きす。A conventional device of this type is shown in FIG. In the figure, (ri) is the board to be inspected, (2) is a projector made up of an incandescent lamp, fluorescent lamp, etc. that irradiates this board (υ), and (3) is a receiver made of a solar cell, photodiode, etc. , this light receiver (3) is installed opposite to the projector (2) via the inspection plate (1).(4) is the light receiver (
This is a signal processing device that processes the light reception signal (-signal) output from 3) and detects pinholes in the board to be inspected (1). Part (5) is formed.(6) is a light projector that scans and irradiates the board to be inspected (1) with a light beam (laser beam), and (7) is a light projector that scans and irradiates the board to be inspected (1) with a light beam (laser beam). A light receiver (8) that receives the reflected light beam reflected from the inspection plate (1) processes the light output from this light receiver (7) and detects defects (scratches) on the surface of the inspection plate (1). .
汚lし等)の有無を検出する信号処理部であり、こイ″
Lら行列(6)〜(8月こより表面検査s(9〕が形成
されている。This is a signal processing unit that detects the presence or absence of dirt (dirt, etc.).
Surface inspection s(9) are formed from L et al matrices (6) to (August).
次に動作について説明する。第1図において被検査板(
1)は所定の速度で搬送され、この被検査板(1)には
投光器(2〕により連続的に投光爵射されているものと
する。Next, the operation will be explained. In Figure 1, the board to be inspected (
1) is transported at a predetermined speed, and the plate to be inspected (1) is continuously illuminated by a light projector (2).
今、被検査板(1)のピンホールが投光器(2)の照°
射域に達すると、その照射光はピンホールを通過して受
光器(3)ヲこ入射され、受光される。この受光器t3
) ’i:’受光されfsピンホール通過光は、受光器
(3)内の太陽電池、フォトダイオード等の光電変換素
子により、その光レベルに応じた電気信号に変換され信
号処理装置(4月と送られる。信号処理装置(4ンに入
力さn fs 14気信号は増幅回路、比較器等により
、信号処理されピンホールが検出される。Now, the pinhole in the board to be inspected (1) is illuminated by the projector (2).
When the irradiated light reaches the irradiation area, it passes through the pinhole and enters the light receiver (3), where it is received. This receiver t3
) 'i:' The light that is received and passes through the fs pinhole is converted into an electrical signal according to the light level by a photoelectric conversion element such as a solar cell or a photodiode in the receiver (3), and then sent to a signal processing device (April The signal input to the signal processing device (4-pin) is processed by an amplifier circuit, a comparator, etc., and pinholes are detected.
一方、被検査板(1)の表面検査は、投光器(6)の光
ビーム走査およびその反射光を受光する受光器(7)に
より行われる。すなわら被検査板(1)の表面に欠陥が
あると、その欠陥部における光ビームの回折(反射)パ
タンの乱れにより、その反射光レベルは低下し、受光器
(7)からはこの低下に応じた電気信号カヤ、出力され
、信号処理装置り8)に人力される。On the other hand, the surface inspection of the board to be inspected (1) is performed by scanning a light beam of a light projector (6) and by a light receiver (7) that receives the reflected light. In other words, if there is a defect on the surface of the plate to be inspected (1), the reflected light level decreases due to the disturbance of the diffraction (reflection) pattern of the light beam at the defective part, and this decrease is reflected from the light receiver (7). An electric signal corresponding to the signal is output and input manually to the signal processing device 8).
この信号処理装置(8)に入力された電気信号は、増幅
、比較等の処理がなされ表面欠陥が検出される。The electrical signal input to the signal processing device (8) is subjected to processing such as amplification and comparison to detect surface defects.
従来の表面検査装置は以上のように構成されCいるので
、被検査板の表面検査とピンホール検査を行う便に装置
を、それぞれ別個に設置することが装置価格も高価にな
る等の欠点があった。Since the conventional surface inspection equipment is configured as described above, it has disadvantages such as the cost of the equipment becoming expensive if the equipment is installed separately for the surface inspection and pinhole inspection of the board to be inspected. there were.
この発明は上記のような従来のものの欠点を除去するた
めになされ/′:もので、投光部および受光部からなる
センサ部と、投光部より発せられる光ビームを受光部に
反射させる反射部を被検査板を介して対向させて設ける
ことにより、被検査板の表面欠陥とピンホールか同時t
こ分離して検出でき、設置スペースを節約装置価格の低
廉化が図れる表面検査装置を提供することを目的として
いる。。This invention was made in order to eliminate the above-mentioned drawbacks of the conventional devices.It includes a sensor section consisting of a light projecting section and a light receiving section, and a sensor section that reflects a light beam emitted from the light projecting section to the light receiving section. By arranging the parts facing each other with the board to be inspected in between, surface defects and pinholes on the board to be inspected can be detected at the same time.
It is an object of the present invention to provide a surface inspection device that can separate and detect the surface, save installation space, and reduce the cost of the device. .
以下、この発明の一実施例を図について説明する。第2
図においてθη(J特定の角度で組み合せらlしたミラ
ー、@はレーザによる投光部と、光電子増倍管等の光電
変換素子を含む受光部とで構成さnるセンサ部、鵠はセ
ンサ部(6)からその受光レベルに応じた電気信号が入
力され、各種電気信号処理を行なう信号処理装置である
。An embodiment of the present invention will be described below with reference to the drawings. Second
In the figure, θη (J is a mirror assembled at a specific angle, @ is a sensor unit consisting of a laser light emitting unit and a light receiving unit including a photoelectric conversion element such as a photomultiplier tube, and a mouse is a sensor unit. This is a signal processing device that receives an electrical signal corresponding to the received light level from (6) and performs various electrical signal processing.
次をこ動作について説明する。センサ部0オ内のレーザ
チューブから発せられたレーザビームはレンズ系、ミラ
ー、4磁振動鏡又は回転鏡等に誹り所定の形状に絞られ
て被検査板(1)上にその移動方向と直角方向に走査さ
れる。被検査板(1)で反射されたレーザ光はオプテイ
カルファイノ<又はレンズ等により集束され光電子増倍
管等jこよりi気信号ζこ変換されこの透気信号ルシ信
号処理装置曽に送らtし、信号処理装置内では増幅、波
形整形、比較器等をこより信号処理される。ここでミラ
ー0ηは、レーザビームの被検査板(1)への投光角度
に対して第8図に示すまうな形状で組み合せられており
、被検査板(1)のピンホールを通過したレーザビーム
〃)センサ部0功の受光部(こ反射されるように角度設
定さnている。この第3図の場合、ミラーC1υの組み
合せ角度は90度からビームの投光角度a0を引いた値
である。This operation will be explained next. The laser beam emitted from the laser tube inside the sensor unit 0 is focused into a predetermined shape by a lens system, mirror, 4-magnetic vibrating mirror, rotating mirror, etc., and is directed onto the inspection target board (1) perpendicular to the direction of movement. scanned in the direction. The laser beam reflected by the plate to be inspected (1) is focused by an optical fiber or lens, converted into an air signal by a photomultiplier tube, etc., and sent to a signal processing device. However, within the signal processing device, the signal is processed by amplification, waveform shaping, comparator, etc. Here, the mirrors 0η are combined in the correct shape as shown in Fig. 8 with respect to the projection angle of the laser beam onto the plate to be inspected (1), and the laser beam passing through the pinhole of the plate to be inspected (1) Beam〃) Sensor unit 0 light receiving unit (The angle is set so that it is reflected. In the case of this figure 3, the combination angle of mirror C1υ is the value obtained by subtracting the beam projection angle a0 from 90 degrees. It is.
この実施例のように、正反射光を受光する表面検査方式
では正常表面に対する信号処理装置内の信号は、レーザ
ビームの一走査に対して第4図をこお:りる(a)及び
(b)の信号が無い一様しベルの電気信号波形となり、
表面欠陥がある場合は、その欠1拍都においてレーザビ
ームの一折ノ゛クターンが乱れるため、その信号レベル
は低くなり(a)の1言号が現われ)ピンホール検査ヌ
ある場合1よミラーGυlこ才6ける反射光が加算され
るtこめ、その信”けレベル(、を高くなり(b)の信
号が現われる。し1こがつ−C(は弓処理装置0内で第
4図に示す(a)と(シ)の信号を分離して検出するこ
とは容易であり、本装置・2ノ1jいれば表面検査とピ
ンホール検査が[即時(こ行なえることになる。As in this embodiment, in the surface inspection method that receives specularly reflected light, the signal in the signal processing device for a normal surface is as shown in Fig. 4 for one scan of the laser beam. b) There is no signal, and the electric signal waveform becomes a uniform bell.
If there is a surface defect, the laser beam's folding pattern will be disrupted in each defect, so the signal level will be low and the word (a) will appear.) If there is a pinhole inspection, the mirror As the reflected light from Gυl is added, its signal level () becomes higher and the signal (b) appears. It is easy to separate and detect the signals (a) and (b) shown in (a) and (b), and with this device, surface inspection and pinhole inspection can be done immediately.
上記実施例では正反射光受光方式につ(八で述へtコが
拡散光受光方式に対してもミラー(II)の構成を変え
ることにより、ピンホール通過光を受光することは可能
である。なお、この場合、+g @ 迅G +こおいて
は表面欠陥信号と同方向の信号とし”C現わすしるが信
号レベル差により表面欠陥信号とピンホール信号とを分
離することは可能て・あり、上記実施例と同様の効果を
奏する、。In the above embodiment, it is possible to receive light passing through a pinhole by changing the configuration of the mirror (II) for the specular reflection light reception method (described in Section 8), but also for the diffuse light reception method. In this case, the signal is in the same direction as the surface defect signal and is expressed as "C," but it is not possible to separate the surface defect signal and pinhole signal based on the signal level difference. - Yes, the same effect as in the above embodiment is achieved.
以上のように、この発明によXLば投光部と受光部から
なる従来の表面検査装置にミラー等の反射部材を対向配
設し、この反射部材によりピンホール通過光を反射させ
るように構成しjこの又・、被検青板の表面検査とピン
ホール検査が同時でき−1しかも装置の小型化および低
廉化か図れる効果がある。As described above, according to the present invention, a reflecting member such as a mirror is disposed facing the conventional surface inspection device consisting of an XL light projecting section and a light receiving section, and the light passing through the pinhole is reflected by this reflecting member. Moreover, the surface inspection and pinhole inspection of the blue plate to be inspected can be carried out at the same time.In addition, there is an effect that the apparatus can be made smaller and less expensive.
第1図は従来の表面検査装置のブロック図、第2図はこ
の発明の一実施例による表面検査装置のブロック図、第
3図は第2図におけるミラーの構成を示す側面図、第4
因は第2図の信号処理部内における動作を説明するため
の動作波形図である。
aυ゛°゛ミラー、喀・・センザ部
なお、図中、同一符号は同一、又は相当部分を示す。
代理人 大岩二j増雄
第1図FIG. 1 is a block diagram of a conventional surface inspection device, FIG. 2 is a block diagram of a surface inspection device according to an embodiment of the present invention, FIG. 3 is a side view showing the structure of the mirror in FIG. 2, and FIG.
The reason for this is an operational waveform diagram for explaining the operation within the signal processing section of FIG. aυ゛°゛Mirror,...sensor section In the drawings, the same reference numerals indicate the same or equivalent parts. Agent: Nij Masuo Oiwa Figure 1
Claims (1)
ームを発する投光部と、この投光部から発せられる光ビ
ームの反射光を受光する受光部により構成されたセンサ
部、および上記被検査板の他面側かつ上記センサ部に対
向して配設され、上記被検査板のピンホールを通過した
上記投光部からの光ビームを回折反射させ、その反射光
を上記ピンホールを通過させて上記受光部に入射させる
反射部を備えた表面検査装置。a sensor section provided on one side of the board to be inspected and configured with a light projecting part that emits a ζζ light beam for the board to be inspected, and a light receiving part that receives reflected light of the light beam emitted from the light projecting part; and is disposed on the other side of the board to be inspected and facing the sensor unit, and diffracts and reflects the light beam from the light projecting unit that has passed through the pinhole of the board to be inspected, and directs the reflected light to the pin of the board to be inspected. A surface inspection device including a reflecting section that allows the light to pass through the hole and enter the light receiving section.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5827183A JPS59183350A (en) | 1983-04-01 | 1983-04-01 | Surface inspecting apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5827183A JPS59183350A (en) | 1983-04-01 | 1983-04-01 | Surface inspecting apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS59183350A true JPS59183350A (en) | 1984-10-18 |
Family
ID=13079512
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5827183A Pending JPS59183350A (en) | 1983-04-01 | 1983-04-01 | Surface inspecting apparatus |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59183350A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6348445A (en) * | 1986-08-18 | 1988-03-01 | Oji Paper Co Ltd | Detecting device for defect of sheet |
-
1983
- 1983-04-01 JP JP5827183A patent/JPS59183350A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6348445A (en) * | 1986-08-18 | 1988-03-01 | Oji Paper Co Ltd | Detecting device for defect of sheet |
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