JPS5917976B2 - Wire bonding method - Google Patents

Wire bonding method

Info

Publication number
JPS5917976B2
JPS5917976B2 JP54111284A JP11128479A JPS5917976B2 JP S5917976 B2 JPS5917976 B2 JP S5917976B2 JP 54111284 A JP54111284 A JP 54111284A JP 11128479 A JP11128479 A JP 11128479A JP S5917976 B2 JPS5917976 B2 JP S5917976B2
Authority
JP
Japan
Prior art keywords
wire
bonding
capillary
bond
point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54111284A
Other languages
Japanese (ja)
Other versions
JPS5636141A (en
Inventor
信人 山崎
猛 長谷川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP54111284A priority Critical patent/JPS5917976B2/en
Publication of JPS5636141A publication Critical patent/JPS5636141A/en
Publication of JPS5917976B2 publication Critical patent/JPS5917976B2/en
Expired legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
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    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
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    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
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    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
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    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
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    • H01L2224/8518—Translational movements
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    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Abstract

PURPOSE:To eliminate the deterioration of the quality of the second bonding by a method wherein the second bonding is conducted at the lead side, sacrifice bonding is conducted, and a wire is pulled in the direction that joins the next first bonding point and the second bonding point and cut. CONSTITUTION:The wire 2 is inserted into a capillary 1, the capillary 1 is vibrated pushing the wire 2 against a pad 4A of a pellet 3, the first bonding point, and bonding is conducted. The capillary 1 is moved to the second bonding point 6A at the lead 5A side, delivering the wire 2 from the capillary 1, and bonding is conducted. The wire 2 is delivered from the capillary 1, sacrifice bonding 7A is conducted on a lead 5A near the second bonding point, and the wire 2 is pulled in the direction that joins the first bonding point 4B and the second bonding point 6B and cut. Thus, torsional force in case of the cutting of the wire is absorbed by the sacrifice bonding, and the deterioration of the quality of the second bonding can be prevented even when an angle in the cutting direction to the direction that the wire is connected is large.

Description

【発明の詳細な説明】 本発明はワイヤボンディング方法に関するものである。[Detailed description of the invention] The present invention relates to a wire bonding method.

半導体装置、集積回路装置等の製造においては、ペレッ
ト上のパッドと外部リードとをワイヤで接続する作業が
あり、このワイヤ接続の方法として超音波ワイヤボンデ
ィング方法及び超音波熱圧着ワイヤボンディング方法が
知られている。In the manufacture of semiconductor devices, integrated circuit devices, etc., there is work to connect pads on pellets and external leads with wires, and the ultrasonic wire bonding method and the ultrasonic thermocompression wire bonding method are known methods for this wire connection. It is being

この方法においては、ワイヤをボンド点に押し付けるた
めのツール下端よりワイヤが逃げないようにワイヤの延
在する方向とツールの振動方向を一致させることを必要
とする。そこで最近、このような方向性を考慮しなくて
もよいように、ツールに代えて筒状のキャピラリにワイ
ヤを挿通して用いることが行なわれている。In this method, it is necessary to match the direction in which the wire extends and the direction of vibration of the tool so that the wire does not escape from the lower end of the tool for pressing the wire against the bonding point. Therefore, recently, in order to eliminate the need to consider such directionality, a wire has been inserted into a cylindrical capillary instead of a tool.

し力化ながら、筒状キャピラリを用いて超音波ワイヤボ
ンディングを行なう場合、切断によつてワイヤ先端部の
折曲げられた方向と次にボンデイン９ グされるボンド
点間の方向とが大きくずれていると、次の第１ボンド点
のワイヤ接合部の付け根に大きな力が加わり、破断、ク
ラック等が発生する欠点がある。従来、上記のような欠
点を解消するものとして、５ 特開昭５３−１０４１６
７号公報に示す方法が知られている。When performing ultrasonic wire bonding using a cylindrical capillary, the direction in which the tip of the wire is bent due to cutting and the direction between the bond points to be bonded next may deviate greatly. If it is, a large force is applied to the base of the wire joint at the next first bonding point, resulting in breakage, cracks, etc. Conventionally, as a solution to the above-mentioned drawbacks, 5 Japanese Patent Application Laid-Open No. 53-10416
A method shown in Publication No. 7 is known.

この方法は第１ボンド、第２ボンドを行なつた後、ワイ
ヤを引張つて前記第２ボンド部の近傍で切断させる際、
ワイヤを次にワイヤの張られる第１ボンド点より第２ボ
ンド点の方向にｏ 向つて引張つてワイヤを切断し、キ
ャピラリ下端から突出するワイヤ先端部を次のワイヤの
張られる方向に一致させるようにしている。しかしなが
ら、この方法はワイヤ接続された方向に対して切断方向
が４５０以上になると、接続’５ された第２ボンド部
には切断による大きなねじり力が加わり、第２ボンド部
がはがれてしまうか又は付きが劣化するので、ワイヤ接
続された方向に対する切断方向は３００以内に限られて
いる。In this method, after performing the first bond and the second bond, when the wire is pulled and cut near the second bond part,
Next, pull the wire in the direction o from the first bond point where the wire is stretched to the second bond point, and cut the wire so that the tip of the wire protruding from the lower end of the capillary matches the direction in which the next wire is stretched. I have to. However, in this method, when the cutting direction is 450 degrees or more with respect to the direction in which the wires are connected, a large twisting force is applied to the connected second bond part due to the cutting, and the second bond part may be peeled off or Since the attachment deteriorates, the cutting direction is limited to within 300 degrees with respect to the direction in which the wire is connected.

本発明は上記従来技術の欠点に鑑みなされたもｊ０ので
、ワイヤの接続された方向に対するワイヤ切断方向が大
きくても何んらボンディング品質を低下させることなく
ボンドを行なうことができるワイヤボンディング方法を
提供することを目的とする。■５ 以下、本発明を図示
の実施例により説明する。The present invention has been made in view of the above-mentioned drawbacks of the prior art, and therefore provides a wire bonding method that can perform bonding without any deterioration in bonding quality even if the wire cutting direction is large with respect to the direction in which the wires are connected. The purpose is to provide. (5) The present invention will be explained below with reference to illustrated embodiments.

図は本発明のワイヤボンディング方法の一実施例を示す
。円筒状のキャピラリ１にはワイヤ２が挿通され、キヤ
ピラリ１の下端中央から延在するワイヤ２を第１ボンド
点であるペレツト３のパツド４Ａに押付けながらキャピ
ラリ１を振動させてボンデイングし、その後キヤピラリ
１からワイヤ２を繰り出しながらキャピラリ１をリード
５Ａ側の第２ボンド点６Ａに移動させ、ワイヤ２を第２
ボンド点６Ａ面に押付けながら振動させて第２ボンド点
６Ａにボンデイングする。以上は従来と同じである。本
発明は続いて第２ボンド点６Ａにボンデイングされたリ
ード５Ａの近傍に存在する使用しないリード５Ｃにすて
ボンド７Ａする。The figure shows an embodiment of the wire bonding method of the present invention. A wire 2 is inserted into the cylindrical capillary 1, and bonding is performed by vibrating the capillary 1 while pressing the wire 2 extending from the center of the lower end of the capillary 1 against the pad 4A of the pellet 3, which is the first bonding point. While feeding out the wire 2 from the capillary 1, move the capillary 1 to the second bond point 6A on the lead 5A side.
Bonding is carried out to the second bond point 6A by vibrating it while pressing against the surface of the bond point 6A. The above is the same as before. The present invention then performs a bond 7A by discarding an unused lead 5C existing in the vicinity of the lead 5A bonded to the second bond point 6A.

ここで、すてボンド７Ａは、次にボンデイングする第１
ボンド点４Ｂと第２ボンド点６Ｂを結ぶ方向Ａに第２ボ
ンド点６Ａよりリード５Ｃにキヤピラリ１を移動させて
行なう、その後、前記Ａ方向にキヤピラリ１を移動させ
てワイヤ２をすてボンド７Ａ近傍で切断させる。このよ
うに、第２ボンド点６Ａから前記Ａ方向にキヤピラリ１
を移動させてすてボンド７Ａを行ない、ワイヤ切断時に
はそのまま同じ方向にキヤピラリ１を移動させてワイヤ
２を切断するので、第２ボンド点６Ａは勿論のこと、す
てボンド７Ａにもねじり力が加わらなく、より良いボン
デイングが行なえる。Here, the discarded bond 7A is the first bond to be bonded next.
This is done by moving the capillary 1 from the second bond point 6A to the lead 5C in the direction A that connects the bond point 4B and the second bond point 6B.Then, move the capillary 1 in the direction A, discarding the wire 2, and bond 7A. Cut it nearby. In this way, the capillary 1 is connected in the direction A from the second bond point 6A.
When cutting the wire, the capillary 1 is moved in the same direction to cut the wire 2, so twisting force is applied not only to the second bond point 6A but also to the bond 7A. Better bonding can be achieved without adding additional components.

なお、前記したすてボンド７Ａは第２ボンド後にすべて
行なつてもよいが、ワイヤ接続された方向に対して切断
方向が３００以．上の時にのみ行なうようにしてもよい
。Note that all of the above-described bonding steps 7A may be performed after the second bonding, but if the cutting direction is 300 degrees or more with respect to the direction in which the wires are connected. You may choose to do this only at the above times.

以上の説明から明らかな如く、本発明になるワイヤボン
デイング方法によれば、第２ボンドされたリードの近傍
に存在する使用しないリードにすてボンドし、しかも第
２ボンドからすてボンドの方向及びワイヤを引張つて切
断する方向は、それぞれ次にボンドされる第１ボンド点
と第２ボンド点を結ぶ方向であるので、ワイヤ接続され
た方向に対して次にワイヤが張られる方向が大きくても
ボンドされた第２ボンドの品質を低下させることもない
。As is clear from the above description, according to the wire bonding method of the present invention, the unused lead existing in the vicinity of the second bonded lead is discarded and bonded, and the direction from the second bond to the discarded bond is The direction in which the wire is pulled and cut is the direction that connects the first and second bond points that will be bonded next, so even if the direction in which the wire is stretched next is larger than the direction in which the wire is connected, There is no deterioration in the quality of the second bond.

【図面の簡単な説明】[Brief explanation of the drawing]

図は本発明になるワイヤボンデイング方法の・一実施例
を示す斜視図である。 １・・・キヤピラリ、２・・・ワイヤ、４Ａ，４Ｂ・・
・第１ボンド点、５Ａ，５Ｂ，５Ｃ・・・リード、６Ａ
，６Ｂ・・・第２ボンド点、７Ａ・・・すてボンド。The figure is a perspective view showing an embodiment of the wire bonding method according to the present invention. 1... Capillary, 2... Wire, 4A, 4B...
・1st bond point, 5A, 5B, 5C...Lead, 6A
, 6B...second bond point, 7A...stop bond.

Claims (1)

【特許請求の範囲】[Claims] １ リードの第２ボンド点にボンド後、次の第１ボンド
点と第２ボンド点を結ぶ方向にキャピラリを移動させて
前記ボンドされたリードの近傍に存在する不使用のリー
ドにすてボンドを行ない、その後前記した次の第１ボン
ド点と第２ボンド点を結ぶ方向にワイヤを引張つてワイ
ヤを切断することを特徴とするワイヤボンディング方法
。1 After bonding to the second bond point of the lead, move the capillary in the direction connecting the next first bond point and second bond point and discard the bond to an unused lead near the bonded lead. The wire bonding method is characterized in that the wire is cut by pulling the wire in the direction connecting the next first bond point and the second bond point.
JP54111284A 1979-08-31 1979-08-31 Wire bonding method Expired JPS5917976B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP54111284A JPS5917976B2 (en) 1979-08-31 1979-08-31 Wire bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP54111284A JPS5917976B2 (en) 1979-08-31 1979-08-31 Wire bonding method

Publications (2)

Publication Number Publication Date
JPS5636141A JPS5636141A (en) 1981-04-09
JPS5917976B2 true JPS5917976B2 (en) 1984-04-24

Family

ID=14557320

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54111284A Expired JPS5917976B2 (en) 1979-08-31 1979-08-31 Wire bonding method

Country Status (1)

Country Link
JP (1) JPS5917976B2 (en)

Also Published As

Publication number Publication date
JPS5636141A (en) 1981-04-09

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