JPS59182532A - ボンデイング装置用加熱装置 - Google Patents

ボンデイング装置用加熱装置

Info

Publication number
JPS59182532A
JPS59182532A JP58055235A JP5523583A JPS59182532A JP S59182532 A JPS59182532 A JP S59182532A JP 58055235 A JP58055235 A JP 58055235A JP 5523583 A JP5523583 A JP 5523583A JP S59182532 A JPS59182532 A JP S59182532A
Authority
JP
Japan
Prior art keywords
gas
bonding
heater
lead frame
bonding work
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58055235A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0254664B2 (enrdf_load_stackoverflow
Inventor
Hiroshi Ushiki
博 丑木
Koichi Orita
折田　浩一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP58055235A priority Critical patent/JPS59182532A/ja
Publication of JPS59182532A publication Critical patent/JPS59182532A/ja
Publication of JPH0254664B2 publication Critical patent/JPH0254664B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP58055235A 1983-04-01 1983-04-01 ボンデイング装置用加熱装置 Granted JPS59182532A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58055235A JPS59182532A (ja) 1983-04-01 1983-04-01 ボンデイング装置用加熱装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58055235A JPS59182532A (ja) 1983-04-01 1983-04-01 ボンデイング装置用加熱装置

Publications (2)

Publication Number Publication Date
JPS59182532A true JPS59182532A (ja) 1984-10-17
JPH0254664B2 JPH0254664B2 (enrdf_load_stackoverflow) 1990-11-22

Family

ID=12992937

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58055235A Granted JPS59182532A (ja) 1983-04-01 1983-04-01 ボンデイング装置用加熱装置

Country Status (1)

Country Link
JP (1) JPS59182532A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6234429U (enrdf_load_stackoverflow) * 1985-08-17 1987-02-28
JPS63142642A (ja) * 1986-12-05 1988-06-15 Kuwano Denki Kk フレ−ムの酸化防止装置
WO2003012833A3 (en) * 2001-08-01 2004-03-04 Li Logix Inc D B A Rd Automati Process and apparatus for mounting semiconductor components to substrates and parts therefor
JP2013111646A (ja) * 2011-12-01 2013-06-10 Fuji Electric Co Ltd ガス発生装置、はんだ接合装置およびはんだ接合方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49126265A (enrdf_load_stackoverflow) * 1973-04-04 1974-12-03
JPS53162659U (enrdf_load_stackoverflow) * 1977-05-25 1978-12-20
JPS55127030A (en) * 1979-03-26 1980-10-01 Toshiba Corp Assembling apparatus for semiconductor
JPS5687331A (en) * 1979-12-18 1981-07-15 Toshiba Corp Reducing furnace for solder-treatment
JPS56163423A (en) * 1980-04-15 1981-12-16 Commissariat Energie Atomique Seismic gauge
JPS5742175U (enrdf_load_stackoverflow) * 1980-08-14 1982-03-08

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49126265A (enrdf_load_stackoverflow) * 1973-04-04 1974-12-03
JPS53162659U (enrdf_load_stackoverflow) * 1977-05-25 1978-12-20
JPS55127030A (en) * 1979-03-26 1980-10-01 Toshiba Corp Assembling apparatus for semiconductor
JPS5687331A (en) * 1979-12-18 1981-07-15 Toshiba Corp Reducing furnace for solder-treatment
JPS56163423A (en) * 1980-04-15 1981-12-16 Commissariat Energie Atomique Seismic gauge
JPS5742175U (enrdf_load_stackoverflow) * 1980-08-14 1982-03-08

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6234429U (enrdf_load_stackoverflow) * 1985-08-17 1987-02-28
JPS63142642A (ja) * 1986-12-05 1988-06-15 Kuwano Denki Kk フレ−ムの酸化防止装置
WO2003012833A3 (en) * 2001-08-01 2004-03-04 Li Logix Inc D B A Rd Automati Process and apparatus for mounting semiconductor components to substrates and parts therefor
US6818543B2 (en) 2001-08-01 2004-11-16 Lilogix, Inc. Process and apparatus for mounting semiconductor components to substrates and parts therefor
JP2013111646A (ja) * 2011-12-01 2013-06-10 Fuji Electric Co Ltd ガス発生装置、はんだ接合装置およびはんだ接合方法

Also Published As

Publication number Publication date
JPH0254664B2 (enrdf_load_stackoverflow) 1990-11-22

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